公开(公告)号：US20180047662A1

公开(公告)日：2018-02-15

申请号：US15796713

申请日：2017-10-27

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.

发明人： Che-Wei Hsu ,  Shih-Ping Hsu ,  Chih-Wen Liu

IPC分类号： H01L23/498 ,  H01L21/48 ,  H05K3/46 ,  H01L23/13 ,  H05K3/20 ,  H01L23/14

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/13 ,  H01L23/145 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/0152 ,  H01L2924/00

摘要： A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming, on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above.

公开(公告)号：US20160104652A1

公开(公告)日：2016-04-14

申请号：US14684574

申请日：2015-04-13

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD

发明人： Shih-Ping Hsu ,  Chih-Wen Liu ,  Tang-I Wu ,  Shu-Wei Hu

IPC分类号： H01L23/31 ,  H01L21/288 ,  H01L23/528 ,  H01L21/683 ,  H01L21/56 ,  H01L25/16 ,  H01L21/768

CPC分类号： H01L23/3107 ,  H01L21/2885 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/16 ,  H01L23/49541 ,  H01L23/49589 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/16245 ,  H01L2224/48245 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/85005 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511

摘要： A method for fabricating a package structure is provided, which includes the steps of: forming a wiring layer on a carrier by electroplating; disposing at least one electronic component on the wiring layer; forming on the carrier an insulating layer that encapsulates the wiring layer and the electronic component; and removing the carrier. With the single wiring layer having one surface electrically connected the at least one electronic component and the other surface electrically connected to a plurality of conductive elements, the package structure has a signal transmission path that is shortened.

摘要翻译： 提供了一种制造封装结构的方法，其包括以下步骤：通过电镀在载体上形成布线层; 在所述布线层上配置至少一个电子部件; 在所述载体上形成封装所述布线层和所述电子部件的绝缘层; 并移除载体。 在单个布线层具有与至少一个电子部件电连接的一个表面和与多个导电元件电连接的另一个表面的情况下，封装结构具有缩短的信号传输路径。

公开(公告)号：US09831165B2

公开(公告)日：2017-11-28

申请号：US14547743

申请日：2014-11-19

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.

发明人： Che-Wei Hsu ,  Shih-Ping Hsu ,  Chih-Wen Liu

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/13 ,  H01L23/14 ,  H05K3/20 ,  H05K3/46

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/13 ,  H01L23/145 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/0152 ,  H01L2924/00

摘要： A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above.