Logic circuitry powered by partially rectified AC waveform
    1.
    发明授权
    Logic circuitry powered by partially rectified AC waveform 有权
    由部分整流交流波形供电的逻辑电路

    公开(公告)号:US07245151B2

    公开(公告)日:2007-07-17

    申请号:US11424450

    申请日:2006-06-15

    IPC分类号: G06K19/07 G06K7/10 H02M7/217

    摘要: Logic circuitry is powered by a partially rectified alternating current (ac) waveform. The waveform is partially rectified in the sense that it does not provide a clean, primarily dc power signal. Instead, it is possible to power logic circuitry with a waveform that includes a substantial ac component. The partially rectified ac waveform may be applied to logic circuitry incorporating thin film transistors based on amorphous or polycrystalline organic semiconductors, inorganic semiconductors or combinations of both.

    摘要翻译: 逻辑电路由部分整流的交流(ac)波形供电。 在不提供干净的主要直流电源信号的意义上,波形是部分整流的。 相反,可以用包含大量交流分量的波形为逻辑电路供电。 部分整流的交流波形可以应用于结合基于无定形或多晶有机半导体,无机半导体或两者的组合的薄膜晶体管的逻辑电路。

    Logic circuitry powered by partially rectified ac waveform
    3.
    发明授权
    Logic circuitry powered by partially rectified ac waveform 失效
    由部分整流的交流波形供电的逻辑电路

    公开(公告)号:US07078937B2

    公开(公告)日:2006-07-18

    申请号:US10738082

    申请日:2003-12-17

    IPC分类号: H03K19/20 H02M7/00

    摘要: Logic circuitry is powered by a partially rectified alternating current (ac) waveform. The waveform is partially rectified in the sense that it does not provide a clean, primarily dc power signal. Instead, it is possible to power logic circuitry with a waveform that includes a substantial ac component. The partially rectified ac waveform may be applied to logic circuitry incorporating thin film transistors based on amorphous or polycrystalline organic semiconductors, inorganic semiconductors or combinations of both.

    摘要翻译: 逻辑电路由部分整流的交流(ac)波形供电。 在不提供干净的主要直流电源信号的意义上,波形是部分整流的。 相反,可以用包含大量交流分量的波形为逻辑电路供电。 部分整流的交流波形可以应用于结合基于无定形或多晶有机半导体,无机半导体或两者的组合的薄膜晶体管的逻辑电路。

    In-line deposition processes for circuit fabrication
    5.
    发明授权
    In-line deposition processes for circuit fabrication 失效
    电路制造的在线沉积工艺

    公开(公告)号:US06821348B2

    公开(公告)日:2004-11-23

    申请号:US10076005

    申请日:2002-02-14

    IPC分类号: C23C1600

    摘要: In one embodiment, the invention is directed to aperture mask deposition techniques using aperture mask patterns formed in one or more elongated webs of flexible film. The techniques involve sequentially depositing material through mask patterns formed in the film to define layers, or portions of layers, of the circuit. A deposition substrate can also be formed from an elongated web, and the deposition substrate web can be fed through a series of deposition stations. Each deposition station may have an elongated web formed with aperture mask patterns. The elongated web of mask patterns feeds in a direction perpendicular to the deposition substrate web. In this manner, the circuit creation process can be performed in-line. Moreover, the process can be automated to reduce human error and increase throughput.

    摘要翻译: 在一个实施例中,本发明涉及使用在一个或多个细长的柔性膜网中形成的孔掩模图案的孔掩模沉积技术。 这些技术涉及通过在膜中形成的掩模图案顺序沉积材料以限定电路的层或层的一部分。 沉积衬底也可以由细长的腹板形成,并且沉积衬底腹板可以通过一系列沉积站进给。 每个沉积站可以具有形成有孔掩模图案的细长腹板。 细长的掩模图形网沿垂直于沉积衬底腹板的方向进给。 以这种方式,可以在线执行电路创建处理。 此外,该过程可以自动化以减少人为错误并增加吞吐量。