公开(公告)号：US09360907B2

公开(公告)日：2016-06-07

申请号：US14600667

申请日：2015-01-20

Applicant: QUALCOMM INCORPORATED

Inventor： Paras S. Doshi ,  Ankur Jain ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter ,  Anil Vootukuru ,  Ronald F. Alton ,  Jon J. Anderson

IPC: G06F1/26 ,  G06F1/32 ,  G06F1/20 ,  G06F11/30

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3287 ,  G06F1/3296 ,  G06F11/3031 ,  G06F11/3037 ,  G06F11/3058 ,  Y02D10/126 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract translation: 公开了在便携式计算设备（“PCD”）中实现的用于自适应热管理技术的方法和系统的各种实施例。 值得注意的是，在许多PCD中，与PCD中各种组件相关的温度阈值，例如但不限于芯片结温度，封装封装（“PoP”）存储器温度和器件外表面的“触摸温度” 本身限制了可以利用PCD的性能能力的程度。 对于自适应热管理的方法和系统的各种实施例的优点在于，当违反温度阈值时，PCD的性能只能在授权热攻击之前被尽可能多地牺牲，并且在必要时被清除， 处理组件返回到最大操作功率。

公开(公告)号：US09785209B2

公开(公告)日：2017-10-10

申请号：US14675393

申请日：2015-03-31

Applicant: QUALCOMM INCORPORATED

Inventor： Anil Vootukuru ,  Ankur Jain ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter ,  Christopher Lee Medrano

IPC: G01K13/00 ,  G06F1/20 ,  G05B15/02 ,  G01K7/42 ,  G06F1/32

CPC classification number: G06F1/206 ,  G01K7/427 ,  G01K13/00 ,  G05B15/02 ,  G06F1/203 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/172

Abstract: Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload.

公开(公告)号：US09864647B2

公开(公告)日：2018-01-09

申请号：US14588798

申请日：2015-01-02

Applicant: QUALCOMM INCORPORATED

Inventor： Serag Gadelrab ,  Cristian Duroiu ,  Vinod Chamarty ,  Pooja Sinha ,  John Daniel Chaparro ,  Anil Vootukuru ,  Vinodh Ramesh Cuppu ,  Joseph Schweiray Lee ,  Vinay Mitter ,  Paul Chow ,  Ruolong Liu ,  Johnny Jone Wai Kuan

IPC: G06F11/07 ,  G06F1/08 ,  G06F13/40

CPC classification number: G06F11/0781 ,  G06F1/08 ,  G06F11/0742 ,  G06F11/0793 ,  G06F13/4022

Abstract: A method and system for adjusting bandwidth within a portable computing device based on danger signals monitored from one on more elements of the portable computing device are disclosed. A danger level of an unacceptable deadline miss (“UDM”) element of the portable computing device may be determined with a danger level sensor within the UDM element. Next, a quality of service (“QoS”) controller may adjust a magnitude for one or more danger levels received based on the UDM element type that generated the danger level and based on a potential fault condition type associated with the particular danger level. The danger levels received from one UDM element may be mapped to at least one of another UDM element and a non-UDM element. A quality of service policy for each UDM element and non-UDM element may be mapped in accordance with the danger levels.