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    LIGHTING APPARATUS
    1.
    发明申请
    LIGHTING APPARATUS 审中-公开
    照明设备

    公开(公告)号：US20120134161A1

    公开(公告)日：2012-05-31

    申请号：US13231245

    申请日：2011-09-13

    申请人： Nobuo Kawamura ,  Masahiro Yokota ,  Osamu Ono ,  Ken Takahashi ,  Takeshi Ookawa ,  Shusuke Morita ,  Takashi Nishimura ,  Hidemi Matsuda

    发明人： Nobuo Kawamura ,  Masahiro Yokota ,  Osamu Ono ,  Ken Takahashi ,  Takeshi Ookawa ,  Shusuke Morita ,  Takashi Nishimura ,  Hidemi Matsuda

    IPC分类号： F21V3/00

    CPC分类号： F21V3/02 ,  F21K9/232 ,  F21K9/60 ,  F21V3/0625 ,  F21Y2115/10

    摘要： According to one embodiment, an lighting apparatus includes a base member, a light source configured to emit visible light, and a translucent cover including a translucent region which covers at least a front surface of the light source and emits the light emitted from the light source to the outside. The light source is provided on a front surface flat section of the base member, a luminous intensity of the light emitted from the light source has a directionality which is strong in a normal direction of the front surface flat section and becomes zero on a rear surface side. The translucent cover includes a domed shape having a maximum diameter at a position higher than a height of the position where the light source is arranged, and a transmittance of a region opposing the light source is 60% or less.

    摘要翻译： 根据一个实施例，照明装置包括基座构件，被配置为发射可见光的光源以及包括半透明区域的半透明盖，所述半透明区域至少覆盖光源的前表面并且发射从光源发射的光 到外面 光源设置在基部构件的前表面平坦部分上，从光源发射的光的发光强度具有在前表面平坦部分的法线方向上强的方向性，并且在后表面上变为零 侧。 半透明盖包括在比设置有光源的位置的高度高的位置处具有最大直径的圆顶形状，并且与光源相对的区域的透射率为60％以下。

    COMMUNICATION SYSTEM AND SUPERIMPOSING APPARATUS
    5.
    发明申请
    COMMUNICATION SYSTEM AND SUPERIMPOSING APPARATUS 有权
    通信系统和超级计算机

    公开(公告)号：US20130208733A1

    公开(公告)日：2013-08-15

    申请号：US13879618

    申请日：2011-10-25

    申请人： Takeshi Sugiyama ,  Tadashi Matsumoto ,  Ken Takahashi

    发明人： Takeshi Sugiyama ,  Tadashi Matsumoto ,  Ken Takahashi

    IPC分类号： H04L12/43

    CPC分类号： H04L47/60 ,  H04B3/544

    摘要： The communication system includes: first terminal devices connected to a transmission path and having terminal information; a second terminal device connected to the path and sending an information request requesting the information from the first terminal device; a first superimposing apparatus interposed between the first terminal device and the path; and a second superimposing apparatus interposed between the second terminal device and the path and receiving the request from the second terminal device. The first superimposing apparatus acquires the information from the connected first terminal device at predetermined timings and stores it. Upon receiving the request, the second superimposing apparatus sends the request to the first superimposing apparatus using a superimposed signal superimposed on a transmission signal transmitted via the path. Upon receiving the request, the first superimposing apparatus sends the information to the second superimposing apparatus using the superimposed signal. Upon receiving the information, the second superimposing apparatus provides the information to the second terminal device.

    摘要翻译： 通信系统包括：连接到传输路径并具有终端信息的第一终端设备; 连接到所述路径并发送从所述第一终端设备请求所述信息的信息请求的第二终端设备; 插入在所述第一终端装置和所述路径之间的第一重叠装置; 以及插入在第二终端设备和路径之间并且接收来自第二终端设备的请求的第二叠加设备。 第一重叠装置以预定的定时从连接的第一终端装置获取信息并存储。 在接收到请求时，第二叠加装置使用叠加在经由该路径发送的发送信号上的叠加信号将该请求发送给第一叠加装置。 在接收到请求时，第一叠加装置使用叠加信号将信息发送到第二叠加装置。 在接收到该信息时，第二重叠装置向第二终端装置提供信息。

    Distributed processing device, and storage medium storing distributed processing program
    6.
    发明授权
    Distributed processing device, and storage medium storing distributed processing program 有权
    分布式处理设备和存储分布式处理程序的存储介质

    公开(公告)号：US08447727B2

    公开(公告)日：2013-05-21

    申请号：US13075729

    申请日：2011-03-30

    申请人： Ken Takahashi

    发明人： Ken Takahashi

    IPC分类号： G06F17/30

    CPC分类号： G06Q10/06

    摘要： A distributed processing device includes receiving unit receives a plurality of process requests to records stored on a database, an acquiring unit acquires execution frequency of each processes responsive to the plurality of process requests related to a record identified by an attribute name, on a per attribute name basis of a plurality of attribute names, each attribute name identifying each of the plurality of records, sorting unit sorts the plurality of process requests into a first set and a second set in accordance with the acquired execution frequency of each process on each of the plurality of attribute names, a determining unit determines a first node, serving as an allocation destination of the process request sorted in the first set, from among a plurality of nodes, each node having the database, and an allocating unit allocates the process request sorted in the first set to the first node.

    摘要翻译： 一种分布式处理装置，包括接收单元，接收对数据库中存储的记录的多个处理请求，获取单元响应于与由属性名称识别的记录有关的多个处理请求，针对每个属性获取每个进程的执行频率 多个属性名称的名称基础，每个属性名称标识多个记录中的每一个，排序单元根据所获取的每个进程的执行频率，将多个处理请求分类为第一集合和第二集合 多个属性名称，确定单元从多个节点中确定用作第一组中排序的处理请求的分配目的地的第一节点，每个节点具有数据库，并且分配单元分配处理请求分类 在第一个设置到第一个节点。

    Methods of processing a substrate and forming a micromagnetic device
    8.
    发明授权
    Methods of processing a substrate and forming a micromagnetic device 有权
    处理基板并形成微磁装置的方法

    公开(公告)号：US08288277B2

    公开(公告)日：2012-10-16

    申请号：US13108423

    申请日：2011-05-16

    申请人： Ken Takahashi ,  Trifon M. Liakopoulos

    发明人： Ken Takahashi ,  Trifon M. Liakopoulos

    IPC分类号： H01L21/44

    CPC分类号： H01F41/046 ,  H01F3/14 ,  H01F17/0033 ,  H01F41/34 ,  H05K1/0306 ,  H05K3/0011 ,  H05K3/108 ,  H05K2203/1121 ,  Y10S438/909

    摘要： A method of processing a substrate with a conductive film formed thereover and method of forming a micromagnetic device. In one embodiment, the method of processing the substrate includes reducing a temperature of the substrate to a stress-compensating temperature, and maintaining the temperature of the substrate at the stress-compensating temperature for a period of time. The method also includes increasing the temperature of the substrate above the stress-compensating temperature.

    摘要翻译： 一种用其上形成的导电膜处理衬底的方法和形成微磁性器件的方法。 在一个实施例中，处理衬底的方法包括将衬底的温度降低到应力补偿温度，并将衬底的温度保持在应力补偿温度一段时间。 该方法还包括将基板的温度升高到应力补偿温度以上。