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公开(公告)号：US07713790B2
公开(公告)日：2010-05-11
申请号：US12220711
申请日：2008-07-28
CPC分类号： H05K1/189 , A61N1/375 , H01L23/4985 , H01L2924/0002 , H01L2924/3011 , H05K1/113 , H05K3/4069 , H05K2201/10545 , H05K2201/10681 , H01L2924/00
摘要： A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.
摘要翻译： 一种胶带自动接合（TAB）结构，其包括在其上形成导电图案的柔性带。 导电引线图形包括多个引线，其被配置为形成TAB结构的内部引线键合（ILB）部分。 所述多个引线中的至少一个在内部布线并且具有暴露在TAB结构的ILB部分内部的触点。
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公开(公告)号：US07405475B2
公开(公告)日：2008-07-29
申请号：US11683586
申请日：2007-03-08
CPC分类号： H05K1/189 , A61N1/375 , H01L23/4985 , H01L2924/0002 , H01L2924/3011 , H05K1/113 , H05K3/4069 , H05K2201/10545 , H05K2201/10681 , H01L2924/00
摘要： A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.
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公开(公告)号：US07190069B2
公开(公告)日：2007-03-13
申请号：US09970145
申请日：2001-10-02
IPC分类号： H01L23/34 , H01L23/495 , H01L23/14
CPC分类号： H05K1/189 , A61N1/375 , H01L23/4985 , H01L2924/0002 , H01L2924/3011 , H05K1/113 , H05K3/4069 , H05K2201/10545 , H05K2201/10681 , H01L2924/00
摘要： A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.
摘要翻译： 一种胶带自动接合（TAB）结构，其包括在其上形成导电图案的柔性带。 导电引线图形包括多个引线，其被配置为形成TAB结构的内部引线键合（ILB）部分。 所述多个引线中的至少一个在内部布线并且具有暴露在TAB结构的ILB部分内部的触点。
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公开(公告)号：US20080293168A1
公开(公告)日：2008-11-27
申请号：US12220711
申请日：2008-07-28
IPC分类号： H01L21/66
CPC分类号： H05K1/189 , A61N1/375 , H01L23/4985 , H01L2924/0002 , H01L2924/3011 , H05K1/113 , H05K3/4069 , H05K2201/10545 , H05K2201/10681 , H01L2924/00
摘要： A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.
摘要翻译： 一种胶带自动接合（TAB）结构，其包括在其上形成导电图案的柔性带。 导电引线图形包括多个引线，其被配置为形成TAB结构的内部引线键合（ILB）部分。 所述多个引线中的至少一个在内部布线并且具有暴露在TAB结构的ILB部分内部的触点。
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公开(公告)号：US20080218989A1
公开(公告)日：2008-09-11
申请号：US12123261
申请日：2008-05-19
申请人： Nick A. Youker , Ronald L. Anderson
发明人： Nick A. Youker , Ronald L. Anderson
IPC分类号： H05K9/00
CPC分类号： A61N1/375 , A61N1/3718 , A61N1/3758 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3025 , Y10T29/49126 , Y10T29/49128 , Y10T29/49146 , Y10T29/49172 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering. An apparatus includes a first substrate assembly including a first substrate having a cavity. A first set of electronic components are disposed within the cavity, and a first polymer is disposed over the first set of components. Deposited on an outer surface of the first polymer by vapor deposition is a thin film of metal. The thin film of metal is electrically coupled with a ground. A second substrate assembly including a second substrate is coupled with the first substrate assembly.
摘要翻译： 一种方法包括将组件填充在衬底的空腔中，将聚合物设置在部件上方和腔内。 聚合物固化，并在聚合物上形成薄膜。 此外，一种方法包括通过在医疗装置的表面上沉积金属薄膜，在医疗装置内形成EMI屏蔽。 通过气相沉积或溅射形成金，金，铜或铜的金属薄膜。 一种装置包括第一基板组件，其包括具有空腔的第一基板。 第一组电子部件设置在空腔内，第一聚合物设置在第一组件上。 通过气相沉积沉积在第一聚合物的外表面上是金属薄膜。 金属薄膜与地面电耦合。 包括第二基板的第二基板组件与第一基板组件联接。
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公开(公告)号：US06631555B1
公开(公告)日：2003-10-14
申请号：US09499725
申请日：2000-02-08
申请人： Nick A. Youker , Ronald L. Anderson
发明人： Nick A. Youker , Ronald L. Anderson
IPC分类号： H05K336
CPC分类号： A61N1/375 , A61N1/3718 , A61N1/3758 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3025 , Y10T29/49126 , Y10T29/49128 , Y10T29/49146 , Y10T29/49172 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering.
摘要翻译： 一种方法包括将组件填充在衬底的空腔中，将聚合物设置在部件上方和腔内。 聚合物固化，并在聚合物上形成薄膜。 此外，一种方法包括通过在医疗装置的表面上沉积金属薄膜，在医疗装置内形成EMI屏蔽。 通过气相沉积或溅射形成金，金，铝或铜的金属薄膜
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公开(公告)号：US06251124B1
公开(公告)日：2001-06-26
申请号：US09507523
申请日：2000-02-18
IPC分类号： A61N100
CPC分类号： H01G9/15 , A61N1/362 , A61N1/3956 , H01G9/26 , H05K3/301
摘要： A multi-capacitor module carries vertically-oriented surface mount tantalum capacitors. The module provides at least one conductor for coupling to the substrate capacitor terminals that are distal thereto. The module occupies less space, when mounted to a circuit board substrate, than individually mounting the bases of the surface mount capacitors to the substrate. This allows more efficient use of volume within an implantable cardiac rhythm management device, reducing its size, or alternatively, increasing its implanted longevity.
摘要翻译： 多电容器模块承载垂直取向的表面贴装钽电容。 该模块提供至少一个用于耦合到其远端的衬底电容器端子的导体。 当安装到电路板基板上时，模块占用较少的空间，而不是将表面贴装电容器的基板单独安装到基板上。 这允许在可植入的心律管理装置内更有效地使用体积，减小其尺寸，或者替代地增加其植入的寿命。
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公开(公告)号：US06185088B2
公开(公告)日：2001-02-06
申请号：US09507524
申请日：2000-02-18
IPC分类号： H01G438
CPC分类号： H01G9/15 , A61N1/362 , A61N1/3956 , H01G9/26 , H05K3/301
摘要： A multi-capacitor module carries vertically-oriented surface mount tantalum capacitors. The module provides at least one conductor for coupling to the, substrate capacitor terminals that are distal thereto. The module occupies less space, when mounted to a circuit board substrate, than individually mounting the bases of the surface mount capacitors to the substrate. This allows more efficient use of volume within an implantable cardiac rhythm management device, reducing its size, or alternatively, increasing its implanted longevity.
摘要翻译： 多电容器模块承载垂直取向的表面贴装钽电容。 该模块提供至少一个用于耦合到远离其的基板电容器端子的导体。 当安装到电路板基板上时，模块占用较少的空间，而不是将表面贴装电容器的基板单独安装到基板上。 这允许在可植入的心律管理装置内更有效地使用体积，减小其尺寸，或者替代地增加其植入的寿命。
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公开(公告)号：US07646614B2
公开(公告)日：2010-01-12
申请号：US12123261
申请日：2008-05-19
申请人： Nick A. Youker , Ronald L. Anderson
发明人： Nick A. Youker , Ronald L. Anderson
IPC分类号： H05K9/00
CPC分类号： A61N1/375 , A61N1/3718 , A61N1/3758 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3025 , Y10T29/49126 , Y10T29/49128 , Y10T29/49146 , Y10T29/49172 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering. An apparatus includes a first substrate assembly including a first substrate having a cavity. A first set of electronic components are disposed within the cavity, and a first polymer is disposed over the first set of components. Deposited on an outer surface of the first polymer by vapor deposition is a thin film of metal. The thin film of metal is electrically coupled with a ground. A second substrate assembly including a second substrate is coupled with the first substrate assembly.
摘要翻译： 一种方法包括将组件填充在衬底的空腔中，将聚合物设置在部件上方和腔内。 聚合物固化，并在聚合物上形成薄膜。 此外，一种方法包括通过在医疗装置的表面上沉积金属薄膜，在医疗装置内形成EMI屏蔽。 通过气相沉积或溅射形成金，金，铜或铜的金属薄膜。 一种装置包括第一基板组件，其包括具有空腔的第一基板。 第一组电子部件设置在空腔内，第一聚合物设置在第一组件上。 通过气相沉积沉积在第一聚合物的外表面上是金属薄膜。 金属薄膜与地面电耦合。 包括第二基板的第二基板组件与第一基板组件联接。
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公开(公告)号：US07375982B2
公开(公告)日：2008-05-20
申请号：US10655509
申请日：2003-09-04
申请人： Nick A. Youker , Ronald L. Anderson
发明人： Nick A. Youker , Ronald L. Anderson
IPC分类号： H05K9/00
CPC分类号： A61N1/375 , A61N1/3718 , A61N1/3758 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3025 , Y10T29/49126 , Y10T29/49128 , Y10T29/49146 , Y10T29/49172 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering. An apparatus includes a first substrate assembly including a first substrate having a cavity. A first set of electronic components are disposed within the cavity, and a first polymer is disposed over the first set of components. Deposited on an outer surface of the first polymer by vapor deposition is a thin film of metal. The thin film of metal is electrically coupled with a ground. A second substrate assembly including a second substrate is coupled with the first substrate assembly.
摘要翻译： 一种方法包括将组件填充在衬底的空腔中，将聚合物设置在部件上方和腔内。 聚合物固化，并在聚合物上形成薄膜。 此外，一种方法包括通过在医疗装置的表面上沉积金属薄膜，在医疗装置内形成EMI屏蔽。 通过气相沉积或溅射形成金，金，铜或铜的金属薄膜。 一种装置包括第一基板组件，其包括具有空腔的第一基板。 第一组电子部件设置在空腔内，第一聚合物设置在第一组件上。 通过气相沉积沉积在第一聚合物的外表面上是金属薄膜。 金属薄膜与地面电耦合。 包括第二基板的第二基板组件与第一基板组件联接。
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