Electrostatic chuck
    1.
    发明授权
    Electrostatic chuck 有权
    静电吸盘

    公开(公告)号:US6134096A

    公开(公告)日:2000-10-17

    申请号:US317772

    申请日:1999-05-18

    摘要: An electrostatic chuck for attracting an object for treatment. The electrostatic chuck includes a substrate, an insulating dielectric layer and at least one electrode located between the substrate and the insulating dielectric layer. The object is attracted onto the electrode via the insulating dielectric layer. The insulating dielectric layer is between 0.5 mm and 5.0 mm thick, and utilizes a gas-introducing hole to form a gas-diffusing depression on the side of an attractive surface, allowing for more uniform heat conduction. The gas-diffusing depression is between 100 um and 5.0 mm deep. The distance between the bottom surface of the gas-diffusing depression and an electrode may range from 500 .mu.m to 5 mm.

    摘要翻译: 用于吸引物体进行治疗的静电卡盘。 静电卡盘包括基板,绝缘电介质层和位于基板和绝缘介电层之间的至少一个电极。 物体经由绝缘介电层吸引到电极上。 绝缘介电层的厚度在0.5mm至5.0mm之间,利用气体导入孔在吸引面侧形成气体扩散凹部,能够进行更均匀的导热。 气体扩散凹陷深度在100μm到5.0mm之间。 气体扩散凹陷的底表面和电极之间的距离可以在500μm至5mm的范围内。

    Electrostatic chuck
    2.
    发明授权
    Electrostatic chuck 失效
    静电吸盘

    公开(公告)号:US5946183A

    公开(公告)日:1999-08-31

    申请号:US705988

    申请日:1996-08-30

    摘要: An electrostatic chuck for attracting an object to be treated, includes a substrate, an insulating dielectric layer and at least one electrode provided between the substrate and the insulating dielectric layer, wherein the above object is to be attracted onto the electrode via the insulating dielectric layer and an average thickness of the insulating dielectric layer is not less than 0.5 mm and not more than 5.0 mm.

    摘要翻译: 用于吸引待处理物体的静电卡盘包括基板,绝缘介电层和设置在基板和绝缘介电层之间的至少一个电极,其中上述目的经由绝缘介电层被吸引到电极上 并且绝缘介电层的平均厚度不小于0.5mm且不大于5.0mm。

    Plasma processing apparatus
    3.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号:US06432208B1

    公开(公告)日:2002-08-13

    申请号:US09670580

    申请日:2000-09-27

    IPC分类号: C23C1600

    摘要: In a plasma processing apparatus, a temperature control of a substrate to be processed is improved. A ceramic made support member having a substantially cylindrical shape is provided in a process chamber. An upper end of the support member is airtightly connected to a back surface of a placement table by solid state bonding. A lower end of the support member is airtightly connected to a bottom of the process chamber via a lower cooling jacket and O-rings. A cooling jacket made of a disc-like aluminum block is provided in an atmosphere chamber formed inside the support member. The cooling jacket is mounted to the back surface of the placement table via a heat conductive sheet member.

    摘要翻译: 在等离子体处理装置中,提高了待处理基板的温度控制。 在处理室中设置具有大致圆柱形状的陶瓷制的支撑构件。 支撑构件的上端通过固态粘合气密地连接到放置台的后表面。 支撑构件的下端经由下部冷却套和O形环气密地连接到处理室的底部。 在形成在支撑构件内部的气氛室中设置由盘状铝块制成的冷却套。 冷却套通过导热板构件安装到放置台的后表面。

    Substrate for use in wafer attracting apparatus and manufacturing method
thereof
    4.
    发明授权
    Substrate for use in wafer attracting apparatus and manufacturing method thereof 失效
    用于晶片吸引装置的基板及其制造方法

    公开(公告)号:US6166432A

    公开(公告)日:2000-12-26

    申请号:US34021

    申请日:1998-03-02

    CPC分类号: H01L21/6833 Y10T279/23

    摘要: A wafer attracting apparatus includes a substrate made of a ceramic material and adapted to attract and hold a wafer onto an attracting surface thereof, wherein the attracting surface is constituted by a ductile worked surface, the ductile worked surface has concave portions, a diameter of each of the concave portions is 0.1 .mu.m or less, and when the wafer is attracted onto the attracting surface of the substrate and released therefrom, the number of particles attaching to that wafer is 9.3 or less per 1 cm.sup.2.

    摘要翻译: 晶片吸引装置包括由陶瓷材料制成并适于将晶片吸引并保持在其吸引表面上的衬底,其中吸引表面由延性加工表面构成,延性加工表面具有凹部,每个的直径 的凹部的面积为0.1μm以下,并且当晶片被吸引到基板的吸引面上并从基板上吸引后,附着于该晶片的粒子数为每1cm3 9.3以下。

    Substrate for use in wafer attracting apparatus and manufacturing method thereof
    5.
    发明授权
    Substrate for use in wafer attracting apparatus and manufacturing method thereof 有权
    用于晶片吸引装置的基板及其制造方法

    公开(公告)号:US06491571B1

    公开(公告)日:2002-12-10

    申请号:US09531462

    申请日:2000-03-20

    IPC分类号: B24B722

    CPC分类号: H01L21/6833 Y10T279/23

    摘要: A wafer attracting apparatus includes a substrate made of a ceramic material and adapted to attract and hold a wafer onto an attracting surface thereof, wherein the attracting surface is constituted by a ductile worked surface, the ductile worked surface has concave portions, a diameter of each of the concave portions is 0.1 &mgr;m or less, and when the wafer is attracted onto the attracting surface of the substrate and released therefrom, the number of particles attaching to that wafer is 9.3 or less per 1 cm2.

    摘要翻译: 晶片吸引装置包括由陶瓷材料制成并适于将晶片吸引并保持在其吸引表面上的衬底,其中吸引表面由延性加工表面构成,延性加工表面具有凹部,每个的直径 的凹部的厚度为0.1μm以下,并且当晶片被吸引到基板的吸附面上并被剥离时,附着在该晶片上的粒子的数量为每1cm 3为9.3以下。