公开(公告)号：US20140126050A1

公开(公告)日：2014-05-08

申请号：US14118514

申请日：2012-05-17

申请人： Michiko Takushima ,  Tomomi Sano ,  Jun Yorita ,  Masaya Nishi

发明人： Michiko Takushima ,  Tomomi Sano ,  Jun Yorita ,  Masaya Nishi

IPC分类号： G02B27/22 ,  G02B3/00

CPC分类号： G02B27/2214 ,  G02B3/0037 ,  G03B35/24 ,  H04N13/305

摘要： A lens component 10 comprises K unit lenses 11, each extending in the X direction and having a common structure, arranged in parallel at a minimum period PL in the Y direction. Each unit lens 11 includes two partial lenses 121, 122 sectioned within the minimum period PL in the Y direction and a flat part 13 disposed between the partial lenses 121, 122. The partial lenses 121, 122 have respective optical axes different from each other but parallel to the Z direction and form images of a common point on an object surface onto an image surface A at respective positions different from each other.

摘要翻译： 透镜部件10包括K个单元透镜11，每个单元透镜在X方向上延伸并且具有共同的结构，在Y方向上以最小周期PL平行布置。 每个单位透镜11包括在Y方向上在最小周期PL内分割的两个部分透镜121,122以及设置在部分透镜121,122之间的平坦部13.部分透镜121,122具有彼此不同的各自的光轴，但是 平行于Z方向，并将物体表面上的公共点的图像形成到彼此不同的各个位置处的图像表面A.

公开(公告)号：US20050088192A1

公开(公告)日：2005-04-28

申请号：US10972482

申请日：2004-10-26

申请人： Tsuyoshi Haga ,  Kousuke Miura ,  Jun Yorita

发明人： Tsuyoshi Haga ,  Kousuke Miura ,  Jun Yorita

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/067 ,  G01R3/00 ,  G01R31/02

CPC分类号： G01R1/06716 ,  G01R1/0466 ,  G01R1/06738 ,  G01R3/00

摘要： A method of manufacturing a columnar contact having a spiral spring structure for attaining electrical continuity with an electrode of electronic equipment or inspection equipment, the method comprising the steps of forming a plastic mold (resist structure) with a metal mold; forming a layer consisting of metallic material on the plastic mold (resist structure) by means of electroforming. With such method, an inspection contact or coupling contact having high reliability and capable of attaining electrical continuity of large electric current can be produced at low cost.

摘要翻译： 一种制造具有用于与电子设备或检查设备的电极实现电连续性的螺旋弹簧结构的柱状接触的方法，所述方法包括以下步骤：用金属模具形成塑料模具（抗蚀剂结构）; 通过电铸在塑料模具（抗蚀剂结构）上形成由金属材料构成的层。 通过这种方法，可以以低成本制造具有高可靠性并且能够实现大电流的电连续性的检查接触或耦合接触。

公开(公告)号：US06399878B2

公开(公告)日：2002-06-04

申请号：US09243450

申请日：1999-02-03

申请人： Mamoru Kondo ,  Ryosuke Hata ,  Hiroshi Takigawa ,  Jun Yorita ,  Takahiro Horikawa ,  Yuichi Ashibe ,  Morihiro Seki

发明人： Mamoru Kondo ,  Ryosuke Hata ,  Hiroshi Takigawa ,  Jun Yorita ,  Takahiro Horikawa ,  Yuichi Ashibe ,  Morihiro Seki

IPC分类号： H10B906

CPC分类号： H01B7/292 ,  H01B3/22 ,  H01B3/28 ,  H01B3/441 ,  H01B7/14 ,  H01B9/0611 ,  H01B9/0688

摘要： A cable and cable system is provided having a conductor and an insulation layer on an outer circumference of a conductor. The insulation layer is impregnated with a medium-viscosity insulating oil that has a viscosity of 10 centistokes (cst) to less than 500 cst at 60° C. The insulation layer includes an insulating tape that may be one or a combination of composite tape having a polyolefin resin film laminated with a kraft paper on both its sides and an insulating tape including a polyolefin resin film. The cable includes a metal sheath provided on an outer circumference of the insulation layer, and a reinforcing layer formed on an outer circumference of the metal sheath. The reinforcing layer reinforces the metal sheath by absorbing hoop stress exerted on the metal sheath. The cable system includes a submarine-portion cable and a land-portion cable, an oil stop joint box, and an oil feeding tank. The oil stop joint box connects the submarine-portion cable to the land-portion cable, and the oil feeding tank is connected to the land-portion cable which feeds the medium-viscosity insulating oil to the land-portion cable.

摘要翻译： 提供一种电缆和电缆系统，其在导体的外圆周上具有导体和绝缘层。 绝缘层用在60℃下粘度为10厘沲（cst）至小于500cst的中等粘度绝缘油浸渍。绝缘层包括绝缘带，其可以是具有 在其两侧用牛皮纸层叠的聚烯烃树脂膜和包含聚烯烃树脂膜的绝缘带。 电缆包括设置在绝缘层的外周上的金属护套和形成在金属护套的外周上的加强层。 增强层通过吸收施加在金属护套上的环向应力来加强金属护套。 电缆系统包括海底部分电缆和陆部电缆，止油接头盒和给油槽。 油停止接头盒将海底部分电缆连接到陆部电缆，供油槽连接到将中等粘度的绝缘油供给到陆部电缆的陆部电缆。

公开(公告)号：US06207261B1

公开(公告)日：2001-03-27

申请号：US08972197

申请日：1997-11-18

申请人： Hidemitsu Kuwabara ,  Katsuhiko Katayama ,  Toru Tsujioka ,  Ryosuke Hata ,  Hiroshi Takigawa ,  Jun Yorita

发明人： Hidemitsu Kuwabara ,  Katsuhiko Katayama ,  Toru Tsujioka ,  Ryosuke Hata ,  Hiroshi Takigawa ,  Jun Yorita

IPC分类号： B32B702

CPC分类号： H01B7/0225 ,  H01B3/54 ,  Y10T428/2495 ,  Y10T428/2936 ,  Y10T428/294 ,  Y10T428/31902

摘要： Disclosed is an electrical insulating laminated paper prepared by a process which comprises the steps of melt-extruding a polyolefin resin as a binder onto one or two sheets of a kraft insulating paper by means of a extruder to obtain a laminated paper, and calendering or supercalendering the laminated paper so that the total thickness thereof is from 30 to 200 &mgr;m and the proportion of a polymer comprising the polyolefin resin is from 40 to 90%. The laminated paper is excellent in dielectric properties, dielectric strength, and mechanical properties such as adhesive strength.

摘要翻译： 公开了一种通过以下方法制备的电绝缘层压纸，该方法包括通过挤出机将聚烯烃树脂作为粘合剂熔融挤出到一片或两片硫酸盐绝缘纸上以获得层压纸，并且压延或超级砑光 层叠纸，使其总厚度为30〜200μm，由聚烯烃树脂构成的聚合物的比例为40〜90％。 该层压纸的介电性，介电强度和机械性能如粘合强度优异。

公开(公告)号：US07390442B2

公开(公告)日：2008-06-24

申请号：US10506425

申请日：2003-03-03

申请人： Hideki Kashihara ,  Masamichi Yamamoto ,  Jun Yorita ,  Hideaki Toshioka ,  Misako Osoegawa ,  Keiji Koyama ,  Masatoshi Majima ,  Yoshie Tani

发明人： Hideki Kashihara ,  Masamichi Yamamoto ,  Jun Yorita ,  Hideaki Toshioka ,  Misako Osoegawa ,  Keiji Koyama ,  Masatoshi Majima ,  Yoshie Tani

IPC分类号： H01B1/02 ,  H01B1/22

CPC分类号： H01R4/04 ,  G01R1/06755 ,  G01R1/073 ,  G01R3/00 ,  H01R43/007 ,  Y10T428/25 ,  Y10T428/258 ,  Y10T428/31678

摘要： An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

摘要翻译： 各向异性导电膜及其制造方法，特别适用于安装半导体封装，并且充分满足更高密度安装的要求，因为即使电极的间距小或适当，也不会在膜的平面方向上发生短路 为了安装接触式探头，因为能够以更低的压力确保导电连接不会与高电流并联，甚至可以处理高频信号。 各向异性导电膜含有金属粉末，其具有许多细金属颗粒作为导电组分连接的形状，其中金属粉末链的长度设定为不超过当半导体封装为半导体封装时导电地接合的相邻电极之间的距离 当安装接触探针时，链条的直径设定在1mum-20mum的范围内。 在由具有磁场的顺磁金属形成的链定向的同时形成膜的至少一部分。

公开(公告)号：US07220370B2

公开(公告)日：2007-05-22

申请号：US10487345

申请日：2002-08-21

申请人： Jun Yorita ,  Shinji Inazawa ,  Masatoshi Majima ,  Hideki Kashihara ,  Toshihiro Sakamoto ,  Hideaki Toshioka

发明人： Jun Yorita ,  Shinji Inazawa ,  Masatoshi Majima ,  Hideki Kashihara ,  Toshihiro Sakamoto ,  Hideaki Toshioka

IPC分类号： H01B1/00 ,  H01B1/02 ,  H01B1/12 ,  B05D5/12 ,  B05D7/00

CPC分类号： H05K3/205 ,  C25D1/08 ,  C25D1/10 ,  C25D5/022 ,  H01L21/283 ,  H01L21/2885 ,  H05K3/202 ,  H05K3/323 ,  H05K2201/035

摘要： A method of producing a fine metal component where a plated coating is deposited on a conductive film exposed at fine through-hole pattern portions in a mold to produce a fine metal component, wherein the conductive film is made using a conductive paste comprised of a metal powder in which the metal particles are magnetically linked together in a chain shape.

摘要翻译： 一种制造精细金属成分的方法，其中镀在镀膜上的导电膜上沉积在模具中的细通孔图案部分上以形成细金属成分，其中导电膜由金属 金属颗粒以链状磁性连接在一起的粉末。

公开(公告)号：US07105281B2

公开(公告)日：2006-09-12

申请号：US10492918

申请日：2002-10-25

申请人： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

发明人： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

IPC分类号： G03F7/039

CPC分类号： B81C99/0085 ,  B81C2201/032 ,  C25D1/003 ,  H01L21/4821 ,  H05K3/202 ,  H05K3/205

摘要： A method of manufacturing a metal microstructure by using a resin mold. In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold can be set and the high-precision metal microstructure can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure according to the present invention includes the steps of: fixing on a conductive substrate the resin mold having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure having the resin mold; exposing the layered structure having the resin mold to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer existing at the vacant portion of the resin mold; and filling with a metal the vacant portion of the layered structure having the resin mold by electroforming.

摘要翻译： 通过使用树脂模具制造金属微结构的方法。 为了提供一种可以设定对树脂模具造成较小损害的温和制造条件并且通过均匀电铸可以大量生产高精度金属微结构的方法，根据本发明的金属组织的制造方法 本发明包括以下步骤：通过插入具有由电子束，紫外线或可见光辐照的化学组成改变的光敏聚合物，将具有穿透厚度方向的空白部分的树脂模具固定在导电基板上，以形成 具有树脂模具的层状结构; 将具有树脂模具的层状结构暴露于电子束，紫外线辐射或可见光辐射; 去除存在于树脂模具的空缺部分的曝光的光敏聚合物; 并通过电铸将金属填充到具有树脂模具的层状结构的空
间部分。

公开(公告)号：US20050106382A1

公开(公告)日：2005-05-19

申请号：US10506425

申请日：2003-03-03

申请人： Hideaki Kashihara ,  Masamichi Yamamoto ,  Jun Yorita ,  Hideaki Toshioka ,  Misako Osoegawa ,  Keiji Koyama ,  Masatoshi Majima ,  Yoshie Tani

发明人： Hideaki Kashihara ,  Masamichi Yamamoto ,  Jun Yorita ,  Hideaki Toshioka ,  Misako Osoegawa ,  Keiji Koyama ,  Masatoshi Majima ,  Yoshie Tani

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32 ,  B32B15/04

CPC分类号： H01R4/04 ,  G01R1/06755 ,  G01R1/073 ,  G01R3/00 ,  H01R43/007 ,  Y10T428/25 ,  Y10T428/258 ,  Y10T428/31678

摘要： An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

摘要翻译： 各向异性导电膜及其制造方法，特别适用于安装半导体封装，并且充分满足更高密度安装的要求，因为即使电极的间距小或适当，也不会在膜的平面方向上发生短路 为了安装接触式探头，因为能够以更低的压力确保导电连接不会与高电流并联，甚至可以处理高频信号。 各向异性导电膜含有金属粉末，其具有许多细金属颗粒作为导电组分连接的形状，其中金属粉末链的长度设定为不超过当半导体封装为半导体封装时导电地接合的相邻电极之间的距离 当安装接触探针时，链条的直径设定在1mum-20mum的范围内。 在由具有磁场的顺磁金属形成的链定向的同时形成膜的至少一部分。

公开(公告)号：US06759599B2

公开(公告)日：2004-07-06

申请号：US10187379

申请日：2002-07-02

申请人： Nobuyoshi Tatoh ,  Jun Yorita

发明人： Nobuyoshi Tatoh ,  Jun Yorita

IPC分类号： H05K111

CPC分类号： H05K3/108 ,  H01L21/4846 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49866 ,  H01L2224/11831 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/062 ,  H05K3/388 ,  H05K2201/098 ,  H05K2203/0597 ,  H05K2203/1184 ,  Y10T29/4913 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2224/45099

摘要： A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.

摘要翻译： 一种电路板，包括在陶瓷基板上以图案形成的第一金属层，在第一金属层上以图案形成的第二金属层，以及形成为覆盖第二金属层的顶表面的第三金属层， 表面，其中未被第三金属层覆盖的第一和第二金属层的宽度通过蚀刻而减小。 电路板具有精细且高分辨率的布线图案，并且可以通过在其上安装至少一个高输出半导体元件来实现微型高性能高输出模块。

公开(公告)号：US07713052B2

公开(公告)日：2010-05-11

申请号：US11885079

申请日：2006-02-21

申请人： Jun Yorita ,  Katsunari Mikage

发明人： Jun Yorita ,  Katsunari Mikage

IPC分类号： B29C51/42 ,  B29C59/00

CPC分类号： B81C1/0046 ,  B29C33/02 ,  B29C33/306 ,  B29C35/02 ,  B29C35/16 ,  B29C43/021 ,  B29C43/04 ,  B29C43/52 ,  B29C59/02 ,  B29C2043/025 ,  B29C2043/046 ,  B29C2059/023 ,  B81B2201/058

摘要： In a processing method of a fine structure according to the present invention, an opposed platen (211) is moved from a retreat position to a molding/processing position, so that a film (1) is pressed against a mold (5) and processed. Thereafter a second block (211b) is separated from a first block (211a). Thus, improvement of the cooling rate for the opposed platen (211) can be attained by reducing the total thermal capacity of the opposed platen (211) by reducing the volume of the opposed platen (211) in cooling and physically discharging heat stored in the opposed platen (211). Thus, cooling efficiency for the opposed platen (211) is improved, and the heat cycle of the opposed platen (211) can be reduced.

摘要翻译： 在根据本发明的精细结构的处理方法中，相对的压板（211）从退避位置移动到模制/加工位置，使得膜（1）被压靠在模具（5）上并被加工 。 此后，第二块（211b）与第一块（211a）分离。 因此，相对的压板（211）的冷却速度的提高可以通过减少对置的压板（211）在冷却中的体积减少相对的压板（211）的总热容量并物理地放出存储在该压板 相对的压板（211）。 因此，相对的压板（211）的冷却效率提高，并且可以减小相对的压板（211）的热循环。