公开(公告)号：US10017601B2

公开(公告)日：2018-07-10

申请号：US14901996

申请日：2014-06-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Daisuke Nii ,  Mitsuyoshi Nishino ,  Fuminori Sato ,  Yoshihiko Nakamura

IPC: H01B3/40 ,  C08G59/42 ,  C08J5/24 ,  C08K5/49 ,  C08K9/06 ,  C08J5/10 ,  B32B15/08 ,  B32B27/38 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  C08K3/013 ,  C08K5/5399 ,  C08K5/00

CPC classification number: C08G59/4284 ,  B32B5/02 ,  B32B5/26 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2307/732 ,  B32B2457/08 ,  C08G59/42 ,  C08J5/10 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/013 ,  C08K5/0066 ,  C08K5/49 ,  C08K5/5399 ,  C08K9/06 ,  C08L63/00

Abstract: A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.