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公开(公告)号:US20220148875A1
公开(公告)日:2022-05-12
申请号:US17586505
申请日:2022-01-27
发明人: Bhadri N. VARADARAJAN , Bo GONG , Zhe GUI
IPC分类号: H01L21/02 , C23C16/505 , C23C16/511 , C23C16/32 , C23C16/452 , H01L29/49 , H01L21/768 , C23C16/04
摘要: Disclosed are methods and systems for providing silicon carbide films. A layer of silicon carbide can be provided under process conditions that employ one or more silicon-containing precursors that have one or more silicon-hydrogen bonds and/or silicon-silicon bonds. The silicon-containing precursors may also have one or more silicon-oxygen bonds and/or silicon-carbon bonds. One or more radical species in a substantially low energy state can react with the silicon-containing precursors to form the silicon carbide film. The one or more radical species can be formed in a remote plasma source.
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公开(公告)号:US20240145234A1
公开(公告)日:2024-05-02
申请号:US18539977
申请日:2023-12-14
发明人: Bhadri N. VARADARAJAN , Bo GONG , Zhe GUI
IPC分类号: H01L21/02 , C23C16/04 , C23C16/32 , C23C16/452 , C23C16/505 , C23C16/511 , H01L21/768 , H01L29/49
CPC分类号: H01L21/02167 , C23C16/045 , C23C16/325 , C23C16/452 , C23C16/505 , C23C16/511 , H01L21/02126 , H01L21/02211 , H01L21/02216 , H01L21/02222 , H01L21/02274 , H01L21/76831 , H01L21/76834 , H01L29/4983 , H01L29/4991 , H01L21/7682 , H01L2221/1047
摘要: Disclosed are methods and systems for providing silicon carbide films. A layer of silicon carbide can be provided under process conditions that employ one or more silicon-containing precursors that have one or more silicon-hydrogen bonds and/or silicon-silicon bonds. The silicon-containing precursors may also have one or more silicon-oxygen bonds and/or silicon-carbon bonds. One or more radical species in a substantially low energy state can react with the silicon-containing precursors to form the silicon carbide film. The one or more radical species can be formed in a remote plasma source.
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