公开(公告)号：US6163072A

公开(公告)日：2000-12-19

申请号：US115834

申请日：1998-07-15

申请人： Nobuyoshi Tatoh

发明人： Nobuyoshi Tatoh

IPC分类号： H05K9/00 ,  H01L23/02 ,  H01L23/04 ,  H01L23/66 ,  H01L23/12

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/1616 ,  H01L2924/3011 ,  H01L2924/00

摘要： A package storing semiconductor devices and circuit boards with a cap having a plurality of conductive protrusions whose intervals are shorter than or equal to {c/(2v .epsilon..sup.1/2)}, where c is the light velocity, v is the maximum frequency of signals, and .epsilon. is the dielectric constant of the circuit boards. The protrusions attenuate the transmission of electromagnetic waves to reduce noise, cross-talk, parasitic oscillations, etc.

摘要翻译： 一种存储具有盖的半导体器件和电路板的封装，其具有多个导电突起，其间隔小于或等于{c /（2vε+ E，fra 1/2 + EE）}}，其中c是光速， v是信号的最大频率，ε是电路板的介电常数。 突起衰减电磁波的传播，以减少噪声，串扰，寄生振荡等。

公开(公告)号：US06759599B2

公开(公告)日：2004-07-06

申请号：US10187379

申请日：2002-07-02

申请人： Nobuyoshi Tatoh ,  Jun Yorita

发明人： Nobuyoshi Tatoh ,  Jun Yorita

IPC分类号： H05K111

CPC分类号： H05K3/108 ,  H01L21/4846 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49866 ,  H01L2224/11831 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/062 ,  H05K3/388 ,  H05K2201/098 ,  H05K2203/0597 ,  H05K2203/1184 ,  Y10T29/4913 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2224/45099

摘要： A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.

摘要翻译： 一种电路板，包括在陶瓷基板上以图案形成的第一金属层，在第一金属层上以图案形成的第二金属层，以及形成为覆盖第二金属层的顶表面的第三金属层， 表面，其中未被第三金属层覆盖的第一和第二金属层的宽度通过蚀刻而减小。 电路板具有精细且高分辨率的布线图案，并且可以通过在其上安装至少一个高输出半导体元件来实现微型高性能高输出模块。

公开(公告)号：US06588948B2

公开(公告)日：2003-07-08

申请号：US09943008

申请日：2001-08-31

申请人： Nobuyoshi Tatoh ,  Hiromi Iwamoto ,  Takaaki Hirose

发明人： Nobuyoshi Tatoh ,  Hiromi Iwamoto ,  Takaaki Hirose

IPC分类号： G02B636

CPC分类号： G02B6/4216 ,  G02B1/02 ,  G02B5/3083 ,  G02B6/4204 ,  H01S5/0078 ,  H01S5/0222 ,  H01S5/02296

摘要： An optical module has a housing, and a junction having a light transmissive window structure, which is fixed to the housing, and which utilizes a sapphire plate. The following expressions (1) through (4) are established between an angle &phgr; formed by the C axis of the sapphire, and the plane of polarization of light, and an angle &thgr; formed by the C axis of the sapphire and the optical axis. &ohgr; is the principal refractive index of sapphire, &egr; is the secondary refractive index, &lgr; is the wavelength of transmitted light, and d is the thickness of the window plate. n=&ohgr;&egr;/{square root over ((&ohgr;2cos2&thgr;+&egr;2sin 2&thgr;))}  (1) &dgr;=2&pgr;d(&ohgr;−n)/&lgr;  (2) tan ⁢   ⁢ β = ( sin 2 ⁢ 2 ⁢   ⁢ ψ ⁢   ⁢ sin 2 ⁢   ⁢ δ + 1 ) - 1 sin ⁢   ⁢ 2 ⁢   ⁢ ψ ⁢   ⁢ sin ⁢   ⁢ δ ( 3 )  −30≧+20log(tan&bgr;)  (4)

摘要翻译： 光学模块具有壳体和具有透光窗结构的接合部，该接合部固定在壳体上，并且利用蓝宝石板。 由蓝宝石的C轴和光的偏振面形成的角度φ和由蓝宝石的C轴和光轴形成的角度θ之间建立以下表达式（1）至（4）。 omega是蓝宝石的主要折射率，epsi是次级折射率，lambd是透射光的波长，d是窗板的厚度。

公开(公告)号：US06875918B2

公开(公告)日：2005-04-05

申请号：US10731117

申请日：2003-12-10

申请人： Hiroshi Sudo ,  Nobuyoshi Tatoh

发明人： Hiroshi Sudo ,  Nobuyoshi Tatoh

IPC分类号： F16L33/00 ,  F16L33/28 ,  H02G3/04 ,  H02G3/06 ,  H02G3/30

CPC分类号： H02G3/0468 ,  H02G3/06

摘要： A grip portion is formed by a pair of half-split grip portions and grips an end portion of a tubular cable cover exteriorly mounted on a cable when the half-split grip portions are joined. A clamp portion is formed by a pair of half-split clamp portions and clamps the cable exposed from the end portion when the half-split clamp portions are joined. A clamp protrusion is formed on an inner surface of the clamp portion and clamps the cable exposed from the end portion by pressing the cable in a radial direction.

摘要翻译： 握把部分由一对半分开的把手部分形成，并且当半分离把手部分接合时，把手部分被夹在外部安装在电缆上的管状电缆盖的端部。 夹紧部分由一对半分割夹紧部分形成，并且当半切割夹紧部分接合时，夹持从端部露出的电缆。 在夹紧部的内表面上形成夹紧突起，并通过沿径向按压电缆来夹持从端部露出的电缆。

公开(公告)号：US06614590B2

公开(公告)日：2003-09-02

申请号：US09986579

申请日：2001-11-09

申请人： Nobuyoshi Tatoh

发明人： Nobuyoshi Tatoh

IPC分类号： H01S300

CPC分类号： G02B6/4201 ,  G02B6/4251 ,  G02B6/4256 ,  G02B6/4271 ,  G02B6/428 ,  H01L2924/0002 ,  H01S3/06704 ,  H01S3/06754 ,  H01S5/02216 ,  H01S5/0222 ,  H01L2924/00

摘要： An optical semiconductor hermetic sealing package for accommodating an optical semiconductor element therein, comprising: a frame made of a metal, an insulator, or a composite of metal and insulator; a first bottom plate made of a metal fixed to the frame; a second bottom plate whose Young's modulus is larger than that of the first bottom plate and which is fixed to the surface of the first bottom plate on the opposite side to the frame; and a metal block plate that is fixed to the surface of flanges projecting on both sides of the first bottom plate, on the side of the second bottom plate. The optical semiconductor hermetic sealing package is capable of alleviating warping of the bottom plate and has an even more excellent heat radiating characteristic.

摘要翻译： 一种用于在其中容纳光学半导体元件的光学半导体密封封装，包括：由金属，绝缘体或金属和绝缘体的复合材料制成的框架; 由固定在框架上的金属制成的第一底板; 第二底板的杨氏模量大于第一底板的杨氏模量，并且固定到与框架相反的一侧的第一底板的表面; 以及金属块板，其固定到在第一底板的两侧突出的凸缘的表面，在第二底板的一侧。 光学半导体密封封装能够减轻底板的翘曲，并且具有甚至更优异的散热特性。

公开(公告)号：US06506624B2

公开(公告)日：2003-01-14

申请号：US09945809

申请日：2001-09-05

申请人： Nobuyoshi Tatoh ,  Shinya Nishina

发明人： Nobuyoshi Tatoh ,  Shinya Nishina

IPC分类号： H01L2150

CPC分类号： H01S5/02415 ,  H01L2924/0002 ,  H01S5/02216 ,  H01S5/02284 ,  H01L2924/00

摘要： A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical semiconductor element on the electronic cooling element, wherein the electronic cooling element is soldered to the bottom plate of the optical semiconductor package in a hydrogen atmosphere. The soldering in a hydrogen atmosphere prevents oxidation of a low temperature solder provided on the uppermost surfaces of the electronic cooling element and conduction of the heat at the soldered joint portion between the electronic cooling element and the optical semiconductor element is improved.

公开(公告)号：US06345917B2

公开(公告)日：2002-02-12

申请号：US09756763

申请日：2001-01-10

申请人： Nobuyoshi Tatoh

发明人： Nobuyoshi Tatoh

IPC分类号： G02B636

CPC分类号： H01S5/02216 ,  H01L31/0203 ,  H01L31/024 ,  H01S5/024

摘要： A hermetically sealed optical-semiconductor container in which an optical-semiconductor element is accommodated, comprising a frame 1 made of a metal, an insulating material or a composite material of a metal and an insulating material, a first bottom plate 11 fixed to the frame, and a second bottom plate 12 fixed to opposite surface of the first bottom plate to the frame, either of the first and second bottom plates being made of a metal and having a smaller Young's modulus than the other. For example, the first bottom plate 11 is not less than 25×103 kg/mm2 in Young's modulus, and the second bottom plate 12 is not greater than 15×103 kg/mm2. An optical-semiconductor element, an electronic cooling device and the like are mounted in this container, thus producing an optical-semiconductor module free from degradation of an electronic cooling element nor deviation of an optical axis occurs.

摘要翻译： 一种容纳光半导体元件的气密密封光学半导体容器，包括由金属制成的框架1，绝缘材料或金属和绝缘材料的复合材料，固定到框架的第一底板11 以及固定在第一底板相对于框架的相对表面上的第二底板12，第一和第二底板中的任一个由金属制成，并且具有比另一底板更小的杨氏模量。 例如，第一底板11的杨氏模量不小于25×10 3 kg / mm 2，第二底板12不大于15×10 3 kg / mm 2。 光学半导体元件，电子冷却装置等安装在该容器中，由此产生不会降低电子冷却元件的光学半导体模块，也不发生光轴的偏离。

公开(公告)号：US06855566B2

公开(公告)日：2005-02-15

申请号：US10381460

申请日：2002-04-06

申请人： Nobuyoshi Tatoh ,  Daisuke Takagi ,  Shinya Nishina

发明人： Nobuyoshi Tatoh ,  Daisuke Takagi ,  Shinya Nishina

IPC分类号： H01L23/38 ,  H01L35/32 ,  H01S5/022 ,  H01S5/024 ,  H01L21/00

CPC分类号： H01S5/02415 ,  H01L23/38 ,  H01L35/32 ,  H01L2924/0002 ,  H01S5/02208 ,  H01L2924/00

摘要： An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A package 11 includes two or more units of electronic cooling element 16 mounted therein. Each unit of the electronic cooling element is inserted through the space between inner juts 14a of ceramic feedthrough of the package 11 and a bottom plate 13, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the package 11 occupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.

摘要翻译： 即使封装的底板的面积相同，也可以设置具有大的吸热量的电子冷却元件的光学半导体模块。 包装11包括安装在其中的两个或更多个电子冷却元件16。 电子冷却元件的每个单元通过包装11的陶瓷馈通件的内凸起14a和底板13之间的空间插入并固定到底板。 多个单元的电子冷却元件通过一个或多个铜片串联连接。 电子冷却元件的两个或多个单元与封装11的底板区域之间的接合面积占底板面积的75％以上。 因此，可以增加底板和电子冷却元件之间的整体面积与封装底板的面积的比率。

公开(公告)号：US06674143B2

公开(公告)日：2004-01-06

申请号：US10093734

申请日：2002-03-11

申请人： Nobuyoshi Tatoh ,  Kenichiro Shibata

发明人： Nobuyoshi Tatoh ,  Kenichiro Shibata

IPC分类号： H01L310203

CPC分类号： H01L31/0203 ,  G02B6/4207 ,  G02B6/4216 ,  H01L33/483

摘要： A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the package bottom plate and which is joined to a cylindrical component on the package side wall by the use of a solder brazing material, in which the window material is made of a light-transmitting ceramic (such as alumina or spinel) plate in a substantially regular hexagonal or disk form in which a metallized portion is formed around the periphery, leaving a circular light transmitting portion in the center of the plate; and an optical semiconductor module that makes use of the package. The hermetically sealing package and the optical semiconductor module are easy and inexpensive to manufacture, have high reliability, and do not deform the plane of polarization.

摘要翻译： 一种用于光学半导体的密封封装，其配备有透光窗，其透光表面与封装底板的垂直线倾斜至少六度，并且通过使用 焊料钎焊材料，其中窗材料由基本上规则的六边形或圆盘形状的透光陶瓷（例如氧化铝或尖晶石）板制成，其中在周围形成金属化部分，留下圆形透光 板的中心部分; 以及利用该封装件的光学半导体模块。 密封封装和光学半导体模块制造容易且便宜，具有高可靠性，并且不会使极化面变形。

公开(公告)号：US06220765B1

公开(公告)日：2001-04-24

申请号：US09137152

申请日：1998-08-20

申请人： Nobuyoshi Tatoh

发明人： Nobuyoshi Tatoh

IPC分类号： G02B636

CPC分类号： H01S5/02216 ,  H01L31/0203 ,  H01L31/024 ,  H01S5/024

摘要： A hermetically sealed optical-semiconductor container in which an optical-semiconductor element is accommodated, comprising a frame 1 made of a metal, an insulating material or a composite material of a metal and an insulating material, a first bottom plate 11 fixed to the frame, and a second bottom plate 12 fixed to opposite surface of the first bottom plate to the frame, either of the first and second bottom plates being made of a metal and having a smaller Young's modulus than the other. For example, the first bottom plate 11 is not less than 25×103 kg/mm2 in Young's modulus, and the second bottom plate 12 is not greater than 15×103 kg/mm2. An optical-semiconductor element, an electronic cooling device and the like are mounted in this container, thus producing an optical-semiconductor module free from degradation of an electronic cooling element nor deviation of an optical axis occurs.

摘要翻译： 一种容纳光半导体元件的气密密封光学半导体容器，包括由金属制成的框架1，绝缘材料或金属和绝缘材料的复合材料，固定到框架的第一底板11 以及第一底板12，其固定到第一底板的相对表面与框架，第一和第二底板中的任一个由金属制成，并且具有比另一个更小的杨氏模量。 例如，第一底板11的杨氏模量不小于25×10 3 kg / mm 2，第二底板12不大于15×10 3 kg / mm 2。 光学半导体元件，电子冷却装置等安装在该容器中，由此产生不会降低电子冷却元件的光学半导体模块，也不发生光轴的偏离。