摘要:
An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
摘要:
A method and apparatus for multi-phase transformers are described. In one embodiment, a coupled inductor topology for the multi-phase transformers comprising N primary inductors. In one embodiment, each primary inductor is coupled to one of N input nodes and a common output node. The transformer further includes N−1 secondary inductors coupled in series between one input node and the common output node. In one embodiment, the N−1 secondary inductors are arranged to couple energy from N−1 of the primary inductors to provide a common node voltage as an average of N input node voltages, wherein N is an integer greater than two. Other embodiments are described and claimed.
摘要:
A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.
摘要:
A transformer is provided that includes a plurality of metal lines and a magnetic material provided about the plurality of metal lines. The magnetic material may include a structure to reduce Eddy currents flowing in the magnetic material. This structure may be a plurality of slots extending perpendicular to the metal lines. This structure may also be a laminated structure.
摘要:
Droop-control circuitry of a multiphase power converter determines when multiphase switching signals are concurrently at either a high or low state and temporarily clamps the output of the power converter to either a high or low voltage level in response thereto.
摘要:
An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
摘要:
A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.
摘要:
Systems and methods are disclosed for measuring signals on an integrated circuit die. In one embodiment, a reference signal is distributed to die locations proximal to the signals to be measured. The reference signal is transmitted over transport paths coupling each of the signals to be measured to the die output. The signals to be measured are transmitted over their respective transport paths and measured at the die output. The relative delay between the signals can be calculated using the reference signal measurements.
摘要:
An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
摘要:
A multiphase DC-DC converter is provided that includes a multiphase transformer, the multiphase transformer including a plurality of input voltage terminals and an transformer output voltage terminal, each input voltage terminal associated with a corresponding phase. Each phase is assigned to an input voltage terminal of the plurality of input voltage terminals to minimize a ripple current at the input voltage terminals of the multiphase transformer.