公开(公告)号：US10079190B2

公开(公告)日：2018-09-18

申请号：US14801173

申请日：2015-07-16

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD

发明人： Shih-Ping Hsu ,  Chin-Wen Liu ,  Tang-I Wu ,  Shu-Wei Hu

IPC分类号： H05K3/30 ,  H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49861 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of fabricating a package structure is provided, including forming a plurality of openings by removing a portion of the material on one side of a conductive layer, forming an insulating material as an insulating layer in the openings, removing a portion of the material on the other side of the conductive layer to serve as a wiring layer, disposing an electronic component on the wiring layer, and forming an encapsulating layer to cover the electronic component, thereby allowing the single wiring layer to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path. The present invention further provides a package structure thus fabricated.

公开(公告)号：US11417581B2

公开(公告)日：2022-08-16

申请号：US15997845

申请日：2018-06-05

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.

发明人： Shih-Ping Hsu ,  Chin-Wen Liu ,  Tang-I Wu ,  Shu-Wei Hu

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

摘要： A semiconductor package is provided and includes: an insulative layer having opposing first and second surfaces; a wiring layer embedded in the insulative layer and having a first side that is exposed from the first surface of the insulative layer and a second side opposing the first side and attached to the second surface of the insulative layer; at least one electronic component mounted on the second side of the wiring layer and electrically connected to the wiring layer; and an encapsulating layer formed on the second side of the wiring layer and the second surface of the insulative layer and encapsulating the electronic component. Therefore, the single wiring layer is allowed to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path.

公开(公告)号：US20180315678A1

公开(公告)日：2018-11-01

申请号：US15997845

申请日：2018-06-05

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.

发明人： Shih-Ping Hsu ,  Chin-Wen Liu ,  Tang-I Wu ,  Shu-Wei Hu

IPC分类号： H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49861 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of fabricating a package structure is provided, including forming a plurality of openings by removing a portion of the material on one side of a conductive layer, forming an insulating material as an insulating layer in the openings, removing a portion of the material on the other side of the conductive layer to serve as a wiring layer, disposing an electronic component on the wiring layer, and forming an encapsulating layer to cover the electronic component, thereby allowing the single wiring layer to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path. The present invention further provides a package structure thus fabricated.

公开(公告)号：US20160135299A1

公开(公告)日：2016-05-12

申请号：US14801173

申请日：2015-07-16

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD

发明人： Shih-Ping Hsu ,  Chin-Wen Liu ,  Tang-I Wu ,  Shu-Wei Hu

IPC分类号： H05K1/18 ,  H01L23/31 ,  H05K3/28 ,  H01L21/56 ,  H05K3/34 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L23/3128 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49861 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of fabricating a package structure is provided, including forming a plurality of openings by removing a portion of the material on one side of a conductive layer, forming an insulating material as an insulating layer in the openings, removing a portion of the material on the other side of the conductive layer to serve as a wiring layer, disposing an electronic component on the wiring layer, and forming an encapsulating layer to cover the electronic component, thereby allowing the single wiring layer to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path. The present invention further provides a package structure thus fabricated.

摘要翻译： 提供了一种制造封装结构的方法，包括通过在导电层的一侧去除一部分材料来形成多个开口，在开口中形成作为绝缘层的绝缘材料，去除部分材料 导电层的另一侧用作布线层，将电子部件布置在布线层上，并形成封装层以覆盖电子部件，从而允许单个布线层在一侧连接到电子部件 并连接到另一侧的焊球，以缩短信号传输路径。 本发明还提供如此制造的封装结构。

公开(公告)号：US20160104652A1

公开(公告)日：2016-04-14

申请号：US14684574

申请日：2015-04-13

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD

发明人： Shih-Ping Hsu ,  Chih-Wen Liu ,  Tang-I Wu ,  Shu-Wei Hu

IPC分类号： H01L23/31 ,  H01L21/288 ,  H01L23/528 ,  H01L21/683 ,  H01L21/56 ,  H01L25/16 ,  H01L21/768

CPC分类号： H01L23/3107 ,  H01L21/2885 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/16 ,  H01L23/49541 ,  H01L23/49589 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/16245 ,  H01L2224/48245 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/85005 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511

摘要： A method for fabricating a package structure is provided, which includes the steps of: forming a wiring layer on a carrier by electroplating; disposing at least one electronic component on the wiring layer; forming on the carrier an insulating layer that encapsulates the wiring layer and the electronic component; and removing the carrier. With the single wiring layer having one surface electrically connected the at least one electronic component and the other surface electrically connected to a plurality of conductive elements, the package structure has a signal transmission path that is shortened.

摘要翻译： 提供了一种制造封装结构的方法，其包括以下步骤：通过电镀在载体上形成布线层; 在所述布线层上配置至少一个电子部件; 在所述载体上形成封装所述布线层和所述电子部件的绝缘层; 并移除载体。 在单个布线层具有与至少一个电子部件电连接的一个表面和与多个导电元件电连接的另一个表面的情况下，封装结构具有缩短的信号传输路径。