摘要:
A method of diagnosis of an integrated logic circuit having function blocks, in which a test signal is supplied to the logic circuit; an input signal to and an output signal from at least one of the function blocks are detected by the use of a contactless probing device such as an electron beam probing device or laser beam probing device; simulation is carried out of a normal logic operation of the function block with the detected input signal to provide a simulated output signal; the detected and simulated output signals are compared with each other; and the function block is determined as being normal or abnormal according to the result of the comparison. When the function block includes plural logic elements, the cause of the abnormality may be traced back to a faulty function element by detecting the output of a function element by a contactless probing device, comparing the detected output with a corresponding simulated output and repeating the detection and comparison on other function elements in the function block until the comparison results in coincidence. The function element which receives the signal providing the coincidence as a result of the comparison is determined as the faulty function element.
摘要:
A high-voltage capacitor is intended for use in a high-voltage capacitor device having at least two through conductors. The high-voltage capacitor includes a dielectric porcelain, an individual electrode, and a common electrode. At least two spaced individual electrodes are provided on one surface of the dielectric porcelain and intended to be connected one-to-one to the through conductors positioned outside the dielectric porcelain. The common electrode is provided on the other surface of the dielectric porcelain.
摘要:
A coating solution of SOG is applied on a silicon oxynitride film (11) and precured. As a result, moisture contained in the coating solution volatilizes, and an SOG film (12) is formed. Next, a coating solution of SOG is applied on the SOG film (12) and precured. As a result, an SOG film (13) is formed. Thereafter, a coating solution of SOG is applied on the SOG film (13) and precured. As a result, an SOG film (14) is formed. Subsequently, a main cure of the SOG films (12, 13, and 14) is performed. The viscosity of the coating solution of SOG used for forming the SOG film (12) is lower than those of the coating solutions of SOG used for forming the SOG films (13 and 14).
摘要:
A laminated ceramic electronic component includes a ceramic substrate, an internal electrode, and a buffer layer. The ceramic substrate includes a protective layer and a functional layer. The protective layer is disposed on at least one side of the functional layer. The internal electrode is embedded in the functional layer. The buffer layer is embedded in the protective layer and has a different burning shrinkage from the ceramic substrate.
摘要:
A high-voltage feed-through capacitor includes: a capacitor element; a grounding metal fitting; an insulating resin; two through conductors; an insulating cover; and an insulating tube. The capacitor element has two separate electrodes on one side and one common electrode on the other side and is mounted on one side of the grounding metal fitting with the common electrode being connected to the same side of the grounding metal fitting. The insulating resin fills a space inside the capacitor element. Each through conductor has a rod-like conductor portion passing through the grounding metal fitting and the capacitor element and connected to the separate electrode. At least a portion of the insulating tube is attached to the rod-like conductor portion within the capacitor element. The insulating cover is attached to the rod-like conductor portion to have one end thereof in contact with one end of the insulating tube.
摘要:
A capacitor has electrodes at surfaces thereof, with one of the electrodes secured onto one surface of a grounding metal. Through conductors pass through the capacitor and the grounding metal and are connected to the other electrodes so as to achieve electrical continuity. An insulating case is provided at one surface of the grounding metal, with one end of the insulating case fitted around the external circumference of the raised portion of the grounding metal. Insulating resin fills a space inside the insulating case, the internal space of the grounding metal and a space around the capacitor. The insulating resin comprises an epoxy resin containing a brominated fire retardant, and the brominated fire retardant is a brominated aromatic glycidyl ether.
摘要:
A high-voltage feed-through capacitor includes: a capacitor element; a grounding metal fitting; an insulating resin; two through conductors; an insulating cover; and an insulating tube. The capacitor element has two separate electrodes on one side and one common electrode on the other side and is mounted on one side of the grounding metal fitting with the common electrode being connected to the same side of the grounding metal fitting. The insulating resin fills a space inside the capacitor element. Each through conductor has a rod-like conductor portion passing through the grounding metal fitting and the capacitor element and connected to the separate electrode. At least a portion of the insulating tube is attached to the rod-like conductor portion within the capacitor element. The insulating cover is attached to the rod-like conductor portion to have one end thereof in contact with one end of the insulating tube.
摘要:
At least two (groups of) sensors forming an insertion detection sensor are offset from each other in the conveyance direction of a photosensitive material. An insertion speed, which is different for each manual insertion event, is obtained based on the time difference when sensors that have been offset from each other detect the leading end of the photosensitive material. The length of the photosensitive material in the conveyance direction thereof is accurately computed based on the insertion speed and other information. By correcting the errors due to the changeable insertion state of the photosensitive material caused by manual insertion by the operator, the process area of the photosensitive material, required for calculating the amount of replenisher to be replenished, is accurately obtained. Therefore, the amount of the replenisher is appropriately determined and the process capacity of the developer or the fixing solution can constantly be maintained at the satisfactory level.
摘要:
There is disclosed a process for preparing a thermoplastic resin composition which comprises melting and kneading(A) 100 parts by weight of a resin comprising 100% by weight in total of:(a) 5 to 95% by weight of a non-crystalline thermoplastic resin,(b) 95 to 5% by weight of a crystalline thermoplastic resin,(c) 0 to 50% by weight of a compatibilizer and(d) 0 to 40% by weight of an impact modifier and(B) 1.0 part by weight or more of an organic solvent in a kneader equipped with vent ports each having a vacuum device while maintaining each vent port at reduced pressure to make an organic solvent content in a final composition less than 1.0% by weight.
摘要:
A coating solution of SOG is applied on a silicon oxynitride film (11) and precured. As a result, moisture contained in the coating solution volatilizes, and an SOG film (12) is formed. Next, a coating solution of SOG is applied on the SOG film (12) and precured. As a result, an SOG film (13) is formed. Thereafter, a coating solution of SOG is applied on the SOG film (13) and precured. As a result, an SOG film (14) is formed. Subsequently, a main cure of the SOG films (12, 13, and 14) is performed. The viscosity of the coating solution of SOG used for forming the SOG film (12) is lower than those of the coating solutions of SOG used for forming the SOG films (13 and 14).