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公开(公告)号：US12132158B2
公开(公告)日：2024-10-29
申请号：US17432429
申请日：2020-02-13
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Richard Scheicher , Thomas Huettmayer , Ivar Tangring , Angela Eberhardt , Florian Peskoller
CPC classification number: H01L33/62 , H01L33/005 , H01L33/22 , H01L33/44 , H01L33/58 , H01L2933/0025 , H01L2933/0058 , H01L2933/0066
Abstract: In an embodiment an optoelectronic component includes a first joining partner including an LED chip with a structured light-emitting surface and a compensation layer applied to the light-emitting surface, wherein the compensation layer has a surface facing away from the light-emitting surface and spaced apart from the light-emitting surface, and wherein the surface forms a first connecting surface, a second joining partner having a second connecting surface, the first and second connecting surfaces being arranged such that they face each other and a bonding layer made of a film of low-melting glass having a layer thickness of not more than 1 μm, wherein the bonding layer bonds the first and second connecting surfaces together, wherein the structure of the light-emitting surface is embedded in the compensation layer, and wherein the first and second connecting surfaces are smooth such that their surface roughness, expressed as center-line roughness, is less than or equal to 50 nm.
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公开(公告)号：US20220077369A1
公开(公告)日：2022-03-10
申请号：US17432429
申请日：2020-02-13
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Richard Scheicher , Thomas Huettmayer , Ivar Tangring , Angela Eberhardt , Florian Peskoller
Abstract: In an embodiment an optoelectronic component includes a first joining partner including an LED chip with a structured light-emitting surface and a compensation layer applied to the light-emitting surface, wherein the compensation layer has a surface facing away from the light-emitting surface and spaced apart from the light-emitting surface, and wherein the surface forms a first connecting surface, a second joining partner having a second connecting surface, the first and second connecting surfaces being arranged such that they face each other and a bonding layer made of a film of low-melting glass having a layer thickness of not more than 1 μm, wherein the bonding layer bonds the first and second connecting surfaces together, wherein the structure of the light-emitting surface is embedded in the compensation layer, and wherein the first and second connecting surfaces are smooth such that their surface roughness, expressed as center-line roughness, is less than or equal to 50 nm.
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Patent Agency Ranking
公开(公告)号：US11760929B2
公开(公告)日：2023-09-19
申请号：US17292360
申请日：2019-11-13
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jörg Frischeisen , Nusret Sena Gueldal , Angela Eberhardt , Vesna Mueller , Florian Peskoller , Pascal Rabenbauer , Thomas Huckenbeck , Jürgen Bauer
CPC classification number: C09K11/7774 , C03C14/006 , C09K11/02 , C09K11/025 , C09K11/70 , C09K11/7731 , C09K11/77342 , C09K11/77347 , C09K11/77348 , C09K11/883 , H01L33/502 , C09K11/0883
Abstract: The invention relates to a conversion element comprising a wavelength-converting conversion material, a matrix material in which the conversion material is inserted, and a substrate on which the matrix material and the conversion material are directly arranged, the matrix material comprising at least one condensed sol-gel material selected from the following group: water glass, metal phosphate, aluminium phosphate, monoaluminium phosphate, modified monoaluminium phosphate, alkoxytetramethoxysilane, tetraethyl orthosilicate, methyltrimethoxysilane, methyltriethoxysilane, titanium alkoxide, silica sol, metal alkoxide, metal oxane or metal alkoxane, the conversion element being arranged in the beam path of a laser source, the conversion element being mounted in a mechanically immobile manner in relation to the laser source, and the radiation of the laser source being dynamically arranged in relation to the conversion element.
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公开(公告)号：US09945989B2
公开(公告)日：2018-04-17
申请号：US14396801
申请日：2013-04-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Daniel Steffen Setz , Manfred Deisenhofer , Angela Eberhardt , Christina Wille
CPC classification number: G02B5/0226 , C03C8/10 , C03C8/14 , C03C8/22 , C03C17/04 , G02B5/0242 , G02B5/0268 , G02B5/0278 , H01L51/5268 , H01L51/56
Abstract: Various embodiments may relate to a process for producing a scattering layer for electromagnetic radiation. The process may include applying scattering centers onto a carrier, applying glass onto the scattering centers, and liquefying of the glass so that a part of the liquefied glass flows between the scattering centers toward the surface of the carrier, in such a way that a part of the liquefied glass still remains above the scattering centers.
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公开(公告)号：US11430922B2
公开(公告)日：2022-08-30
申请号：US16479198
申请日：2018-02-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jörg Frischeisen , Angela Eberhardt , Florian Peskoller , Thomas Huckenbeck , Michael Schmidberger , Jürgen Bauer , Dominik Eisert , Albert Schneider
IPC: H01L33/50 , C09J183/04 , C09K11/02 , C09K11/08 , C09K11/77
Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a semiconductor layer sequence having an active region configured to emit radiation at least via a main radiation exit surface during operation and a self-supporting conversion element arranged in a beam path of the semiconductor layer sequence, wherein the self-supporting conversion element includes a substrate and subsequently a first layer, wherein the first layer includes at least one conversion material embedded in a matrix material, wherein the matrix material includes at least one condensed sol-gel material, wherein the condensed sol-gel material has a proportion between 10 and 70 vol % in the first layer, and wherein the substrate is free of the sol-gel material and the conversion material and mechanically stabilizes the first layer.
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公开(公告)号：US11011683B2
公开(公告)日：2021-05-18
申请号：US16484767
申请日：2018-02-23
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： David O'Brien , Norwin von Malm , Jörg Frischeisen , Angela Eberhardt , Florian Peskoller
Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment, an optoelectronic component includes a semiconductor layer sequence having an active region configured to emit radiation at least via a main radiation exit surface and a conversion element arranged directly downstream of the main radiation exit surface, wherein the conversion element is substrate-free and includes a first layer, wherein the first layer includes at least one conversion material embedded in a matrix material, wherein the matrix material includes at least one condensed inorganic sol-gel material selected from the following group consisting of water glass, metal phosphate, aluminum phosphate, modified monoaluminum phosphate, monoaluminum phosphate, alkoxytetramethoxysilane, tetraethylorthosilicate, methyltrimethoxysilane, methyltriethoxysilane, titanium alkoxide, silica sol, metal alkoxide, metal oxane, metal alkoxane, metal oxide, metal silicates, metal sulfates, and tungstates, and wherein the condensed sol-gel material has a proportion between 10 and 70 vol % in the first layer.
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7.发明申请公开(公告)号：US20150097166A1
公开(公告)日：2015-04-09
申请号：US14396801
申请日：2013-04-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Daniel Steffen Setz , Manfred Deisenhofer , Angela Eberhardt , Christina Wille
CPC classification number: G02B5/0226 , C03C8/10 , C03C8/14 , C03C8/22 , C03C17/04 , G02B5/0242 , G02B5/0268 , G02B5/0278 , H01L51/5268 , H01L51/56
Abstract: Various embodiments may relate to a process for producing a scattering layer for electromagnetic radiation. The process may include applying scattering centers onto a carrier, applying glass onto the scattering centers, and liquefying of the glass so that a part of the liquefied glass flows between the scattering centers toward the surface of the carrier, in such a way that a part of the liquefied glass still remains above the scattering centers.
Abstract translation: 各种实施例可涉及用于产生用于电磁辐射的散射层的方法。 该方法可以包括将散射中心应用到载体上，将玻璃施加到散射中心上，并液化玻璃，使得液体玻璃的一部分在散射中心之间朝着载体的表面流动，使得部分 的液化玻璃仍然保留在散射中心之上。
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