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公开(公告)号：US4587000A
公开(公告)日：1986-05-06
申请号：US672601
申请日：1984-11-19
摘要： Electroplating apparatus and methods for plating high aspect ratio thru-holes in printed circuit boards and the like. For copper plating thru-holes in printed circuit boards, the printed circuit board is immersed in a tank of electrolyte. Surrounding both sides of the printed circuit board are a plurality of cell-like structures which contain mechanical electrolyte agitating members, filters and electrolyte ion replenishment anode baskets. In addition, a pump is provided to encourage exhausting of the electrolyte from local regions of each side of the printed circuit board to encourage a general but definite flow of electrolyte through any thru-holes in the printed circuit board. The general flow of electrolyte as encouraged by the pump is through the ion replenishment anode basket to the mechanical agitator adjacent the printed circuit board, through any thru-holes in that region of the printed circuit board and to some extent around the printed circuit board, past the mechanical agitator on the other side of the printed circuit board and through a filter adjacent the exhaust manifold for recirculation back and forth through similar cells disposed along the length of the circuit board. The mechanical agitation avoids ion depletion in the electrolyte adjacent the printed circuit board and particularly adjacent the edges of and within the thru-holes by assuring fast and continuous interchange of the "surface" electrolyte with the bulk electrolyte, which itself is replenished at an adequate rate by the background flow established by the pump. Alternate methods and apparatus are also disclosed.
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公开(公告)号：US4111419A
公开(公告)日：1978-09-05
申请号：US708533
申请日：1976-07-26
申请人： Peter P. Pellegrino
发明人： Peter P. Pellegrino
CPC分类号： A63B69/0026 , A63B67/14 , A63B67/20 , A63B69/3632 , A63B2067/146 , A63B21/0552 , A63B2102/24
摘要： A practice hockey puck for use in individual practice on surfaces other than ice. The practice hockey puck body may be a standard hockey puck altered so as to have a plurality of headed pins disposed about the periphery of the two flat surfaces thereon. Headed members are also provided at the center of the two flat surfaces, with the heads thereof extending above the elevation of the heads of the members at the periphery of the flat surfaces so that the majority of the weight of the hockey puck is supported on these central members when resting on a flat surface. The puck is removably coupled to an elastic cord which in turn includes a fastening device at the opposite end thereof for fastening to a hockey stick. One section of the elastic cord may be provided with known and limited breakage characteristics so as to limit the maximum elastic energy which may be stored in the elastic cord to limit the springback of the puck.
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公开(公告)号：US4686014A
公开(公告)日：1987-08-11
申请号：US832035
申请日：1986-02-21
摘要： Electroplating apparatus and methods for rapid and efficient plating of printed circuit board and the like are disclosed. In accordance with the method, a printed circuit board is disclosed within a tank of electrolyte and caused to oscillate in the plane of the printed circuit board. On each side of the printed circuit board are a plurality of paddle assemblies which are rotated to maintain a high degree of turbulence in the electrolyte adjacent the printed circuit board. Ion replenishment for the electrolyte is provided by baskets filled with pieces of the material to be plated, in the embodiment disclosed the baskets themselves being rotatable and having the paddle assemblies integral therewith. Electrolyte circulation is maintained by pumps with the electrolyte being withdrawn from the tank for filtering and replenishment through manifolds in the walls separating the cells within which the paddle assemblies operate. Various alternate embodiments are described.
摘要翻译： 公开了用于印刷电路板等的快速和有效电镀的电镀设备和方法。 根据该方法，印刷电路板被公开在电解质槽内并且在印刷电路板的平面中振荡。 在印刷电路板的每一侧上是多个桨组件，其被旋转以保持邻近印刷电路板的电解质中的高度湍流。 电解质的离子补充由填充有待镀层材料的篮子提供，在所公开的实施例中，篮子本身可旋转并且具有与其一体的桨叶组件。 电解液循环通过泵保持，其中电解液从罐中取出，用于过滤和补充通过分隔板组件操作的单元的壁中的歧管。 描述各种替代实施例。
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公开(公告)号：US4595478A
公开(公告)日：1986-06-17
申请号：US674426
申请日：1984-11-23
摘要： Electroplating apparatus and methods for rapid and efficient plating of printed circuit board and the like are disclosed. In accordance with the method, a printed circuit board is disclosed within a tank of electrolyte and caused to oscillate in the plane of the printed circuit board. On each side of the printed circuit board are a plurality of paddle assemblies which are rotated to maintain a high degree of turbulence in the electrolyte adjacent the printed cirucit board. Ion replenishment for the electrolyte is provided by baskets filled with pieces of the material to be plated, in the embodiment disclosed the baskets themselves being rotatable and having the paddle assemblies integral therewith. Electrolyte circulation is maintained by pumps with the electrolyte being withdrawn from the tank for filtering and replenishment through manifolds in the walls separating the cells within which the paddle assemblies operate. Various alternate embodiments are described.
摘要翻译： 公开了用于印刷电路板等的快速和有效电镀的电镀设备和方法。 根据该方法，印刷电路板被公开在电解质槽内并且在印刷电路板的平面中振荡。 在印刷电路板的每一侧上是旋转的多个桨叶组件，以保持邻近印刷电路板的电解质中的高度湍流。 电解质的离子补充由填充有待镀层材料的篮子提供，在所公开的实施例中，篮子本身可旋转并且具有与其一体的桨叶组件。 电解液循环通过泵保持，其中电解液从罐中取出，用于过滤和补充通过分隔板组件操作的单元的壁中的歧管。 描述各种替代实施例。
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5.发明授权
公开(公告)号：US4692222A
公开(公告)日：1987-09-08
申请号：US832057
申请日：1986-02-21
摘要： Electroplating apparatus and methods for plating high aspect ratio thru-holes in printed circuit boards and the like. For copper plating thru-holes in printed circuit boards, the printed circuit board is immersed in a tank of electrolyte. Surrounding both sides of the printed circuit board are a plurality of cell-like structures which contain mechanical electrolyte agitating members, filters and electrolyte ion replenishment anode baskets. In addition, a pump is provided to encourage exhausting of the electrolyte from local regions of each side of the printed circuit board to encourage a general but definite flow of electrolyte through any thru-holes in the printed circuit board. The general flow of electrolyte as encouraged by the pump is through the ion replenishment anode basket to the mechanical agitator adjacent the printed circuit board, through any thru-holes in that region of the printed circuit board and to some extent around the printed circuit board, past the mechanical agitator on the other side of the printed circuit board and through a filter adjacent the exhaust manifold for recirculation back and forth through similar cells disposed along the length of the circuit board. The mechanical agitation avoids ion depletion in the electrolyte adjacent the printed circuit board and particularly adjacent the edges of and within the thru-holes by assuring fast and continuous interchange of the "surface" electrolyte with the bulk electrolyte, which itself is replenished at an adequate rate by the background flow established by the pump. Alternate methods and apparatus are also disclosed.
摘要翻译： 用于在印刷电路板等中电镀高纵横比通孔的电镀设备和方法。 对于印刷电路板中的铜电镀通孔，将印刷电路板浸入电解液槽中。 印刷电路板的两侧是包含机械电解质搅拌部件，过滤器和电解质离子补充阳极筐的多个电池状结构体。 此外，提供泵以鼓励电解质从印刷电路板的每一侧的局部区域排出，以促进电解质通过印刷电路板中的任何通孔的一般但确定的流动。 泵所鼓励的电解液的一般流动是通过离子补充阳极筐到靠近印刷电路板的机械搅拌器，通过印刷电路板的该区域中的任何通孔，并且在某种程度上围绕印刷电路板， 经过印刷电路板另一侧的机械搅拌器，并且通过与排气歧管相邻的过滤器，用于通过沿电路板长度设置的类似电池来回循环。 机械搅拌通过确保“表面”电解质与大体积电解质的快速和连续的交换，避免了邻近印刷电路板的电解质中的离子消耗，特别是邻近通孔内部和内部的电解质中的离子消耗，其本身以足够的量补充 按照由泵建立的背景流量。 还公开了替代方法和装置。
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公开(公告)号：US4631100A
公开(公告)日：1986-12-23
申请号：US671672
申请日：1984-11-15
申请人： Peter P. Pellegrino
发明人： Peter P. Pellegrino
CPC分类号： H05K3/46 , H05K1/0287 , H05K3/429 , H05K1/0298 , H05K2201/0376 , H05K2201/09454 , H05K2201/09718 , H05K2201/09945 , H05K2203/107 , H05K2203/175 , H05K3/06 , Y10S428/901 , Y10T29/49156 , Y10T29/49158 , Y10T428/12396
摘要： The present invention contemplates fabrication of a printed circuit board blank having a predetermined pattern of pads and interconnecting conductive pathways, preferably (but not necessarily) flush with the face of the insulating substrate. To fabricate a finished circuit board of any desired circuit configuration, the printed circuit board blank is coated with a photoresist and exposed so that upon development of the photoresist and etching in accordance with the developed pattern, the interconnecting conductive pathways between pads will be selectively etched away so that only those interconnects for the desired circuit pattern remain. While contact printing or image exposure systems may be used to expose the photoresist, computer controlled raster scan laser printers offer the combination of speed and versatility, as the predetermined starting matrix of the invention is highly conductive to computer aided design, and the percentage of circuit board area required for exposure is very small compared to normal copper-clad board fabrication techniques. For multilayer printed circuit boards, registration apertures are provided in each board layer for alignment purposes. Interconnects between boards are made by drilling through selective pads and plating the through holes to interconnect the various board layers. Isolation of any layer of any plated through hole may be obtained by either isolation of the pad (removal of all pad interconnects) at the through hole, or alternatively by etching a larger diameter in the pad which region will be filled with laminating adhesive during the lamination process to insulate the pad from the through hole copper plating.
摘要翻译： 本发明考虑制造具有预定图案的焊盘和互连导电路径的印刷电路板坯料，优选（但不一定）与绝缘衬底的表面齐平。 为了制造任何所需电路结构的成品电路板，印刷电路板坯体被涂覆有光致抗蚀剂并暴露，使得在显影光刻胶和根据显影图案进行蚀刻时，焊盘之间的互连导电路径将被选择性地蚀刻 使得仅保留用于所需电路图案的那些互连。 尽管接触式印刷或图像曝光系统可用于曝光光致抗蚀剂，但计算机控制的光栅扫描激光打印机提供速度和多功能性的组合，因为本发明的预定起始矩阵对于计算机辅助设计是高度导电的，并且电路的百分比 与正常的铜包覆板制造技术相比，曝光所需的板面积非常小。 对于多层印刷电路板，在每个板层中设置配准孔用于对准目的。 板之间的互连是通过选择性焊盘钻孔和电镀通孔来互连各个板层而制成的。 任何电镀通孔的任何层的隔离可以通过在通孔处隔离焊盘（去除所有焊盘互连）来获得，或者通过蚀刻焊盘中的较大直径来获得，该区域将在层压粘合剂期间填充层压粘合剂 层压工艺使焊盘与通孔镀铜绝缘。
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公开(公告)号：US4521262A
公开(公告)日：1985-06-04
申请号：US439333
申请日：1983-01-10
申请人： Peter P. Pellegrino
发明人： Peter P. Pellegrino
CPC分类号： H05K3/429 , H05K1/0287 , H05K1/029 , H05K1/116 , H05K1/0298 , H05K2201/0376 , H05K2201/09454 , H05K2201/09718 , H05K2201/09945 , H05K2203/107 , H05K2203/175 , H05K3/06 , Y10T29/49165
摘要： The present invention contemplates fabrication of a printed circuit board blank having a predetermined pattern of pads and interconnecting conductive pathways, preferably (but not necessarily) flush with the face of the insulating substrate. To fabricate a finished circuit board of any desired circuit configuration, the printed circuit board blank is coated with a photoresist and exposed so that upon development of the photoresist and etching in accordance with the developed pattern, the interconnecting conductive pathways between pads will be selectively etched away so that only those interconnects for the desired circuit pattern remain. While contact printing or image exposure systems may be used to expose the photoresist, computer controlled raster scan laser printers offer the combination of speed and versatility, as the predetermined starting matrix of the invention is highly conducive to computer aided design, and the percentage of circuit board area required for exposure is very small compared to normal copper-clad board fabrication techniques. For multilayer printed circuit boards, registration apertures are provided in each board layer for alignment purposes. Interconnects between boards are made by drilling through selective pads and plating the through holes to interconnect the various board layers. Isolation of any layer of any plated through hole may be obtained by either isolation of the pad (removal of all pad interconnects) at the through hole, or alternatively by etching a larger diameter in the pad which region will be filled with laminating adhesive during the lamination process to insulate the pad from the through hole copper plating.
摘要翻译： 本发明考虑制造具有预定图案的焊盘和互连导电路径的印刷电路板坯料，优选（但不一定）与绝缘衬底的表面齐平。 为了制造任何所需电路结构的成品电路板，印刷电路板坯体被涂覆有光致抗蚀剂并暴露，使得在显影光刻胶和根据显影图案进行蚀刻时，焊盘之间的互连导电路径将被选择性地蚀刻 使得仅保留用于所需电路图案的那些互连。 虽然接触式印刷或图像曝光系统可用于曝光光致抗蚀剂，但是由于本发明的预定起始矩阵高度有利于计算机辅助设计，所以计算机控制的光栅扫描激光打印机提供了速度和多功能性的组合，并且电路的百分比 与正常的铜包覆板制造技术相比，曝光所需的板面积非常小。 对于多层印刷电路板，在每个板层中设置配准孔用于对准目的。 板之间的互连是通过选择性焊盘钻孔和电镀通孔来互连各个板层而制成的。 任何电镀通孔的任何层的隔离可以通过在通孔处隔离焊盘（去除所有焊盘互连）来获得，或者通过蚀刻焊盘中的较大直径来获得，该区域将在层压粘合剂期间填充层压粘合剂 层压工艺使焊盘与通孔镀铜绝缘。
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公开(公告)号：US4174261A
公开(公告)日：1979-11-13
申请号：US895744
申请日：1978-04-13
申请人： Peter P. Pellegrino
发明人： Peter P. Pellegrino
摘要： Methods and apparatus for providing high and uniform processing rates for electroplating, deplating, etching and the like, substantially independent of the surface geometries of the article subjected to the process. In an electroplating application, the article to be plated is supported on a cathode so the electrolyte may be forcibly sprayed on the article from an array of spray nozzles adjacent the surface thereof. Intermixed with the array of spray nozzles may be a second array of openings providing suction to locally remove most of the sprayed electrolyte after impingment on the work piece. In this manner most of the spent electrolyte is removed from the work piece locally so that it is not available to flow down the work piece to shield the surface thereof from the spray of lower nozzles. One or more additional intermixed arrays of delivery ports may also be used to deliver such things as inert gases, brighteners, polishing media, air under pressure to increase agitation, etc., either on a continuous basis or on an intermittent basis as desired. Uniformity over the work piece area is assured by random oscillation of the work piece in an amount on the order of the nozzle spacing. The methods and apparatus are applicable to other electrical processes such as deplating, and non-electrical processes such as etching and cleaning.
摘要翻译： 用于为电镀，脱镀，蚀刻等提供高且均匀的加工速率的方法和装置，基本上与经受该工艺的制品的表面几何形状无关。 在电镀应用中，要镀覆的制品被支撑在阴极上，使得电解质可以从邻近其表面的喷嘴阵列被强制喷射在制品上。 与喷嘴阵列混合可以是第二阵列的开口，其提供抽吸以在冲击在工件上之后局部地去除大部分喷射的电解质。 以这种方式，大部分废电解质被局部地从工件上移除，使得它不能从工件流下来以防止其表面与下喷嘴的喷射。 输送口的一个或多个另外的混合排列也可以用于在需要时连续地或间歇地输送诸如惰性气体，增亮剂，抛光介质，压力下的空气以增加搅拌等。 工件区域的均匀性通过工件的随机振荡以喷嘴间距的顺序确保。 所述方法和装置可应用于其它电气工艺，例如脱镀和非电工艺如蚀刻和清洁。
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