TREATED SUBSTRATES
    2.
    发明公开
    TREATED SUBSTRATES 审中-公开

    公开(公告)号:US20230203699A1

    公开(公告)日:2023-06-29

    申请号:US18169148

    申请日:2023-02-14

    CPC classification number: C25D5/34 C25D9/08 C25D9/10 C25D9/12

    Abstract: Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

    METHODS FOR ELECTROLYTICALLY DEPOSITING PRETREATMENT COMPOSITIONS

    公开(公告)号:US20200002831A1

    公开(公告)日:2020-01-02

    申请号:US16565800

    申请日:2019-09-10

    Abstract: Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

    Treated substrates
    7.
    发明授权

    公开(公告)号:US12104272B2

    公开(公告)日:2024-10-01

    申请号:US18169148

    申请日:2023-02-14

    CPC classification number: C25D5/34 C25D9/08 C25D9/10 C25D9/12

    Abstract: Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

    SYSTEMS AND METHODS FOR TREATING A METAL SUBSTRATE

    公开(公告)号:US20230074169A1

    公开(公告)日:2023-03-09

    申请号:US17757641

    申请日:2020-12-23

    Abstract: Disclosed is a system for treating a metal substrate comprising a conversion composition comprising trivalent chromium in an amount of 0.001 g/L to 20 g/L and a sealing composition comprising an ammonium-containing compound. Also disclosed is a method for treating a metal substrate that includes contacting at least a portion of a surface of the substrate with the conversion composition and then contacting at least a portion of the surface of the substrate with the sealing composition. Also disclosed is a substrate obtainable by treatment with the system and/or obtainable by the method of treatment.

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