公开(公告)号：US06548832B1

公开(公告)日：2003-04-15

申请号：US09536921

申请日：2000-03-28

申请人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

IPC分类号： H01L3300

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. When a circuit is configured in one region of a hybrid integrated circuit substrate, a position recognition mark 53 and a flow stop 57 are disposed in the open region. Also the region is covered with Ni so as to function as reflecting means.

摘要翻译： 在其中发光元件附着在印刷电路板上的光照射装置中，散热性能得到提高，并且实现了发光效率的提高和尺寸和重量的降低。 在金属基板11上形成覆盖有Ni的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。当在混合集成电路基板的一个区域中配置电路时，将位置识别标记53和流动停止器57设置在 开放区域。 此外，该区域被Ni覆盖，以起到反射装置的作用。

公开(公告)号：US06489637B1

公开(公告)日：2002-12-03

申请号：US09536730

申请日：2000-03-28

申请人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

IPC分类号： H01L3300

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. Flow-stopping means 36 made of a brazing material is formed around each of the light emitting diodes 10. Also the surface of the brazing material is used as a reflecting surface.

摘要翻译： 在其中发光元件附着在印刷电路板上的光照射装置中，散热性能得到提高，并且实现了发光效率的提高和尺寸和重量的降低。 在金属基板11上形成覆盖有Ni的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。在每个发光二极管10周围形成由钎焊材料制成的阻流装置36.此外，钎焊材料的表面 用作反射面。

公开(公告)号：US3938001A

公开(公告)日：1976-02-10

申请号：US445955

申请日：1974-02-26

申请人： Susumu Ota ,  Ryuzo Aihara

发明人： Susumu Ota ,  Ryuzo Aihara

IPC分类号： H01J37/073 ,  H01J37/24 ,  H01J37/248 ,  H01J29/70

CPC分类号： H01J37/241 ,  H01J37/073 ,  H01J37/248

摘要： An electron gun comprising a changeover chamber and changeover circuit between the gun chamber and the insulated cable which connects the power supply circuits to the electrodes which enables adjustment of electrode potentials to accomplish electrode treatment without excessive gun currents.

摘要翻译： 一种电子枪，包括转换室和枪室和绝缘电缆之间的转换电路，其将电源电路连接到电极，其能够调节电极电位以在没有过多的枪电流的情况下实现电极处理。