公开(公告)号：US20160222541A1

公开(公告)日：2016-08-04

申请号：US15093435

申请日：2016-04-07

申请人： Novellus Systems, Inc.

发明人： Jingbin Feng ,  R. Marshall Stowell ,  Shantinath Ghongadi ,  Zhian He ,  Frederick Dean Wilmot

IPC分类号： C25D21/12 ,  H01L21/288 ,  C25D7/12

CPC分类号： C25D17/12 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D17/10 ,  C25D21/12 ,  H01L21/2885

摘要： Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

公开(公告)号：US09677188B2

公开(公告)日：2017-06-13

申请号：US14102239

申请日：2013-12-10

申请人： Novellus Systems, Inc.

发明人： R. Marshall Stowell ,  Jingbin Feng ,  David W. Porter

IPC分类号： C25D21/04 ,  C25D5/22 ,  C25D17/00 ,  C25D7/12 ,  C25D5/02 ,  C25D5/00 ,  C25D5/04 ,  C25D21/12 ,  C25D21/18 ,  C25D3/38

CPC分类号： C25D5/22 ,  C25D3/38 ,  C25D5/003 ,  C25D5/02 ,  C25D5/04 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  C25D21/12 ,  C25D21/18

摘要： The disclosed embodiments relate to methods and apparatus for immersing a substrate in electrolyte in an electroplating cell under sub-atmospheric conditions to reduce or eliminate the formation/trapping of bubbles as the substrate is immersed. Various electrolyte recirculation loops are disclosed to provide electrolyte to the plating cell. The recirculation loops may include pumps, degassers, sensors, valves, etc. The disclosed embodiments allow a substrate to be immersed quickly, greatly reducing the issues related to bubble formation and uneven plating times during electroplating.

公开(公告)号：US20140097088A1

公开(公告)日：2014-04-10

申请号：US14102239

申请日：2013-12-10

申请人： Novellus Systems, Inc.

发明人： R. Marshall Stowell ,  Jingbin Feng ,  David W. Porter

IPC分类号： C25D5/22 ,  C25D17/00

CPC分类号： C25D5/22 ,  C25D3/38 ,  C25D5/003 ,  C25D5/02 ,  C25D5/04 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  C25D21/12 ,  C25D21/18

摘要： The disclosed embodiments relate to methods and apparatus for immersing a substrate in electrolyte in an electroplating cell under sub-atmospheric conditions to reduce or eliminate the formation/trapping of bubbles as the substrate is immersed. Various electrolyte recirculation loops are disclosed to provide electrolyte to the plating cell. The recirculation loops may include pumps, degassers, sensors, valves, etc. The disclosed embodiments allow a substrate to be immersed quickly, greatly reducing the issues related to bubble formation and uneven plating times during electroplating.

摘要翻译： 所公开的实施方案涉及用于在亚低温大气条件下将基板浸入电镀池中的电解质中的方法和装置，以减少或消除基底浸入时气泡的形成/捕获。 公开了各种电解质循环回路以向电镀槽提供电解质。 再循环回路可以包括泵，脱气器，传感器，阀门等。所公开的实施例允许衬底被快速浸入，大大减少了与电镀期间的气泡形成和电镀时间不均有关的问题。

公开(公告)号：US10351968B2

公开(公告)日：2019-07-16

申请号：US15093435

申请日：2016-04-07

申请人： Novellus Systems, Inc.

发明人： Jingbin Feng ,  R. Marshall Stowell ,  Shantinath Ghongadi ,  Zhian He ,  Frederick Dean Wilmot

IPC分类号： C25D17/00 ,  C25D17/12 ,  C25D17/06 ,  C25D17/10 ,  C25D7/12 ,  H01L21/288 ,  C25D21/12

摘要： Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved. The consumable anode in one implementation has a plurality of through channels and at least one depression on its surface (e.g., a depression surrounding a channel) that is configured for registering with a protrusion on a component of an anode assembly, such as with a support plate. Fasteners may pass through the channels in the anode and attach it to a charge plate.

公开(公告)号：US09340893B2

公开(公告)日：2016-05-17

申请号：US14678686

申请日：2015-04-03

申请人： Novellus Systems, Inc.

发明人： Jingbin Feng ,  R. Marshall Stowell ,  Shantinath Ghongadi ,  Zhian He ,  Frederick Dean Wilmot

IPC分类号： C25D17/12 ,  C25D17/00 ,  C25D17/06 ,  C25D17/10 ,  C25D7/12

CPC分类号： C25D17/12 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D17/10 ,  C25D21/12 ,  H01L21/2885

摘要： Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

公开(公告)号：US20150211144A1

公开(公告)日：2015-07-30

申请号：US14678686

申请日：2015-04-03

申请人： Novellus Systems, Inc.

发明人： Jingbin Feng ,  R. Marshall Stowell ,  Shantinath Ghongadi ,  Zhian He ,  Frederick Dean Wilmot

IPC分类号： C25D17/12

CPC分类号： C25D17/12 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D17/10 ,  C25D21/12 ,  H01L21/2885

摘要： Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

摘要翻译： 描述了用于电镀的设备和方法。 本文描述的装置包括阳极支撑件，其包括定位机构，其在电镀期间保持晶片表面和可消耗阳极表面之间的一致的距离。 实现更均匀性的控制。