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公开(公告)号:US06998935B2
公开(公告)日:2006-02-14
申请号:US10369434
申请日:2003-02-19
申请人: Nitin Jain , Jean-Pierre Lanteri , Noyan Kinayman
发明人: Nitin Jain , Jean-Pierre Lanteri , Noyan Kinayman
IPC分类号: H01P1/10
CPC分类号: H03K17/6874 , H01P1/15 , H03K17/693
摘要: A switch matrix including a plurality of microstrip pairs arranged to form a grid and switches to couple the microstrip pairs where they cross. Each microstrip pair includes a first microstrip and a second microstrip for passing signals. The signals on the first and second microstrips are such that the electromagnetic forces produced by each one are canceled out by the other. By canceling out the electromagnetic forces, undesirable coupling between microstrips that cross and between microstrips and the substrate are minimized, thereby allowing inexpensive substrates such as silicon to be used.
摘要翻译: 一种开关矩阵,包括布置成形成栅格的多个微带对,并且切换到将它们交叉的微带对耦合。 每个微带对包括用于传递信号的第一微带和第二微带。 第一和第二微带上的信号使得由每一个产生的电磁力被另一个消除。 通过消除电磁力,使得在微带和基板之间交叉的微带之间的不期望的耦合被最小化,从而允许使用廉价的基板例如硅。
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公开(公告)号:US06891266B2
公开(公告)日:2005-05-10
申请号:US10075406
申请日:2002-02-14
申请人: Noyan Kinayman , Bernard A. Ziegner , Richard Anderson , Jean-Pierre Lanteri , M. Tekamul Buber
发明人: Noyan Kinayman , Bernard A. Ziegner , Richard Anderson , Jean-Pierre Lanteri , M. Tekamul Buber
IPC分类号: H01L23/055 , H01L23/66 , H01L23/34
CPC分类号: H01L24/32 , H01L23/055 , H01L23/66 , H01L24/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/05599 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H05K1/0222 , H05K1/0243 , H05K2201/09618 , H01L2924/00 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.
摘要翻译: 叠层多层球栅阵列封装适用于毫米波电路。 封装的频率带宽为DC至40 GHz。 该封装采用层叠电路板材料制成,以将封装的温度膨胀系数与主板PCB相匹配。 使用球栅阵列技术实现封装和封装安装在其上的主机PCB之间的电气连接。 包装可以密封,覆盖或封装,适用于大批量生产。
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公开(公告)号:US20080094309A1
公开(公告)日:2008-04-24
申请号:US11551798
申请日:2006-10-23
IPC分类号: H01Q15/02
CPC分类号: H01Q9/0485
摘要: A dielectric resonator radiator comprising first and second portions, each portion being conical or monotonically varying in shape having a larger basal surface and a smaller basal surface and defining a longitudinal axis, the first and second portions being arranged with their longitudinal axes collinear and their larger basal surfaces parallel and adjacent to each other and separated by a gap.
摘要翻译: 一种介质谐振器辐射器,包括第一和第二部分,每个部分是圆锥形或单调变化形状,具有较大的基面和较小的基面并限定纵向轴线,第一和第二部分被布置成它们的纵向轴线共线, 基面相互平行并相邻,间隔开。
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