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    Panel-Molded Electronic Assemblies
    3.
    发明申请
    Panel-Molded Electronic Assemblies 有权
    面板模制电子组件

    公开(公告)号：US20120287582A1

    公开(公告)日：2012-11-15

    申请号：US13105696

    申请日：2011-05-11

    申请人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Andrew T. D'Amico ,  Rudolph Mutter ,  Sean Timothy Fleming

    发明人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Andrew T. D'Amico ,  Rudolph Mutter ,  Sean Timothy Fleming

    IPC分类号： H05K7/00 ,  H05K5/00 ,  B29C33/20 ,  H01R43/00

    CPC分类号： H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

    摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

    摘要翻译： 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

    Method of forming an electrical contact
    4.
    发明授权
    Method of forming an electrical contact 有权
    形成电接点的方法

    公开(公告)号：US08966747B2

    公开(公告)日：2015-03-03

    申请号：US13105696

    申请日：2011-05-11

    申请人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

    发明人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

    IPC分类号： H05K3/30 ,  H05K7/20 ,  H01R43/24 ,  H05K5/06 ,  B29C45/14 ,  B29C45/00

    CPC分类号： H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

    摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

    摘要翻译： 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

    System and apparatus for efficient heat removal from heat-generating electronic modules
    5.
    再颁专利
    System and apparatus for efficient heat removal from heat-generating electronic modules 有权
    用于从发热电子模块有效散热的系统和装置

    公开(公告)号：USRE44372E1

    公开(公告)日：2013-07-16

    申请号：US13358062

    申请日：2012-01-25

    申请人： Patrizio Vinciarelli ,  Michael B. Lafleur

    发明人： Patrizio Vinciarelli ,  Michael B. Lafleur

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/209

    摘要： This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating device thermally coupled by internal members to selected portions of a housing. The module housing includes a flat top surface with a perimeter adjoined to side surfaces. In one example, the heat removal device includes a cavity interior surface with an upper surface to match the module top surface, and side walls that match at least 50% by area of the selected portions of the module side surfaces. The cavity interior surface may receive at least 50% of the housing surface area. The matched portion of the cavity side surfaces may be at least 33% by area of the portion of the cavity upper surface that matches the module top surface.

    摘要翻译： 本文件描述了用于独立组件的装置和方法，其具有通过导热物质耦合到散热装置的封装的电子模块。 在说明性示例中，该模块包括至少一个由内部构件热耦合到壳体的选定部分的散热装置。 模块壳体包括具有与侧表面相邻的周边的平坦顶表面。 在一个示例中，除热装置包括具有上表面以匹配模块顶表面的空腔内表面和与模块侧表面的所选部分的至少50％的面积匹配的侧壁。 空腔内表面可以容纳至少50％的壳体表面积。 空腔侧表面的匹配部分可以与空腔上表面的与模块顶表面匹配的部分的至少33％的面积。

    Surface mounting a power converter
    6.
    发明授权
    Surface mounting a power converter 有权
    表面安装电源转换器

    公开(公告)号：US06940013B2

    公开(公告)日：2005-09-06

    申请号：US10714323

    申请日：2003-11-14

    申请人： Patrizio Vinciarelli ,  Jay Prager ,  Michael B. LaFleur

    发明人： Patrizio Vinciarelli ,  Jay Prager ,  Michael B. LaFleur

    IPC分类号： H02M3/00 ,  H01R43/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H02G3/08 ,  H05K5/00

    CPC分类号： H05K3/368 ,  H01R12/57 ,  H01R43/0256 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/3436 ,  H05K2201/1031 ,  Y02P70/611

    摘要： A power converter includes electrical contacts arranged on a first surface and a connection device. The converter has a top surface above the first surface and a bottom surface below the first surface. A border of the bottom surface is inset from a border of the second surface. The connection device includes a pair of conductive legs, each leg comprising a first end and a second end. The pair of legs lie opposite each other in a pair of evenly spaced planes that intersect the first surface. The first ends are adapted to connect to one or more of the contacts on the first surface and the second ends are adapted to connect to one or more conductive pads on a surface of a substrate. The connection device is adapted to enable the first ends of the two legs to connect to the contacts from below the first surface.

    摘要翻译： 电力转换器包括布置在第一表面上的电触头和连接装置。 转换器具有位于第一表面上方的顶表面和第一表面下方的底表面。 底面的边界是从第二表面的边界插入的。 连接装置包括一对导电腿，每个腿包括第一端和第二端。 一对腿在与第一表面相交的一对均匀间隔的平面中彼此相对。 第一端适于连接到第一表面上的一个或多个触点，并且第二端适于连接到衬底表面上的一个或多个导电焊盘。 连接装置适于使得两个腿的第一端能够从第一表面下方连接到触点。

    Bobbins, transformers, magnetic components, and methods
    7.
    发明授权
    Bobbins, transformers, magnetic components, and methods 有权
    线轴，变压器，磁性元件和方法

    公开(公告)号：US06593836B1

    公开(公告)日：2003-07-15

    申请号：US09342403

    申请日：1999-06-28

    申请人： Michael B. LaFleur ,  Patrizio Vinciarelli

    发明人： Michael B. LaFleur ,  Patrizio Vinciarelli

    IPC分类号： H01F2708

    CPC分类号： H01F27/22 ,  H01F3/14 ,  H01F27/29 ,  H01F27/306 ,  H01F29/10 ,  H01F38/08

    摘要： A bobbin is adapted to support a winding on a permeable core and has a wall that provides a confined thermally conductive channel that causes conduction of heat along a predetermined path from the core to a location outside the winding. A value of magnetizing inductance in a transformer is set by adjusting the gap until the value of magnetizing inductance has been set and attaching a segment of the bobbin to a pair of core pieces to maintain the gap. A permeable strip provides a permeable path outside of the hollow interior space and does not couple the winding, and an electrically insulating coupler is interposed between the slug and the winding to electrically insulate the winding.

    摘要翻译： 线轴适于将绕组支撑在可渗透的芯上并且具有壁，其提供限制的导热通道，其导致沿着从芯到预定绕组的位置的预定路径的热传导。 变压器中的励磁电感值通过调整间隙直到磁化电感的值被设定并且将线圈的一部分连接到一对芯片上来保持间隙来设定。 可渗透条带提供在中空内部空间外部的可渗透路径，并且不耦合绕组，并且电绝缘耦合器插入在芯块和绕组之间以使绕组电绝缘。

    System and apparatus for efficient heat removal from heat-generating electronic modules
    8.
    发明授权
    System and apparatus for efficient heat removal from heat-generating electronic modules 有权
    用于从发热电子模块有效散热的系统和装置

    公开(公告)号：US07952879B1

    公开(公告)日：2011-05-31

    申请号：US12423417

    申请日：2009-04-14

    申请人： Patrizio Vinciarelli ,  Michael B. Lafleur

    发明人： Patrizio Vinciarelli ,  Michael B. Lafleur

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/209

    摘要： This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating device thermally coupled by internal members to selected portions of a housing. The module housing includes a flat top surface with a perimeter adjoined to side surfaces. In one example, the heat removal device includes a cavity interior surface with an upper surface to match the module top surface, and side walls that match at least 50% by area of the selected portions of the module side surfaces. The cavity interior surface may receive at least 50% of the housing surface area. The matched portion of the cavity side surfaces may be at least 33% by area of the portion of the cavity upper surface that matches the module top surface.

    摘要翻译： 本文件描述了用于独立组件的装置和方法，其具有通过导热物质耦合到散热装置的封装的电子模块。 在说明性示例中，该模块包括至少一个由内部构件热耦合到壳体的选定部分的散热装置。 模块壳体包括具有与侧表面相邻的周边的平坦顶表面。 在一个示例中，除热装置包括具有上表面以匹配模块顶表面的空腔内表面和与模块侧表面的所选部分的至少50％的面积匹配的侧壁。 空腔内表面可以容纳至少50％的壳体表面积。 空腔侧表面的匹配部分可以与空腔上表面的与模块顶表面匹配的部分的至少33％的面积。

    Power converter package and thermal management
    9.
    发明授权
    Power converter package and thermal management 有权
    电源转换器封装和热管理

    公开(公告)号：US07799615B2

    公开(公告)日：2010-09-21

    申请号：US12014662

    申请日：2008-01-15

    申请人： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Charles I. McCauley ,  Paul V. Starenas

    发明人： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Charles I. McCauley ,  Paul V. Starenas

    IPC分类号： H01L21/00

    CPC分类号： H05K7/1092 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/1003 ,  H05K2201/10325 ,  Y10T29/49126 ,  Y10T29/49826 ,  H01L2924/00

    摘要： Power conversion apparatus can include a circuit board with power conversion circuitry and a package. The package may be formed by encapsulating areas of the circuit board assembly either before or after the interface contacts are attached to the circuit board. A method for encapsulating two sides of a substrate can include providing a mold that fills a larger first cavity to create a sealing force on a smaller second cavity. The encapsulant flows through the first cavity into the second cavity. A thermal extender can include a surface for mounting a heat dissipating power converter and a surface for mating with an external circuit board. Interface conductors may mate with contacts on the heat dissipating power converter and with conductive regions on the external circuit board. A heat sink may be thermally coupled to remove heat generated by the power converter.

    摘要翻译： 电力转换装置可以包括具有电力转换电路和封装的电路板。 封装可以在接口触点附接到电路板之前或之后通过封装电路板组件的区域来形成。 用于封装基板的两侧的方法可以包括提供填充更大的第一空腔以在较小的第二空腔上产生密封力的模具。 密封剂流过第一腔体进入第二腔体。 热延伸器可以包括用于安装散热功率转换器的表面和用于与外部电路板配合的表面。 接口导体可与散热功率转换器上的触点和外部电路板上的导电区域配合。 散热器可以被热耦合以去除由功率转换器产生的热量。

    Power converter package and thermal management
    10.
    发明授权
    Power converter package and thermal management 有权
    电源转换器封装和热管理

    公开(公告)号：US07361844B2

    公开(公告)日：2008-04-22

    申请号：US10303613

    申请日：2002-11-25

    申请人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Charles I. McCauley ,  Paul V. Starenas

    发明人： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Charles I. McCauley ,  Paul V. Starenas

    IPC分类号： H05K3/36 ,  H05K1/00 ,  H05K1/16

    CPC分类号： H05K7/1092 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/1003 ,  H05K2201/10325 ,  Y10T29/49126 ,  Y10T29/49826 ,  H01L2924/00

    摘要： Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface and a bottom surface of the circuit board. The lower portion encloses a smaller region than that enclosed by the upper portion. The regions are arranged to define an overhang region on the bottom surface of the circuit board. Interface contacts are provided on the bottom surface in the overhang region for making electrical connections to the circuit board. A thermal extender includes a surface for mounting a heat dissipating power converter and a surface for mating with an external circuit board. Interface conductors mate with contacts on the power converter and with conductive regions on the external circuit board. A heat sink is thermally coupled to remove heat generated by the power converter.

    摘要翻译： 电力转换装置包括具有电力转换电路的电路板和具有分别在电路板的顶表面和底表面上包围电路的上部和下部的封装。 下部包围比由上部包围的区域小的区域。 这些区域被布置成在电路板的底表面上限定突出区域。 在伸出区域的底表面上提供界面触点，用于与电路板进行电连接。 热延伸器包括用于安装散热功率转换器的表面和用于与外部电路板配合的表面。 接口导体与电源转换器上的触点和外部电路板上的导电区域配合。 散热器被热耦合以去除由功率转换器产生的热量。