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1.发明授权Integrated microfeature workpiece processing tools with registration systems for paddle reactors 有权集成的微型工件加工工具，具有桨式反应堆的配准系统公开(公告)号：US07393439B2
公开(公告)日：2008-07-01
申请号：US10733807
申请日：2003-12-11
CPC分类号： C25D17/001 , C25D17/02 , C25D21/10
摘要： Tools having mounting modules with registration systems are disclosed. The mounting module includes positioning elements for precisely locating a processing chamber and a transport system that moves workpieces to and from the processing chamber. The relative positions between positioning elements of the module are fixed so that the transport system does not need to be recalibrated when the processing chamber is removed and replaced with another processing chamber. The processing chamber includes a paddle device for agitating processing liquid at a process surface of the workpiece. The paddle device, the processing chamber, and electrodes within the processing chamber are configured to reduce the likelihood for electrical shadowing created by the paddles at the surface of the workpiece, and to account for three-dimensional effects on the electrical field as the paddles reciprocate relative to the workpiece.
摘要翻译： 公开了具有配准系统的安装模块的工具。 安装模块包括用于精确定位处理室的定位元件和将工件移至和离开处理室的输送系统。 模块的定位元件之间的相对位置是固定的，使得当处理室被移除并被另一处理室更换时，输送系统不需要重新校准。 处理室包括用于在工件的处理表面处搅拌处理液体的桨装置。 处理室中的桨装置，处理室和电极被配置为减少由工件表面上的桨形成的电阴影的可能性，并且当桨叶往复运动时考虑对电场的三维效应 相对于工件。
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2.发明授权Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces 有权用于在微型工件加工过程中增强传质的鞍座和外壳公开(公告)号：US07390383B2
公开(公告)日：2008-06-24
申请号：US10734098
申请日：2003-12-11
CPC分类号： C25D5/006 , C25D5/08 , C25D17/001 , C25D17/008 , C25D17/10 , C25D17/12 , C25D21/10 , C25D21/12 , H01L21/6723
摘要： Paddles and enclosures for processing microfeature workpieces are disclosed. A paddle device having multiple paddles is positioned in an enclosure to reciprocate back and forth along a generally linear path. The clearances between the paddles, the workpiece and the walls of the chamber are relatively small to increase the flow agitation at the surface of the workpiece and enhance the mass transfer process occurring there. The paddles are shaped to reduce or eliminate electrical shadowing effects created at the surface of the workpiece during electrochemical processing. Paddles on the same paddle device may have different shapes to reduce the likelihood for creating three-dimensional effects in the flow field proximate to the surface of the workpiece. The reciprocation stroke of the paddles may shift to further reduce shadowing.
摘要翻译： 公开了用于处理微特征工件的鞍座和外壳。 具有多个桨叶的桨装置定位在外壳中，沿着大致线性的路径往复运动。 桨叶，工件和室壁之间的间隙相对较小，以增加工件表面的流动搅拌并增强在那里发生的传质过程。 桨叶的形状可减少或消除在电化学处理期间在工件表面产生的电阴影效应。 相同桨装置上的桨叶可以具有不同的形状，以减少在靠近工件表面的流场中产生三维效应的可能性。 桨叶的往复行程可能会转移以进一步减少阴影。
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3.发明授权Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods 有权具有多个电极和/或封闭的往复式桨的反应器及相关方法公开(公告)号：US07390382B2
公开(公告)日：2008-06-24
申请号：US10734100
申请日：2003-12-11
CPC分类号： C25D5/006 , C25D5/08 , C25D17/001 , C25D17/008 , C25D17/10 , C25D17/12 , C25D21/10 , C25D21/12 , H01L21/6723
摘要： Reactors having multiple electrodes and/or enclosed reciprocating paddles are disclosed. The reactor can include multiple electrodes spaced apart from a process location to provide virtual electrodes proximate to the process location for transferring material to or from the workpiece. A magnet may be positioned proximate to the process plane to orient magnetically sensitive material deposited on the workpiece. The electrodes may be removable from the reactor without passing them through the magnet to reduce interference between the electrodes and the magnet. The workpiece may be carried by a rotatable workpiece support to orient the workpiece for processing. At least one of the electrodes can operate as a current thief to reduce terminal effects at the periphery of the workpiece. An electric field control element positioned between the electrodes and the workpiece circumferentially varies the effect of the thieving electrode current to account for effects created by elongated paddles as they oscillate proximate to the workpiece.
摘要翻译： 公开了具有多个电极和/或封闭的往复式叶片的反应器。 反应器可以包括与处理位置间隔开的多个电极，以提供靠近处理位置的虚拟电极，用于将材料转移到工件或从工件传送材料。 可以将磁体定位成靠近处理平面以定向沉积在工件上的感应敏感材料。 电极可以从反应器中移除，而不会使它们通过磁体，以减少电极和磁体之间的干扰。 工件可以由可旋转的工件支撑件承载以使工件定向以进行加工。 电极中的至少一个可以作为电流窃贼工作，以减少在工件周边处的终端效应。 定位在电极和工件之间的电场控制元件周向地改变了窃电电极电流的影响，以解决细长桨叶在靠近工件振荡时产生的效应。
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公开(公告)号：US08968533B2
公开(公告)日：2015-03-03
申请号：US13468273
申请日：2012-05-10
CPC分类号： C25D17/12 , C25D7/123 , C25D17/001 , C25D17/002
摘要： An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.
摘要翻译： 电镀处理器包括具有形成在通道中的连续流路的电极板。 流路可以可选地是卷绕的流动路径。 一个或多个电极定位在通道中。 膜板在它们之间附着有电极板。 电解液以高速移动通过流路，防止气泡粘到膜底部。 流动路径中的任何气泡被夹带在快速移动的电解质中并从膜中带走。 电镀处理器可以替代地具有延伸通过形成为线圈或其它形状的管状膜的线电极，任选地包括具有直段的形状。
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公开(公告)号：US07927469B2
公开(公告)日：2011-04-19
申请号：US11467232
申请日：2006-08-25
申请人： Nigel Stewart , Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Nigel Stewart , Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： C25F7/00
CPC分类号： H01L21/6719 , H01L21/67115 , H01L21/67126
摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。
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公开(公告)号：US20100078334A1
公开(公告)日：2010-04-01
申请号：US11457192
申请日：2006-07-13
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
CPC分类号： C25F7/00
摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译： 用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。
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公开(公告)号：US20080003781A1
公开(公告)日：2008-01-03
申请号：US11608151
申请日：2006-12-07
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nigel Stewart , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nigel Stewart , Erik Lund , Steven L. Peace
IPC分类号： H01L21/326
CPC分类号： C25D17/001 , C25D17/004
摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一和/或第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动，并且第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。
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8.发明申请公开(公告)号：US20110042224A1
公开(公告)日：2011-02-24
申请号：US12917997
申请日：2010-11-02
CPC分类号： C25D7/12 , C25D7/123 , C25D17/001 , C25D17/10 , C25F3/30
摘要： Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter electrode in the vessel that can operate as an anode or a cathode depending upon the particular plating or electropolishing application. The apparatus further includes a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending upon the type of process. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode in the vessel when the wafer is in the processing zone.
摘要翻译： 用于电化学处理微片的装置和方法。 该装置可以具有容器，该容器包括处理区域，微处理区域定位用于电化学处理。 该装置还包括容器中的至少一个对电极，其可以根据具体的电镀或电解抛光应用而作为阳极或阴极操作。 该装置还包括辅助电极和辅助虚拟电极。 辅助电极被配置为独立于容器中的对电极操作，并且其可以是根据工艺类型的小电极和/或去镀电极。 在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。 辅助虚拟电极位于处理区域中，并且其被配置为当晶片处于处理区域时，相对于与晶片和对置电极之间的偏移相关联的晶片抵消相对于晶片的电场偏移。
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9.发明授权公开(公告)号：US07842173B2
公开(公告)日：2010-11-30
申请号：US11699768
申请日：2007-01-29
IPC分类号： C25B9/00
CPC分类号： C25D7/12 , C25D7/123 , C25D17/001 , C25D17/10 , C25F3/30
摘要： Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter electrode in the vessel that can operate as an anode or a cathode depending upon the particular plating or electropolishing application. The apparatus further includes a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending upon the type of process. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode in the vessel when the wafer is in the processing zone.
摘要翻译： 用于电化学处理微片的装置和方法。 该装置可以具有容器，该容器包括处理区域，微处理区域定位用于电化学处理。 该装置还包括容器中的至少一个对电极，其可以根据具体的电镀或电解抛光应用而作为阳极或阴极操作。 该装置还包括辅助电极和辅助虚拟电极。 辅助电极被配置为独立于容器中的对电极操作，并且其可以是根据工艺类型的小电极和/或去镀电极。 在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。 辅助虚拟电极位于处理区域中，并且其被配置为当晶片处于处理区域时，相对于与晶片和对置电极之间的偏移相关联的晶片抵消相对于晶片的电场偏移。
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公开(公告)号：US20130299343A1
公开(公告)日：2013-11-14
申请号：US13468273
申请日：2012-05-10
IPC分类号： C25D19/00
CPC分类号： C25D17/12 , C25D7/123 , C25D17/001 , C25D17/002
摘要： An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.
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