公开(公告)号：US10053792B2

公开(公告)日：2018-08-21

申请号：US14990573

申请日：2016-01-07

Applicant: NOVELLUS SYSTEMS, INC.

Inventor： Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

IPC: C25D17/06 ,  C25D17/00 ,  C25D17/12 ,  C25D7/12

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/007 ,  C25D17/12

Abstract: Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.

公开(公告)号：US20180030611A1

公开(公告)日：2018-02-01

申请号：US15730061

申请日：2017-10-11

Applicant: Novellus Systems, Inc.

Inventor： Tighe A. Spurlin ,  Charles Lorenzo Merrill ,  Ludan Huang ,  Matthew Sherman Thorum ,  Lee J. Brogan ,  James E. Duncan ,  Frederick Dean Wilmot ,  Robert Marshall Stowell ,  Steven T. Mayer ,  Haiying Fu ,  David W. Porter ,  Shantinath Ghongadi ,  Jonathan David Reid ,  Hyosang S. Lee ,  Mark J. Willey

IPC: C25D21/14 ,  C25D17/00 ,  C25D3/38 ,  C25D21/18 ,  C25D21/12

CPC classification number: C25D21/14 ,  C25D3/38 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25D21/18

Abstract: Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.

公开(公告)号：US20160222541A1

公开(公告)日：2016-08-04

申请号：US15093435

申请日：2016-04-07

Applicant: Novellus Systems, Inc.

Inventor： Jingbin Feng ,  R. Marshall Stowell ,  Shantinath Ghongadi ,  Zhian He ,  Frederick Dean Wilmot

IPC: C25D21/12 ,  H01L21/288 ,  C25D7/12

CPC classification number: C25D17/12 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D17/10 ,  C25D21/12 ,  H01L21/2885

Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

公开(公告)号：US20160115615A1

公开(公告)日：2016-04-28

申请号：US14990573

申请日：2016-01-07

Applicant: NOVELLUS SYSTEMS, INC.

Inventor： Zhian He ,  Jingbin Feng ,  Shantinath Ghongadi ,  Frederick D. Wilmot

IPC: C25D17/06 ,  C25D7/12 ,  C25D17/00

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/007 ,  C25D17/12

Abstract: Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.

公开(公告)号：US20150218726A1

公开(公告)日：2015-08-06

申请号：US14685526

申请日：2015-04-13

Applicant: Novellus Systems, Inc.

Inventor： Jingbin Feng ,  Robert Marshall Stowell ,  Shantinath Ghongadi ,  Ashwin Ramesh

IPC: C25D17/06 ,  C25D7/12

CPC classification number: C25D17/06 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  Y10T29/49778

Abstract: Disclosed are cup assemblies for holding, sealing, and providing electrical power to a semiconductor substrate during electroplating which may include a cup bottom element having a main body portion and a moment arm, an elastomeric sealing element disposed on the moment arm, and an electrical contact element disposed on the elastomeric sealing element. The main body portion may be such that it does not substantially flex when a substrate is pressed against the moment arm, and it may be rigidly affixed to another feature of the cup structure. The ratio of the average vertical thickness of the main body portion to that of the moment arm may be greater than about 5. The electrical contact element may have a substantially flat but flexible contact portion disposed upon a substantially horizontal portion of the sealing element. The elastomeric sealing element may be integrated with the cup bottom element during manufacturing.

Abstract translation: 公开了用于在电镀期间保持，密封和提供电力到电子元件的杯组件，其可以包括具有主体部分和力矩臂的杯底部元件，设置在力臂上的弹性体密封元件和电触点 元件设置在弹性密封元件上。 主体部分可以使得当基板被压靠在力矩臂上时基本不弯曲，并且其可以刚性地固定到杯结构的另一特征。 主体部分的平均垂直厚度与力臂的平均垂直厚度的比可以大于约5.电接触元件可以具有设置在密封元件的基本水平的部分上的基本平坦但柔性的接触部分。 弹性密封元件可以在制造过程中与杯底元件集成。

公开(公告)号：US10968531B2

公开(公告)日：2021-04-06

申请号：US15416448

申请日：2017-01-26

Applicant: Novellus Systems, Inc.

Inventor： Manish Ranjan ,  Shantinath Ghongadi ,  Frederick Dean Wilmot ,  Douglas Hill ,  Bryan L. Buckalew

IPC: C25D21/12 ,  C25D5/00 ,  C25D17/00 ,  H01L21/288 ,  C25D7/12 ,  C25D17/06 ,  G03F7/16 ,  G03F7/20 ,  H01L21/02 ,  H01L21/027 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.

公开(公告)号：US10351968B2

公开(公告)日：2019-07-16

申请号：US15093435

申请日：2016-04-07

Applicant: Novellus Systems, Inc.

Inventor： Jingbin Feng ,  R. Marshall Stowell ,  Shantinath Ghongadi ,  Zhian He ,  Frederick Dean Wilmot

IPC: C25D17/00 ,  C25D17/12 ,  C25D17/06 ,  C25D17/10 ,  C25D7/12 ,  H01L21/288 ,  C25D21/12

Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved. The consumable anode in one implementation has a plurality of through channels and at least one depression on its surface (e.g., a depression surrounding a channel) that is configured for registering with a protrusion on a component of an anode assembly, such as with a support plate. Fasteners may pass through the channels in the anode and attach it to a charge plate.

公开(公告)号：US09587322B2

公开(公告)日：2017-03-07

申请号：US14686479

申请日：2015-04-14

Applicant: Novellus Systems, Inc.

Inventor： Manish Ranjan ,  Shantinath Ghongadi ,  Frederick Dean Wilmot ,  Douglas Hill ,  Bryan L. Buckalew

IPC: C25D17/06 ,  C25D7/12 ,  C25D5/00 ,  C25D17/00 ,  H01L21/288

CPC classification number: C25D21/12 ,  C25D5/00 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  G03F7/16 ,  G03F7/20 ,  H01L21/0206 ,  H01L21/0273 ,  H01L21/2885 ,  H01L21/76802 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/5226 ,  H01L23/53228

Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.

Abstract translation: 本文描述的方法将晶片进入电解质，使得由于晶片和/或晶片保持器与电解质的初始冲击而引起的空气滞留减少，并且晶片以这样的方式移动，使得在浸渍期间保持电解质润湿波前 该晶片还使空气截留最小化。

公开(公告)号：US09340893B2

公开(公告)日：2016-05-17

申请号：US14678686

申请日：2015-04-03

Applicant: Novellus Systems, Inc.

Inventor： Jingbin Feng ,  R. Marshall Stowell ,  Shantinath Ghongadi ,  Zhian He ,  Frederick Dean Wilmot

IPC: C25D17/12 ,  C25D17/00 ,  C25D17/06 ,  C25D17/10 ,  C25D7/12

CPC classification number: C25D17/12 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D17/10 ,  C25D21/12 ,  H01L21/2885

Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

公开(公告)号：US20150218727A1

公开(公告)日：2015-08-06

申请号：US14686479

申请日：2015-04-14

Applicant: Novellus Systems, Inc.

Inventor： Manish Ranjan ,  Shantinath Ghongadi ,  Frederick Dean Wilmot ,  Douglas Hill ,  Bryan L. Buckalew

IPC: C25D17/06 ,  H01L21/288 ,  C25D7/12

CPC classification number: C25D21/12 ,  C25D5/00 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  G03F7/16 ,  G03F7/20 ,  H01L21/0206 ,  H01L21/0273 ,  H01L21/2885 ,  H01L21/76802 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/5226 ,  H01L23/53228

Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.

Abstract translation: 本文描述的方法将晶片进入电解质，使得由于晶片和/或晶片保持器与电解质的初始冲击而引起的空气滞留减少，并且晶片以这样的方式移动，使得在浸渍期间保持电解质润湿波前 该晶片还使空气截留最小化。