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    Panel-Molded Electronic Assemblies
    3.
    发明申请
    Panel-Molded Electronic Assemblies 有权
    面板模制电子组件

    公开(公告)号：US20120287582A1

    公开(公告)日：2012-11-15

    申请号：US13105696

    申请日：2011-05-11

    申请人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Andrew T. D'Amico ,  Rudolph Mutter ,  Sean Timothy Fleming

    发明人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Andrew T. D'Amico ,  Rudolph Mutter ,  Sean Timothy Fleming

    IPC分类号： H05K7/00 ,  H05K5/00 ,  B29C33/20 ,  H01R43/00

    CPC分类号： H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

    摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

    摘要翻译： 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

    Method of forming an electrical contact
    4.
    发明授权
    Method of forming an electrical contact 有权
    形成电接点的方法

    公开(公告)号：US08966747B2

    公开(公告)日：2015-03-03

    申请号：US13105696

    申请日：2011-05-11

    申请人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

    发明人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

    IPC分类号： H05K3/30 ,  H05K7/20 ,  H01R43/24 ,  H05K5/06 ,  B29C45/14 ,  B29C45/00

    CPC分类号： H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

    摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

    摘要翻译： 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。