公开(公告)号：US20150303555A1

公开(公告)日：2015-10-22

申请号：US14551227

申请日：2014-11-24

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHI-HAW CHIANG ,  REN-RUEY FANG ,  MENG-BIN LIN

IPC: H01Q1/38 ,  C23F1/02 ,  C23C18/38 ,  H01Q1/36

CPC classification number: H01Q1/38 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/2066 ,  C23C18/22 ,  C23C18/285 ,  C23C18/30 ,  C23C18/405 ,  C25D3/38

Abstract: A manufacturing method of nonplanar 3D antenna shaping includes providing a nonplanar insulating substrate; performing coarsening and modification on the surface of the substrate, followed by rendering the substrate surface hydrophilic in a plasma process to form a modified substrate; performing copper electroless plating on the modified substrate to plate a copper layer on the substrate, so as to achieve a required thickness. The width of the metal wiring is efficiently reduced to microscale by 3D photolithography; therefore, the range of its low-frequency application is reduced to less than 2 GHz. The method involves controlling substrate surface coarseness uniformity, modifying the substrate surface hydrophilic, and applying a precise plating technique with a view to enhancing the quality of copper wire coating. The method not only enhances antenna low-frequency performance but is also conducive to miniaturization of antennas, thereby allowing a tool carrying an antenna to reduce weight and power consumption.

Abstract translation: 非平面3D天线成形的制造方法包括提供非平面绝缘基板; 在基板的表面上进行粗化和改性，然后在等离子体工艺中使基板表面亲水化以形成改性基板; 在改性基板上进行铜化学镀以在基板上镀铜层，以达到所需的厚度。 通过3D光刻法将金属布线的宽度有效地降低到微观尺寸; 因此，其低频应用的范围降低到小于2GHz。 该方法包括控制基底表面粗糙度均匀性，改变基底表面亲水性，并施加精确的电镀技术以提高铜线涂层的质量。 该方法不仅增强了天线的低频性能，而且有利于天线的小型化，从而允许携带天线的工具减轻重量和功耗。

公开(公告)号：US20190127871A1

公开(公告)日：2019-05-02

申请号：US15801496

申请日：2017-11-02

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHI-HAW CHIANG ,  LIANG-HUEI JIANG ,  REN-RUEY FANG ,  CHIEN-LIANG CHANG ,  YU-PING WANG ,  MING-TA HSIEH

IPC: C25D3/58 ,  H01L21/768

CPC classification number: C25D3/58 ,  C25D3/64 ,  H01L21/76843 ,  H01L21/76873

Abstract: A copper-silver dual-component metal electroplating solution includes copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chlorine ions, and water. An electroplating method for forming a copper-silver dual-component metal by using such an electroplating solution, the steps of which includes (a) contacting the copper-silver dual-component metal electroplating solution with a substrate; (b) applying an operating voltage, the current density of which is controlled to be between 0.1 and 2 ASD in order to carry out electroplating on the substrate. Therefore, the electroplating solution has environmental characteristics, such as less poisoning hazards, through the design of methanesulfonic acid and methanesulfonate electroplating solution. Also, the potential and the current are adjusted during the electroplating in order to obtain a copper-silver dual-component metal plating layer with a specific silver content.

公开(公告)号：US20150348893A1

公开(公告)日：2015-12-03

申请号：US14289937

申请日：2014-05-29

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHIH WANG ,  CHI-HAW CHIANG ,  YU-PING WANG ,  YANG-KUO KUO

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49833 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2924/05032 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1436 ,  H01L2924/1461 ,  H01L2924/20261 ,  H01L2924/20301 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/40102 ,  H01L2924/40503 ,  H01L2924/00014

Abstract: A method of manufacturing a three-dimensional integrated circuit comprising an aluminum nitride interposer is introduced. The method includes providing a first circuit component; providing a plurality of first conductive blocks on the first circuit component; providing an aluminum nitride interposer on the first circuit component, wherein the aluminum nitride interposer has microvias each comprising therein a conductor with an end in contact with a corresponding one of the first conductive blocks; providing second conductive blocks on the aluminum nitride interposer, wherein the second conductive blocks are in contact with the other ends of the conductors in the microvias; and providing at least a second circuit component disposed on the aluminum nitride interposer and electrically connected to the first circuit component through the first and second conductive blocks and the conductors.

Abstract translation: 引入了包括氮化铝插入件的三维集成电路的制造方法。 该方法包括提供第一电路部件; 在所述第一电路部件上提供多个第一导电块; 在所述第一电路部件上提供氮化铝插入件，其中所述氮化铝插入件具有微孔，每个微孔包括其中与所述第一导电块中的相应一个接触的端部的导体; 在所述氮化铝插入件上提供第二导电块，其中所述第二导电块与所述微孔中导体的另一端接触; 以及提供至少第二电路部件，其设置在所述氮化铝插入件上并通过所述第一和第二导电块和所述导体与所述第一电路部件电连接。

公开(公告)号：US20150345040A1

公开(公告)日：2015-12-03

申请号：US14289879

申请日：2014-05-29

Applicant: National Chung Shan Institute of Science and Technology

Inventor： CHI-HAW CHIANG ,  CHIH WANG ,  YU-PING WANG ,  CHUN-YU LEE ,  REN-RUEY FANG ,  YANG-KUAO KUO

IPC: C25D3/56 ,  C25D5/48 ,  C25D7/06 ,  C25D5/18

CPC classification number: C25D3/562 ,  C25D5/12 ,  C25D7/0607

Abstract: A method of manufacturing a nickel-based alloy barrier layer of a wiring connection terminal includes providing a substrate having a metal wiring; electroplating a nickel or a nickel-based alloy to the metal wiring at a deposition rate of 15-30 μm/hr to form a first layer thereon, wherein the first layer is of a thickness of 0.5 μm-5 μm, and the nickel-based alloy layer has nickel content of at least 50%; and plating a gold layer to the first layer to form thereon a second layer of a thickness of 0.03 μm-0.3 μm. The surface of the nickel-based alloy electroplated layer features a crystalline-phase structure full of micro-protuberances, and the thickness of the gold plated layer is reduced to 0.03 μm.

Abstract translation: 制造布线连接端子的镍基合金阻挡层的方法包括提供具有金属布线的基板; 以15-30μm/小时的沉积速率将镍或镍基合金电镀到金属布线上以在其上形成第一层，其中第一层的厚度为0.5μm-5μm， 镍合金层的镍含量至少为50％; 并将金层电镀到第一层上以在其上形成厚度为0.03μm-0.3μm的第二层。 镍基合金电镀层的表面具有充满微突起的结晶相结构，镀金层的厚度减小到0.03μm。

公开(公告)号：US20150303574A1

公开(公告)日：2015-10-22

申请号：US14551192

申请日：2014-11-24

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHI-HAW CHIANG ,  CHIA-HUA CHANG ,  CHIH WANG ,  CHUN-YU LEE

IPC: H01Q9/04

CPC classification number: H01Q9/045 ,  H01Q9/0471

Abstract: A nonplanar antenna embedded package structure and a method of manufacturing the same are introduced. The structure includes a nonplanar antenna component. The nonplanar antenna component comprises an antenna substrate, metal wiring, through-hole, and metal bump. The substrate surface covers the metal wiring. The through-hole penetrates the substrate from the antenna substrate bottom side but does not penetrate the metal wiring, and does not affect its appearance. The metal bump is implanted in the through-hole from the antenna substrate bottom side to join the metal wiring. An electronic component having a copper cable is provided. An end of the copper cable protrudes from the electronic component and is inserted into the through-hole of the antenna component to join the metal bump, thereby forming the nonplanar antenna embedded package structure characterized by: preventing the antenna metal wiring from exposing, and reducing interference otherwise arising from antenna resonance frequency and noise.

Abstract translation: 介绍了非平面天线嵌入式封装结构及其制造方法。 该结构包括非平面天线部件。 非平面天线部件包括天线基板，金属布线，通孔和金属凸块。 基板表面覆盖金属布线。 通孔从天线基板底侧穿透基板，但不穿透金属布线，并且不影响其外观。 金属凸块从天线基板底侧注入到通孔中以连接金属布线。 提供具有铜缆的电子部件。 铜电缆的一端从电子部件伸出并插入到天线部件的通孔中以接合金属凸块，从而形成非平面天线嵌入式封装结构，其特征在于：防止天线金属布线暴露，并且减少 由天线共振频率和噪声引起的干扰。

公开(公告)号：US20150303553A1

公开(公告)日：2015-10-22

申请号：US14551129

申请日：2014-11-24

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHI-HAW CHIANG ,  REN-RUEY FANG ,  MENG-BIN LIN

IPC: H01Q1/36 ,  C23F17/00 ,  C23F1/00 ,  H01Q1/38 ,  C23C18/38

CPC classification number: H01Q1/36 ,  C23C18/1653 ,  C23C18/1851 ,  C23C18/1893 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  C23C18/405 ,  C25D3/38

Abstract: A manufacturing method of antenna shaping includes providing a nonplanar insulating substrate; coarsening and modifying a surface of the substrate and rendering the substrate surface hydrophilic by a plasma process to form a modified substrate; performing copper electroless plating on the modified substrate; electroplating a copper layer to attain a required thickness; defining antenna wiring width and clearance by multi-axis mechanical processing; and performing antenna metal wiring shaping with a copper etching plating solution. Furthermore, metal wiring shaping and processing is performed with a mechanical cutting tool of a multi-axis processing machine without using any photomask, so as to control substrate surface coarsening uniformity and enhance hydrophilicity of the surface of the modified substrate, with a precise plating technique for enhancing the quality of copper wire coating, cutting costs, and speeding up the processing process.

Abstract translation: 天线成形的制造方法包括提供非平面绝缘基板; 粗化和改性基材的表面，并通过等离子体工艺使基材表面亲水，形成改性的基材; 在改性基材上进行铜化学镀; 电镀铜层以达到所需的厚度; 通过多轴机械加工定义天线布线宽度和间隙; 并用铜蚀刻电镀液进行天线金属配线成形。 此外，利用多轴加工机械的机械切削工具进行金属布线成型和加工，而不使用任何光掩模，从而通过精确的电镀技术来控制基板表面粗化均匀性和增强改性基板表面的亲水性 提高铜线涂层的质量，降低成本，加快加工工艺。