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公开(公告)号：US20080042269A1
公开(公告)日：2008-02-21
申请号：US11465042
申请日：2006-08-16
申请人： Pao-Kang Niu , Chien-Jung Wang , Chang-Chun Lee
发明人： Pao-Kang Niu , Chien-Jung Wang , Chang-Chun Lee
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05548 , H01L2224/05624 , H01L2224/05647 , H01L2224/13 , H01L2224/13008 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A bump structure for bonding two substrates together includes a composite structure. The composite structure is formed over a first substrate. The composite structure includes at least one first polymer layer and at least one first metal-containing layer. The bump structure also includes a second metal-containing layer at least partially covering a top surface of the composite structure and extending from the top surface of the composite structure to a surface of the first substrate, wherein the second metal-containing layer is thinner than the first metal-containing layer.
摘要翻译： 用于将两个基板接合在一起的凸块结构包括复合结构。 复合结构形成在第一基板上。 复合结构包括至少一个第一聚合物层和至少一个第一含金属层。 凸起结构还包括至少部分地覆盖复合结构的顶表面并从复合结构的顶表面延伸到第一衬底的表面的第二含金属层，其中第二含金属层比 第一含金属层。
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公开(公告)号：US07211886B2
公开(公告)日：2007-05-01
申请号：US11437718
申请日：2006-05-22
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/06517 , H01L2225/06579 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an active component and a passive component is attached to the flexible substrate by adhesion. In the flexible substrate, electric signals of the electronic device are delivered to the pin terminal through at least a conductive wire for transmitting electric signals. In assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate. Then, the flexible substrate is folded so as to package the electronic device in a three-dimensional multichip stack manner.
摘要翻译： 本发明涉及三维多芯片堆叠电子封装结构及其制造方法，包括至少具有针孔组的主衬底和至少具有至少pin端子的柔性衬底。 至少包括有源元件和无源元件的电子器件通过粘附附着在柔性基片上。 在柔性基板中，电子设备的电信号通过至少一根用于传输电信号的导线被传送到引脚端子。 在组装时，柔性基板的引脚端子插入到主基板的销孔中。 然后，将柔性基板折叠成以三维多芯片堆叠方式封装电子设备。
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公开(公告)号：US20060273439A1
公开(公告)日：2006-12-07
申请号：US11437718
申请日：2006-05-22
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/06517 , H01L2225/06579 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an active component and a passive component is attached to the flexible substrate by adhesion. In the flexible substrate, electric signals of the electronic device are delivered to the pin terminal through at least a conductive wire for transmitting electric signals. In assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate. Then, the flexible substrate is folded so as to package the electronic device in a three-dimensional multichip stack manner.
摘要翻译： 本发明涉及三维多芯片堆叠电子封装结构及其制造方法，包括至少具有针孔组的主衬底和至少具有至少pin端子的柔性衬底。 至少包括有源元件和无源元件的电子器件通过粘附附着在柔性基片上。 在柔性基板中，电子设备的电信号通过至少一根用于传输电信号的导线被传送到引脚端子。 在组装时，柔性基板的引脚端子插入到主基板的销孔中。 然后，将柔性基板折叠成以三维多芯片堆叠方式封装电子设备。
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公开(公告)号：US20110034220A1
公开(公告)日：2011-02-10
申请号：US12537254
申请日：2009-08-07
申请人： Chang-Chun Lee
发明人： Chang-Chun Lee
IPC分类号： H04M1/00
CPC分类号： H04M1/04 , G06F1/1628 , H04B1/3888 , H04M1/18
摘要： A handset jacket structure mainly comprises: a upper protecting frame, being a -shaped body, the upper end thereof being opened with a window, one side thereof being indented downward with a proper size of groove, and a proper position of another side thereof being opened with at least one slot corresponding to a connecting hole of the handset; and a lower shielding sheet, configured below the upper protecting frame to form an accepting space between them, being resilient, and having breaches respectively corresponding to the groove and the slot of the upper protecting frame. Whereby, the elasticity of the lower shielding sheet and the groove together with the breaches are operated in coordination with one another to allow a handset to be inserted in the accepting space so as to achieve the protection of the handset.
摘要翻译： 一种手机护套结构主要包括：上保护框架，形状为一体，其上端开有窗口，其一侧以适当尺寸的凹槽向下凹入，另一侧的适当位置为 用与手机的连接孔对应的至少一个插槽打开; 以及下屏蔽片，其被配置在所述上保护框架下方以在它们之间形成容纳空间，其具有弹性，并且具有分别对应于所述上保护框架的槽和所述槽的突破。 由此，下屏蔽片和沟槽与突破的弹性彼此协调地操作以允许手机插入接受空间中，以实现手机的保护。
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公开(公告)号：US20050224947A1
公开(公告)日：2005-10-13
申请号：US10957653
申请日：2004-10-05
IPC分类号： H01L21/50 , H01L23/28 , H01L23/48 , H01L25/065 , H01L25/10
CPC分类号： H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/06517 , H01L2225/06579 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an active component and a passive component is attached to the flexible substrate by adhesion. In the flexible substrate, electric signals of the electronic device are delivered to the pin terminal through at least a conductive wire for transmitting electric signals. In assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate. Then, the flexible substrate is folded so as to package the electronic device in a three-dimensional multichip stack manner.
摘要翻译： 本发明涉及三维多芯片堆叠电子封装结构及其制造方法，包括至少具有针孔组的主衬底和至少具有至少pin端子的柔性衬底。 至少包括有源元件和无源元件的电子器件通过粘附附着在柔性基片上。 在柔性基板中，电子设备的电信号通过至少一根用于传输电信号的导线被传送到引脚端子。 在组装时，柔性基板的引脚端子插入到主基板的销孔中。 然后，将柔性基板折叠成以三维多芯片堆叠方式封装电子设备。
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