公开(公告)号：US20050253181A1

公开(公告)日：2005-11-17

申请号：US11129440

申请日：2005-05-16

申请人： Naohiko Kimizuka ,  Kiyotaka Imai ,  Yuri Masuoka ,  Toshiyuki Iwamoto ,  Motofumi Saitoh ,  Hirohito Watanabe ,  Masayuki Terai

发明人： Naohiko Kimizuka ,  Kiyotaka Imai ,  Yuri Masuoka ,  Toshiyuki Iwamoto ,  Motofumi Saitoh ,  Hirohito Watanabe ,  Masayuki Terai

IPC分类号： H01L27/092 ,  H01L21/8238 ,  H01L29/78 ,  H01L31/119

CPC分类号： H01L29/517 ,  H01L21/823857 ,  H01L29/4916 ,  H01L29/513 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor device 100 comprises a silicon substrate 102, an N-type MOSFET 118 including a first high dielectric constant film 111 and a polycrystalline silicon film 114 formed on the silicon substrate 102, and a P-type MOSFET 120 including a second high dielectric constant film 112 and a polycrystalline silicon film 114 juxtaposed to N-type MOSFET 118 on the silicon substrate 102. The second high dielectric constant film 112 is formed to have the film thickness thinner than the film thickness of the first high dielectric constant film 111. The first high dielectric constant film 111 and the second high dielectric constant film 112 contains one or more element(s) selected from a group consisting of Hf and Zr.

摘要翻译： 半导体器件100包括硅衬底102，包括形成在硅衬底102上的第一高介电常数膜111和多晶硅膜114的N型MOSFET 118和包括第二高介电常数的P型MOSFET 120 膜112和与硅衬底102上的N型MOSFET 118并列的多晶硅膜114.第二高介电常数膜112形成为具有比第一高介电常数膜111的膜厚薄的膜厚度。 第一高介电常数膜111和第二高介电常数膜112包含从由Hf和Zr组成的组中选择的一种或多种元素。

公开(公告)号：US07759744B2

公开(公告)日：2010-07-20

申请号：US11129440

申请日：2005-05-16

申请人： Naohiko Kimizuka ,  Kiyotaka Imai ,  Yuri Masuoka ,  Toshiyuki Iwamoto ,  Motofumi Saitoh ,  Hirohito Watanabe ,  Masayuki Terai

发明人： Naohiko Kimizuka ,  Kiyotaka Imai ,  Yuri Masuoka ,  Toshiyuki Iwamoto ,  Motofumi Saitoh ,  Hirohito Watanabe ,  Masayuki Terai

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119 ,  H01L27/01 ,  H01L27/12 ,  H01L31/0392 ,  H01L23/62 ,  H01L27/10 ,  H01L29/73

CPC分类号： H01L29/517 ,  H01L21/823857 ,  H01L29/4916 ,  H01L29/513 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device 100 includes a silicon substrate 102, an N-type MOSFET 118 including a first high dielectric constant film 111 and a polycrystalline silicon film 114 on the silicon substrate 102, and a P-type MOSFET 120 including a second high dielectric constant film 12 and a polycrystalline silicon film 114 juxtaposed to N-type MOSFET 118 on the silicon substrate 102. The second high dielectric constant film 112 is formed to have the film thickness thinner than the film thickness of the first high dielectric constant film 111. The first high dielectric constant film 111 and the second high dielectric constant film 112 contains one or more element(s) selected from Hf and Zr.

摘要翻译： 半导体器件100包括硅衬底102，在硅衬底102上包括第一高介电常数膜111和多晶硅膜114的N型MOSFET 118和包括第二高介电常数膜的P型MOSFET 120 12和与硅衬底102上的N型MOSFET 118并列的多晶硅膜114.第二高介电常数膜112形成为具有比第一高介电常数膜111的膜厚薄的膜厚度。第一 高介电常数膜111和第二高介电常数膜112含有选自Hf和Zr的一种或多种元素。

公开(公告)号：US07238996B2

公开(公告)日：2007-07-03

申请号：US11129439

申请日：2005-05-16

申请人： Naohiko Kimizuka ,  Kiyotaka Imai ,  Yuri Masuoka ,  Toshiyuki Iwamoto ,  Motofumi Saitoh ,  Hirohito Watanabe ,  Ayuka Tada

发明人： Naohiko Kimizuka ,  Kiyotaka Imai ,  Yuri Masuoka ,  Toshiyuki Iwamoto ,  Motofumi Saitoh ,  Hirohito Watanabe ,  Ayuka Tada

IPC分类号： H01L29/70

CPC分类号： H01L21/28185 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/31155 ,  H01L21/823857 ,  H01L29/513 ,  H01L29/517

摘要： A semiconductor device 100 comprises a silicon substrate 102, an N-type MOSFET 118 including a high concentration-high dielectric constant film 108b formed on the silicon substrate 102 and a polycrystalline silicon film 114, and a P-type MOSFET 120 including a low concentration-high dielectric constant film 108a and a polycrystalline silicon film 114 formed on the semiconductor substrate 102 to be juxtaposed to the N-type MOSFET 118. The low concentration-high dielectric constant film 108a and the high concentration-high dielectric constant film 108b are composed of a material containing one or more element (s) selected from a group consisting of Hf and Zr. The concentration of the above-described metallic element contained in the low concentration-high dielectric constant film 108a is lower than that contained in the high concentration-high dielectric constant film 108b.

摘要翻译： 半导体器件100包括硅衬底102，包括形成在硅衬底102上的高浓度 - 高介电常数膜108b和多晶硅膜114的N型MOSFET 118以及包括低电平的P型MOSFET 120 浓度高介电常数膜108a和形成在半导体衬底102上并与N型MOSFET 118并置的多晶硅膜114。 低浓度 - 高介电常数膜108a和高浓度 - 高介电常数膜108b由含有选自Hf和Zr的一种或多种元素的材料构成。 包含在低浓度 - 高介电常数膜108a中的上述金属元素的浓度低于高浓度 - 高介电常数膜108b中包含的金属元素的浓度。

公开(公告)号：US20050263802A1

公开(公告)日：2005-12-01

申请号：US11129439

申请日：2005-05-16

申请人： Naohiko Kimizuka ,  Kiyotaka Imai ,  Yuri Masuoka ,  Toshiyuki Iwamoto ,  Motofumi Saitoh ,  Hirohito Watanabe ,  Ayuka Tada

发明人： Naohiko Kimizuka ,  Kiyotaka Imai ,  Yuri Masuoka ,  Toshiyuki Iwamoto ,  Motofumi Saitoh ,  Hirohito Watanabe ,  Ayuka Tada

IPC分类号： H01L27/092 ,  H01L21/28 ,  H01L21/3115 ,  H01L21/336 ,  H01L21/8238 ,  H01L29/51 ,  H01L29/76 ,  H01L29/78

CPC分类号： H01L21/28185 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/31155 ,  H01L21/823857 ,  H01L29/513 ,  H01L29/517

摘要： A semiconductor device 100 comprises a silicon substrate 102, an N-type MOSFET 118 including a high concentration-high dielectric constant film 108b formed on the silicon substrate 102 and a polycrystalline silicon film 114, and a P-type MOSFET 120 including a low concentration-high dielectric constant film 108a and a polycrystalline silicon film 114 formed on the semiconductor substrate 102 to be juxtaposed to the N-type MOSFET 118. The low concentration-high dielectric constant film 108a and the high concentration-high dielectric constant film 108b are composed of a material containing one or more element (s) selected from a group consisting of Hf and Zr. The concentration of the above-described metallic element contained in the low concentration-high dielectric constant film 108a is lower than that contained in the high concentration-high dielectric constant film 108b.

摘要翻译： 半导体器件100包括硅衬底102，包括形成在硅衬底102上的高浓度 - 高介电常数膜108b和多晶硅膜114的N型MOSFET 118以及包括低电平的P型MOSFET 120 浓度高介电常数膜108a和形成在半导体衬底102上并与N型MOSFET 118并置的多晶硅膜114。 低浓度 - 高介电常数膜108a和高浓度 - 高介电常数膜108b由含有选自Hf和Zr的一种或多种元素的材料构成。 包含在低浓度 - 高介电常数膜108a中的上述金属元素的浓度低于高浓度 - 高介电常数膜108b中包含的金属元素的浓度。

公开(公告)号：US07838945B2

公开(公告)日：2010-11-23

申请号：US12093666

申请日：2006-10-18

申请人： Motofumi Saitoh ,  Hirohito Watanabe

发明人： Motofumi Saitoh ,  Hirohito Watanabe

IPC分类号： H01L29/76

CPC分类号： H01L21/823842 ,  H01L21/28097 ,  H01L21/823835 ,  H01L21/823871 ,  H01L29/66545 ,  H01L29/6656 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes first and second active regions on a semiconductor substrate, separated by an element isolation region; a line-shaped electrode disposed from over the first to over the second active region via the element isolation region; first and second FETs including a gate insulating film on the first and second active regions, respectively, a gate electrode composed of the line-shaped electrode and a source/drain region. Parts of the line-shaped electrode over the first and second active regions are formed of different materials. The line-shaped electrode includes a diffusion restraining region having thickness in a direction perpendicular to the substrate thinner than that over the first and second active regions. The diffusion restraining region is over the element isolation region and spans the whole width of the line-shaped electrode in the gate length direction.

摘要翻译： 半导体器件包括半导体衬底上的第一和第二有源区，由元件隔离区隔开; 线状电极，其经由元件隔离区域从第一至第二有源区域上方设置; 第一和第二FET分别包括在第一和第二有源区上的栅极绝缘膜，由线状电极和源极/漏极区组成的栅电极。 第一和第二活性区域上的线状电极的部分由不同的材料形成。 线状电极包括扩散抑制区域，该扩散抑制区域在垂直于衬底的方向上的厚度小于第一和第二有源区域上的厚度。 扩散抑制区域在元件隔离区域的上方，并且跨越栅极长度方向的线状电极的整个宽度。

公开(公告)号：US20090096032A1

公开(公告)日：2009-04-16

申请号：US12093666

申请日：2006-10-18

申请人： Motofumi Saitoh ,  Hirohito Watanabe

发明人： Motofumi Saitoh ,  Hirohito Watanabe

IPC分类号： H01L27/092 ,  H01L21/8234

CPC分类号： H01L21/823842 ,  H01L21/28097 ,  H01L21/823835 ,  H01L21/823871 ,  H01L29/66545 ,  H01L29/6656 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes first and second active regions on a semiconductor substrate, separated by an element isolation region; a line-shaped electrode disposed from over the first to over the second active region via the element isolation region; first and second FETs including a gate insulating film on the first and second active regions, respectively, a gate electrode composed of the line-shaped electrode and a source/drain region. Parts of the line-shaped electrode over the first and second active regions are formed of different materials. The line-shaped electrode includes a diffusion restraining region having thickness in a direction perpendicular to the substrate thinner than that over the first and second active regions. The diffusion restraining region is over the element isolation region and spans the whole width of the line-shaped electrode in the gate length direction.

摘要翻译： 半导体器件包括半导体衬底上的第一和第二有源区，由元件隔离区隔开; 线状电极，其经由元件隔离区域从第一至第二有源区域上方设置; 第一和第二FET分别包括在第一和第二有源区上的栅极绝缘膜，由线状电极和源极/漏极区组成的栅电极。 第一和第二活性区域上的线状电极的部分由不同的材料形成。 线状电极包括扩散抑制区域，该扩散抑制区域在垂直于衬底的方向上的厚度小于第一和第二有源区域上的厚度。 扩散抑制区域在元件隔离区域的上方，并且跨越栅极长度方向的线状电极的整个宽度。

公开(公告)号：US20060131670A1

公开(公告)日：2006-06-22

申请号：US10561608

申请日：2004-04-26

申请人： Takashi Ogura ,  Nobuyuki Ikarashi ,  Toshiyuki Iwamoto ,  Hirohito Watanabe

发明人： Takashi Ogura ,  Nobuyuki Ikarashi ,  Toshiyuki Iwamoto ,  Hirohito Watanabe

IPC分类号： H01L29/76

CPC分类号： H01L21/28185 ,  H01L21/28194 ,  H01L21/28211 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/6656 ,  H01L29/78

摘要： A semiconductor device provided with a MIS type field effect transistor comprising a silicon substrate, a gate insulating film having a high-dielectric-constant metal oxide film which is formed on the silicon substrate via a silicon containing insulating film, a silicon-containing gate electrode formed on the gate insulating film, and a sidewall including, as a constituting material, silicon oxide on a lateral face side of the gate electrode, wherein a silicon nitride film is interposed between the sidewall and at least the lateral face of the gate electrode. This semiconductor device, although having a fine structure with a small gate length, is capable of low power consumption and fast operation.

摘要翻译： 一种设置有MIS型场效应晶体管的半导体器件，包括硅衬底，具有通过含硅绝缘膜形成在硅衬底上的高介电常数金属氧化物膜的栅极绝缘膜，含硅栅电极 形成在所述栅极绝缘膜上的侧壁，以及在所述栅电极的侧面上包含氧化硅作为构成材料的侧壁，其中，所述侧壁与所述栅电极的至少所述侧面之间插入有氮化硅膜。 该半导体器件尽管具有栅极长度小的精细结构，但能够实现低功耗和快速操作。

公开(公告)号：US20080203500A1

公开(公告)日：2008-08-28

申请号：US12071126

申请日：2008-02-15

申请人： Takashi Ogura ,  Nobuyuki Ikarashi ,  Toshiyuki Iwamoto ,  Hirohito Watanabe

发明人： Takashi Ogura ,  Nobuyuki Ikarashi ,  Toshiyuki Iwamoto ,  Hirohito Watanabe

IPC分类号： H01L29/78

CPC分类号： H01L21/28185 ,  H01L21/28194 ,  H01L21/28211 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/6656 ,  H01L29/78

摘要： A semiconductor device provided with a MIS type field effect transistor comprising a silicon substrate, a gate insulating film having a high-dielectric-constant metal oxide film which is formed on the silicon substrate via a silicon containing insulating film, a silicon-containing gate electrode formed on the gate insulating film, and a sidewall including, as a constituting material, silicon oxide on a lateral face side of the gate electrode, wherein a silicon nitride film is interposed between the sidewall and at least the lateral face of the gate electrode. This semiconductor device, although having a fine structure with a small gate length, is capable of low power consumption and fast operation.

摘要翻译： 一种设置有MIS型场效应晶体管的半导体器件，包括硅衬底，具有通过含硅绝缘膜形成在硅衬底上的高介电常数金属氧化物膜的栅极绝缘膜，含硅栅电极 形成在所述栅极绝缘膜上的侧壁，以及在所述栅电极的侧面上包含氧化硅作为构成材料的侧壁，其中，所述侧壁与所述栅电极的至少所述侧面之间插入有氮化硅膜。 该半导体器件尽管具有栅极长度小的精细结构，但能够实现低功耗和快速操作。

公开(公告)号：US09247651B2

公开(公告)日：2016-01-26

申请号：US12754929

申请日：2010-04-06

申请人： Hirohito Watanabe

发明人： Hirohito Watanabe

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K1/11 ,  H05K3/28 ,  H05K1/02 ,  H05K3/00 ,  H05K3/38

CPC分类号： H05K3/281 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y10T29/49124

摘要： To improve reliability by preventing separation of a sheet material attached on a flexible printed circuit, provided is a flexible printed circuit including a printed board body and a reinforcing board. A leaked portion of an adhesive agent is formed to leak in an outward direction relative to an end surface of the reinforcing board. The leaked portion adheres to part of the end surface of the reinforcing board to be continuous from a lower end of the end surface to form an inclined surface tapered in the outward direction. The leaked portion is formed such that a portion thereof that covers the end surface has an adhesion height hA, as measured from an adhesive surface of the reinforcing board, of greater than 0% and not greater than 80% of the thickness H1 of the reinforcing board.

摘要翻译： 为了通过防止附着在柔性印刷电路上的片材的分离来提高可靠性，提供了包括印刷板主体和加强板的柔性印刷电路。 粘合剂的泄漏部形成为相对于加强板的端面在向外方向泄漏。 泄漏部分粘附在加强板的端面的一部分上，从端面的下端连续，形成向外方向倾斜的倾斜面。 泄漏部分形成为使得其覆盖端面的部分具有从加强板的粘合表面测量的粘合高度hA大于加强件的厚度H1的0％且不大于80％ 板。

公开(公告)号：US09006579B2

公开(公告)日：2015-04-14

申请号：US13617366

申请日：2012-09-14

申请人： Masatoshi Inaba ,  Hiroshi Miyata ,  Hirohito Watanabe

发明人： Masatoshi Inaba ,  Hiroshi Miyata ,  Hirohito Watanabe

IPC分类号： B32B38/10 ,  H05K1/00 ,  H05K3/24 ,  H05K3/26 ,  H05K1/11

CPC分类号： H05K3/244 ,  H05K1/118 ,  H05K3/26

摘要： A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles α1 and α2 between the polishing direction of the exposed portion of the copper layer and the bending lines C1 and C2 satisfy the following formula (1): 30°≦α1 and α2≦150°  (1).

摘要翻译： 制造印刷电路板的方法包括：在基膜上形成互连图形的铜层; 将盖层叠在基膜上，以便从覆盖层露出铜层的一部分，并通过覆盖层覆盖铜层; 至少机械抛光铜层的暴露部分; 对铜层的露出部进行电镀处理，在铜层上形成镀层，铜层的露出部的研磨方向和弯曲线C1，C2的角度α1，α2 满足下列公式（1）：30°＆nlE;α1和α2＆nlE; 150°（1）。