RC delay detectors with high sensitivity for through substrate vias
    1.
    发明授权
    RC delay detectors with high sensitivity for through substrate vias 有权
    RC延迟检测器,通过基板通孔具有高灵敏度

    公开(公告)号:US08384430B2

    公开(公告)日:2013-02-26

    申请号:US12971204

    申请日:2010-12-17

    IPC分类号: H03K19/21 H03K17/00

    摘要: A die includes a plurality of through-substrate vias (TSVs) penetrating a substrate of the die, wherein the plurality of TSVs are grouped as a plurality of TSV pairs. A plurality of contact pads is coupled to the plurality of TSVs, wherein the plurality of contact pads is exposed on a first surface of the die. The die further includes a plurality of balanced pulse comparison units, wherein each of the plurality of balanced pulse comparison units includes a first input and a second input coupled to a first TSV and a second TSV of one of the plurality of TSV pairs. The die further includes a plurality of pulse latches, each including an input coupled to an output of one of the plurality of balanced pulse comparison units.

    摘要翻译: 芯片包括贯穿芯片的衬底的多个贯穿衬底通孔(TSV),其中多个TSV被分组为多个TSV对。 多个接触焊盘耦合到多个TSV,其中多个接触焊盘暴露在管芯的第一表面上。 芯片还包括多个平衡脉冲比较单元,其中多个平衡脉冲比较单元中的每一个包括耦合到多个TSV对之一的第一TSV和第二TSV的第一输入和第二输入。 芯片还包括多个脉冲锁存器,每个脉冲锁存器包括耦合到多个平衡脉冲比较单元之一的输出的输入端。

    RC Delay Detectors with High Sensitivity for Through Substrate Vias
    2.
    发明申请
    RC Delay Detectors with High Sensitivity for Through Substrate Vias 有权
    具有高灵敏度的RC延迟检测器用于穿透基板通孔

    公开(公告)号:US20120038388A1

    公开(公告)日:2012-02-16

    申请号:US12971204

    申请日:2010-12-17

    IPC分类号: H03K19/21 H03K17/00

    摘要: A die includes a plurality of through-substrate vias (TSVs) penetrating a substrate of the die, wherein the plurality of TSVs are grouped as a plurality of TSV pairs. A plurality of contact pads is coupled to the plurality of TSVs, wherein the plurality of contact pads is exposed on a first surface of the die. The die further includes a plurality of balanced pulse comparison units, wherein each of the plurality of balanced pulse comparison units includes a first input and a second input coupled to a first TSV and a second TSV of one of the plurality of TSV pairs. The die further includes a plurality of pulse latches, each including an input coupled to an output of one of the plurality of balanced pulse comparison units.

    摘要翻译: 芯片包括贯穿芯片的衬底的多个贯穿衬底通孔(TSV),其中多个TSV被分组为多个TSV对。 多个接触焊盘耦合到多个TSV,其中多个接触焊盘暴露在模具的第一表面上。 芯片还包括多个平衡脉冲比较单元,其中多个平衡脉冲比较单元中的每一个包括耦合到多个TSV对之一的第一TSV和第二TSV的第一输入和第二输入。 芯片还包括多个脉冲锁存器,每个脉冲锁存器包括耦合到多个平衡脉冲比较单元之一的输出的输入端。

    System and method for detecting soft-fails
    3.
    发明授权
    System and method for detecting soft-fails 有权
    检测软故障的系统和方法

    公开(公告)号:US08339155B2

    公开(公告)日:2012-12-25

    申请号:US12857270

    申请日:2010-08-16

    IPC分类号: H03K19/00 H03K19/23

    CPC分类号: H03K19/23 G01R31/31816

    摘要: A system and method for detecting soft-failures in integrated circuits is provided. A circuit includes a combinatorial logic block having a first signal input and a second signal input, and a latch coupled to an output of the combinatorial logic block. The combinatorial logic block produces a pulse when only one of either a first signal provided by the first signal input or a second signal provided by the second signal input is a logical high value, and the latch captures the pulse if the pulse has a pulse width greater than a second threshold. The pulse has a pulse width that is based on a timing difference between a first signal transition on the first signal and a second signal transition on the second signal, the combinatorial logic block produces the pulse if the timing difference is greater than a first threshold, and the combinatorial logic block operates with balanced inputs.

    摘要翻译: 提供一种用于检测集成电路中的软故障的系统和方法。 电路包括具有第一信号输入和第二信号输入的组合逻辑块,以及耦合到组合逻辑块的输出的锁存器。 当仅由第一信号输入提供的第一信号或由第二信号输入提供的第二信号中的一个信号是逻辑高值时,组合逻辑块产生脉冲,并且如果脉冲具有脉冲宽度,则锁存器捕捉脉冲 大于第二阈值。 脉冲具有基于第一信号上的第一信号转换与第二信号上的第二信号转换之间的定时差的脉冲宽度,如果定时差大于第一阈值,组合逻辑块产生脉冲, 并且组合逻辑块通过平衡输入进行操作。

    System and Method for Detecting Soft-Fails
    4.
    发明申请
    System and Method for Detecting Soft-Fails 有权
    检测软件的系统和方法

    公开(公告)号:US20110121856A1

    公开(公告)日:2011-05-26

    申请号:US12857270

    申请日:2010-08-16

    IPC分类号: H03K19/00 H03K19/23

    CPC分类号: H03K19/23 G01R31/31816

    摘要: A system and method for detecting soft-failures in integrated circuits is provided. A circuit includes a combinatorial logic block having a first signal input and a second signal input, and a latch coupled to an output of the combinatorial logic block. The combinatorial logic block produces a pulse when only one of either a first signal provided by the first signal input or a second signal provided by the second signal input is a logical high value, and the latch captures the pulse if the pulse has a pulse width greater than a second threshold. The pulse has a pulse width that is based on a timing difference between a first signal transition on the first signal and a second signal transition on the second signal, the combinatorial logic block produces the pulse if the timing difference is greater than a first threshold, and the combinatorial logic block operates with balanced inputs.

    摘要翻译: 提供一种用于检测集成电路中的软故障的系统和方法。 电路包括具有第一信号输入和第二信号输入的组合逻辑块,以及耦合到组合逻辑块的输出的锁存器。 当仅由第一信号输入提供的第一信号或由第二信号输入提供的第二信号中的一个信号是逻辑高值时,组合逻辑块产生脉冲,并且如果脉冲具有脉冲宽度,则锁存器捕捉脉冲 大于第二阈值。 脉冲具有基于第一信号上的第一信号转换与第二信号上的第二信号转换之间的定时差的脉冲宽度,如果定时差大于第一阈值,组合逻辑块产生脉冲, 并且组合逻辑块通过平衡输入进行操作。

    Diagnosis framework to shorten yield learning cycles of advanced processes
    6.
    发明授权
    Diagnosis framework to shorten yield learning cycles of advanced processes 有权
    诊断框架来缩短先进过程的产量学习周期

    公开(公告)号:US09310431B2

    公开(公告)日:2016-04-12

    申请号:US13588155

    申请日:2012-08-17

    摘要: The present disclosure relates to a diagnosis framework to shorten yield learning cycles of technology node manufacturing processes from the high defect density stage to technology maturity. A plurality of defect under test (DUT) structures are designed to capture potential manufacturing issues associated with defect formation. A test structure is formed by arranging the DUT structures within a DUT carrier unit, which has been yield-hardened though heuristic yield analysis such that a defect density of the DUT carrier unit is essentially zero. Possible outcomes of an application of test patterns and various failure scenarios associated with defects formed within the DUT structures within the DUT carrier unit are simulated and stored in a look-up table (LUT). The LUT may then be referenced to determine a location of a defect within the test structure without the need for iterative analysis to correctly select defect candidates for physical failure analysis (PFA).

    摘要翻译: 本公开涉及一种诊断框架,用于缩短从高缺陷密度阶段到技术成熟度的技术节点制造过程的产量学习周期。 多个待测缺陷(DUT)结构被设计为捕获与缺陷形成相关的潜在制造问题。 通过将DUT结构布置在DUT载体单元内而形成测试结构,该DUT载体单元已经通过启发式产量分析进行了屈服强化,使得DUT载体单元的缺陷密度基本上为零。 在DUT载体单元中的DUT结构内形成的缺陷相关联的测试模式和各种故障情形的应用的可能结果被模拟并存储在查找表(LUT)中。 然后可以参考LUT以确定测试结构内的缺陷的位置,而不需要迭代分析来正确地选择用于物理故障分析(PFA)的缺陷候选。

    Diagnosis Framework to Shorten Yield Learning Cycles of Advanced Processes
    7.
    发明申请
    Diagnosis Framework to Shorten Yield Learning Cycles of Advanced Processes 有权
    诊断框架,缩短先进过程的产量学习周期

    公开(公告)号:US20140049281A1

    公开(公告)日:2014-02-20

    申请号:US13588155

    申请日:2012-08-17

    IPC分类号: G01R31/02 G06F17/50

    摘要: The present disclosure relates to a diagnosis framework to shorten yield learning cycles of technology node manufacturing processes from the high defect density stage to technology maturity. A plurality of defect under test (DUT) structures are designed to capture potential manufacturing issues associated with defect formation. A test structure is formed by arranging the DUT structures within a DUT carrier unit, which has been yield-hardened though heuristic yield analysis such that a defect density of the DUT carrier unit is essentially zero. Possible outcomes of an application of test patterns and various failure scenarios associated with defects formed within the DUT structures within the DUT carrier unit are simulated and stored in a look-up table (LUT). The LUT may then be referenced to determine a location of a defect within the test structure without the need for iterative analysis to correctly select defect candidates for physical failure analysis (PFA).

    摘要翻译: 本公开涉及一种诊断框架,用于缩短从高缺陷密度阶段到技术成熟度的技术节点制造过程的产量学习周期。 多个待测缺陷(DUT)结构被设计为捕获与缺陷形成相关的潜在制造问题。 通过将DUT结构布置在DUT载体单元内而形成测试结构,该DUT载体单元已经通过启发式产量分析进行了屈服强化,使得DUT载体单元的缺陷密度基本上为零。 在DUT载体单元中的DUT结构内形成的缺陷相关联的测试模式和各种故障情形的应用的可能结果被模拟并存储在查找表(LUT)中。 然后可以参考LUT以确定测试结构内的缺陷的位置,而不需要迭代分析来正确地选择用于物理故障分析(PFA)的缺陷候选。

    Built-in self-test for interposer
    8.
    发明授权
    Built-in self-test for interposer 有权
    内置自检功能

    公开(公告)号:US08832511B2

    公开(公告)日:2014-09-09

    申请号:US13209477

    申请日:2011-08-15

    IPC分类号: G01R31/28

    CPC分类号: G01R31/318536

    摘要: A device includes a first die coupled to an interconnect structure of an interposer. The first die includes a first BIST circuit configured to generate and output test signals to the interconnection structure of the interposer. A second die is coupled to the interconnect structure of the interposer and includes a second BIST circuit configured to receive signals from the interconnection structure of the interposer in response to the first BIST circuit transmitting the test signals. The second BIST circuit is configured to compare the signals received from the interconnection structure of the interposer to reference signals generated by the second BIST circuit.

    摘要翻译: 器件包括耦合到插入器的互连结构的第一管芯。 第一裸片包括第一BIST电路,其被配置为产生并输出测试信号到中介层的互连结构。 第二管芯耦合到插入器的互连结构,并且包括第二BIST电路,其被配置为响应于第一BIST电路发送测试信号而从插入器的互连结构接收信号。 第二BIST电路被配置为将从插入器的互连结构接收的信号与由第二BIST电路产生的参考信号进行比较。

    Ultra high resolution timing measurement
    9.
    发明授权
    Ultra high resolution timing measurement 有权
    超高分辨率时序测量

    公开(公告)号:US07986591B2

    公开(公告)日:2011-07-26

    申请号:US12757396

    申请日:2010-04-09

    IPC分类号: G04F8/00 G01R13/02

    CPC分类号: G04F10/005

    摘要: An integrated circuit for high-resolution timing measurement includes a delay pulse generator, the first oscillator to generate the first clock with the first frequency, the second oscillator to generate the second clock with the second frequency, an oscillator tuner, a sampling module, a counter, wherein the delay pulse generator generated a delayed pulse from the second clock, the oscillator tuner controls the second frequency to be as close as possible to the first frequency without being the same as the second frequency, the sampling module samples the delayed pulse at the first frequency, the counter generates a digital counter value by counting a number of sampling by the sampling module, and a time width of the delayed pulse can be calculated by the digital counter value. The second oscillator can be a tunable ring oscillator with one or more coarse tune stages and one or more fine-tune stages.

    摘要翻译: 用于高分辨率定时测量的集成电路包括延迟脉冲发生器,第一振荡器,用于产生具有第一频率的第一时钟,第二振荡器产生具有第二频率的第二时钟,振荡器调谐器,采样模块, 计数器,其中所述延迟脉冲发生器从所述第二时钟产生延迟脉冲,所述振荡器调谐器控制所述第二频率尽可能接近所述第一频率而不与所述第二频率相同,所述采样模块将所述延迟脉冲采样 第一频率,计数器通过对采样模块进行采样次数的计数来产生数字计数器值,并且可以通过数字计数器值计算延迟脉冲的时间宽度。 第二振荡器可以是具有一个或多个粗调级和一个或多个微调级的可调谐环形振荡器。

    BUILT-IN SELF-TEST FOR INTERPOSER
    10.
    发明申请
    BUILT-IN SELF-TEST FOR INTERPOSER 有权
    内置自检测试

    公开(公告)号:US20130047049A1

    公开(公告)日:2013-02-21

    申请号:US13209477

    申请日:2011-08-15

    IPC分类号: G01R31/3187 G06F11/27

    CPC分类号: G01R31/318536

    摘要: A device includes a first die coupled to an interconnect structure of an interposer. The first die includes a first BIST circuit configured to generate and output test signals to the interconnection structure of the interposer. A second die is coupled to the interconnect structure of the interposer and includes a second BIST circuit configured to receive signals from the interconnection structure of the interposer in response to the first BIST circuit transmitting the test signals. The second BIST circuit is configured to compare the signals received from the interconnection structure of the interposer to reference signals generated by the second BIST circuit.

    摘要翻译: 器件包括耦合到插入器的互连结构的第一管芯。 第一裸片包括第一BIST电路,其被配置为产生并输出测试信号到中介层的互连结构。 第二管芯耦合到插入器的互连结构,并且包括第二BIST电路,其被配置为响应于第一BIST电路发送测试信号而从插入器的互连结构接收信号。 第二BIST电路被配置为将从插入器的互连结构接收的信号与由第二BIST电路产生的参考信号进行比较。