Halogen free flame-retardant thermoplastic moulding compositions based on polyamide with increased glow-wire resistance
    8.
    发明授权
    Halogen free flame-retardant thermoplastic moulding compositions based on polyamide with increased glow-wire resistance 有权
    基于聚酰胺的无卤素阻燃热塑性模塑组合物具有增加的灼热丝电阻

    公开(公告)号:US08362119B2

    公开(公告)日:2013-01-29

    申请号:US11662457

    申请日:2005-08-31

    IPC分类号: C08G18/77

    摘要: The present invention relates to thermoplastic moulding compositions comprising unbranched, thermoplastic polyamide, a phosphinic or diphosphinic salt, a nitrogen-containing flame retardant combination and also at least one oxygen-containing, nitrogen-containing or sulphur-containing metal compound and also to the production and the use of the inventive moulding compositions for production of fibres, of foils and of mouldings of any type.

    摘要翻译: 本发明涉及包含无支链,热塑性聚酰胺,次膦酸盐或二次膦酸盐,含氮阻燃剂组合物以及至少一种含氧,含氮或含硫金属化合物的热塑性模塑组合物,并且还涉及生产 以及本发明的模塑组合物用于生产纤维,箔和任何类型的模制品的用途。

    Molding compositions and their use
    9.
    发明申请
    Molding compositions and their use 审中-公开
    成型组合物及其用途

    公开(公告)号:US20050043443A1

    公开(公告)日:2005-02-24

    申请号:US10919044

    申请日:2004-08-16

    摘要: A thermoplastic glass fibers reinforced molding composition that exhibits improved mechanical properties and resistance to hydrolysis is disclosed. The composition contains at least one thermoplastic polymer, sized glass fibers, and optional conventional additives and auxiliary substances. The sizing agent that is substantially free of emulsifiers not bound to the resin contains (a) at least one epoxide-functional, oligomeric resin, having epoxide group content of 0.15 to 0.75 mole per 100 g of resin, average functionality of at least 2.3 epoxide groups per molecule, (b) at least one epoxide curing agents, and (c) at least one silane coupling agent.

    摘要翻译: 公开了一种具有改进的机械性能和抗水解性的热塑性玻璃纤维增​​强模塑组合物。 该组合物含有至少一种热塑性聚合物,尺寸的玻璃纤维和任选的常规添加剂和辅助物质。 基本上不含与树脂结合的乳化剂的上浆剂​​包含(a)至少一种环氧官能的低聚树脂,其环氧基团含量为每100克树脂0.15至0.75摩尔,平均官能度至少为2.3环氧化物 (b)至少一种环氧化物固化剂,和(c)至少一种硅烷偶联剂。