公开(公告)号：US20170188468A1

公开(公告)日：2017-06-29

申请号：US15352264

申请日：2016-11-15

Applicant: Panasonic Intellectual Property Managemtent Co., Ltd.

Inventor： HIROHISA HINO ,  NAOMICHI OHASHI ,  YUKI YOSHIOKA ,  MASATO MORI ,  YASUHIRO SUZUKI

IPC: H05K3/34 ,  H05K1/18 ,  H05K1/11 ,  H01L23/00

CPC classification number: H05K3/3489 ,  B23K35/24 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13023 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13387 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/1601 ,  H01L2224/16013 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81905 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0209 ,  H05K2201/0227 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/05432 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/066

Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.