MULTI-CHIP CARRIER STRUCTURE
    3.
    发明申请

    公开(公告)号:US20220223756A1

    公开(公告)日:2022-07-14

    申请号:US17611112

    申请日:2020-03-10

    Abstract: A support structure for receiving planar microchips, comprising a planar support substrate and at least two receiving elements. The receiving elements are connected to the carrier substrate and configured in such a way that they detachably hold a flat microchip between the at least two receiving elements in such a way that the microchip can be moved out with a defined minimum force transversely to a support structure plane.

Patent Agency Ranking