公开(公告)号：US10224468B2

公开(公告)日：2019-03-05

申请号：US15883348

申请日：2018-01-30

Applicant: NICHIA CORPORATION

Inventor： Takahiro Tani ,  Hiroki Yuu ,  Toshiaki Moriwaki

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/48 ,  H01S5/042 ,  H01S5/00 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device includes: arranging first and second light emitting elements, each having a pair of electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the electrodes facing upward; forming a light shielding member at least covering the electrodes of each of the first and second light emitting elements and a portion between the first and second light emitting elements; forming recesses by removing portions of the light shielding member so that at least a portion of each of the electrodes of the first and second light emitting elements are exposed from the light shielding member; and forming electrically conductive members in the recesses so that each of the electrically conductive members is in contact with a corresponding one of the electrodes of the first and second light emitting elements.

公开(公告)号：US09190585B2

公开(公告)日：2015-11-17

申请号：US13739802

申请日：2013-01-11

Applicant: Nichia Corporation

Inventor： Hiroto Tamaki ,  Eiko Minato ,  Takahiro Tani

IPC: H01L33/56 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads.

Abstract translation: 一种发光器件具有包括在其表面上具有含银层的至少一对引线并由树脂成型体固定的基体，安装在所述引线上的发光元件，由无机材料制成的保护膜， 覆盖所述基座的上表面，以及通过所述保护膜设置在基底表面上的密封树脂。 密封树脂具有覆盖所述发光元件的第一树脂和具有比覆盖所述树脂成型体和所述引线之间的边界的所述第一树脂更高的硬度的第二树脂。

公开(公告)号：US20130181236A1

公开(公告)日：2013-07-18

申请号：US13739802

申请日：2013-01-11

Applicant: Nichia Corporation

Inventor： Hiroto TAMAKI ,  Eiko Minato ,  Takahiro Tani

IPC: H01L33/56

CPC classification number: H01L33/56 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads.

Abstract translation: 一种发光器件具有包括在其表面上具有含银层的至少一对引线并由树脂成型体固定的基体，安装在所述引线上的发光元件，由无机材料制成的保护膜， 覆盖所述基座的上表面，以及通过所述保护膜设置在基底表面上的密封树脂。 密封树脂具有覆盖所述发光元件的第一树脂和具有比覆盖所述树脂成型体和所述引线之间的边界的所述第一树脂更高的硬度的第二树脂。

公开(公告)号：US10707389B2

公开(公告)日：2020-07-07

申请号：US16250725

申请日：2019-01-17

Applicant: NICHIA CORPORATION

Inventor： Takahiro Tani ,  Hiroki Yuu ,  Toshiaki Moriwaki

IPC: H01L25/16 ,  H01L33/58 ,  H01L33/62 ,  H01L33/48 ,  H01S5/00 ,  H01L33/56

Abstract: A light emitting device includes a light emitting surface, a back surface arranged on an opposite side of the light emitting surface, a mounting surface arranged between the light emitting surface and the back surface, and includes a light emitting element, a light shielding member, first and second terminal coating films, and first and second electrically conductive members. The light emitting element has first and second electrodes arranged on the second main surface. The light shielding member covers the lateral surface of the light emitting element and does not cover the first main surface of the light emitting element. The first and second terminal coating films are electrically connected to the first and second electrodes respectively, and arranged continuously on the back surface and the mounting surface of the light emitting device. The first and second electrically conductive members are in contact with the first and second electrodes respectively.

公开(公告)号：US09917234B2

公开(公告)日：2018-03-13

申请号：US15218323

申请日：2016-07-25

Applicant: NICHIA CORPORATION

Inventor： Takahiro Tani ,  Hiroki Yuu ,  Toshiaki Moriwaki

IPC: H01L33/58 ,  H01L33/62 ,  H01S5/042 ,  H01S5/00

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01S5/005 ,  H01S5/0425

Abstract: A method of manufacturing a light emitting device includes: arranging a first light emitting element and a second light emitting element, each having a pair of first and second electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the pair of electrodes facing upward; forming a pair of electrically conductive members each extending between one of the pair of electrodes of the first light emitting element and a corresponding one of the pair of electrodes of the second light emitting element; forming a light shielding member at least covering between the first and second light emitting elements; and cutting the pair of electrically conductive members and the light shielding member between the first and second light emitting elements, along a direction substantially perpendicular to the main light emitting surface of each of the first and second light emitting elements.

公开(公告)号：US09368675B2

公开(公告)日：2016-06-14

申请号：US14633133

申请日：2015-02-27

Applicant: NICHIA CORPORATION

Inventor： Yoshikazu Takeuchi ,  Toshiaki Moriwaki ,  Atsushi Takeichi ,  Takahiro Tani

IPC: H01L21/00 ,  H01L33/00 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L33/0095 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29144 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83011 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1033 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/013 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/00013 ,  H01L2924/00

Abstract: A method of manufacturing a light-emitting device includes flattening top portions of solder bumps disposed on a wiring substrate, disposing a light-emitting element on the solder bumps whose top portions are flattened, and heating the solder bumps to be melt and to be fused so as to provide an adhesive with which the light-emitting element is secured on the wiring substrate.

Abstract translation: 一种制造发光器件的方法包括：布置在布线基板上的焊料凸起的平坦化顶部，将发光元件设置在其顶部平坦化的焊料凸块上，并加热要熔化的焊料凸块并熔化 从而提供将发光元件固定在布线基板上的粘合剂。