公开(公告)号：US09465423B2

公开(公告)日：2016-10-11

申请号：US14690330

申请日：2015-04-17

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Paras S. Doshi ,  Ankur Jain ,  Vinay Mitter ,  Richard A. Stewart

IPC: G06F1/00 ,  G06F1/26 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/26 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F2217/80 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

公开(公告)号：US09360907B2

公开(公告)日：2016-06-07

申请号：US14600667

申请日：2015-01-20

Applicant: QUALCOMM INCORPORATED

Inventor： Paras S. Doshi ,  Ankur Jain ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter ,  Anil Vootukuru ,  Ronald F. Alton ,  Jon J. Anderson

IPC: G06F1/26 ,  G06F1/32 ,  G06F1/20 ,  G06F11/30

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3287 ,  G06F1/3296 ,  G06F11/3031 ,  G06F11/3037 ,  G06F11/3058 ,  Y02D10/126 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract translation: 公开了在便携式计算设备（“PCD”）中实现的用于自适应热管理技术的方法和系统的各种实施例。 值得注意的是，在许多PCD中，与PCD中各种组件相关的温度阈值，例如但不限于芯片结温度，封装封装（“PoP”）存储器温度和器件外表面的“触摸温度” 本身限制了可以利用PCD的性能能力的程度。 对于自适应热管理的方法和系统的各种实施例的优点在于，当违反温度阈值时，PCD的性能只能在授权热攻击之前被尽可能多地牺牲，并且在必要时被清除， 处理组件返回到最大操作功率。

公开(公告)号：US20140240031A1

公开(公告)日：2014-08-28

申请号：US13779606

申请日：2013-02-27

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Paras S. Doshi ,  Ankur Jain ,  Priyank Kumar ,  Vinay Mitter ,  Richard A. Stewart

IPC: G05D23/20

CPC classification number: G05D23/20 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for tuning a thermal strategy of a portable computing device (“PCD”) based on PCD location information. In an exemplary embodiment, it may be recognized that the PCD is in an active state and producing thermal energy, or that one or more thermally aggressive components of the PCD are operating near temperature thresholds for efficient operation. The PCD location information is used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or may use the estimated ambient temperature as an input to a program, application, or algorithm running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive PCD components.

Abstract translation: 基于PCD位置信息来调整便携式计算设备（“PCD”）的热策略的方法和系统的各种实施例。 在示例性实施例中，可以认识到PCD处于活动状态并产生热能，或者PCD的一个或多个热攻击性部件在温度阈值附近操作以进行有效的操作。 PCD位置信息用于估计PCD暴露于的环境温度。 某些实施例可以简单地呈现用于用户利益的估计环境温度，或者可以将估计的环境温度用作在PCD上运行的程序，应用或算法的输入。 可以设想，系统和方法的某些实施例可以使用估计的环境温度来调节PCD中的温度阈值，对于热管理策略来管理热侵蚀性PCD部件。

公开(公告)号：US20140163765A1

公开(公告)日：2014-06-12

申请号：US13707921

申请日：2012-12-07

Applicant: QUALCOMM INCORPORATED

Inventor： Ankur Jain ,  Paras S. Doshi ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter

IPC: G05D23/19 ,  G06F15/00 ,  G01K7/00

CPC classification number: G05D23/19 ,  G01K7/00 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F15/00 ,  Y02D10/126 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for estimating environmental ambient temperature of a portable computing device (“PCD”) from temperature measurements taken within the PCD are disclosed. In an exemplary embodiment, it may be recognized that the PCD is in an idle state, thus producing little or no thermal energy. Temperature measurements are then taken from temperature sensors within the PCD and used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or use the estimated ambient temperature as an input to a program or application running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive processing components.

Abstract translation: 公开了用于从PCD中进行的温度测量估计便携式计算设备（“PCD”）的环境温度的方法和系统的各种实施例。 在示例性实施例中，可以认识到PCD处于空闲状态，因此产生很少的或没有热能。 然后从PCD内的温度传感器获取温度测量值，并用于估算PCD暴露于的环境温度。 某些实施例可以简单地使估计的环境温度为用户的利益或使用估计的环境温度作为在PCD上运行的程序或应用的输入。 可以设想，系统和方法的某些实施例可以使用估计的环境温度来调整PCD中的温度阈值，热管理策略对该温度阈值控制热侵蚀性处理组件。

公开(公告)号：US09430014B2

公开(公告)日：2016-08-30

申请号：US13945181

申请日：2013-07-18

Applicant: Qualcomm Incorporated

Inventor： Ankur Jain ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter ,  Henri Begin ,  Praveen Chidambaram

IPC: G06F1/32

CPC classification number: G06F1/32 ,  G06F1/3203 ,  G06F1/3243

Abstract: Various embodiments of methods and systems for idle state optimization in a portable computing device (“PCD”) are disclosed. An exemplary method includes comparing an aggregate power consumption level for all processing cores in the PCD to a power budget and, if there is available headroom in the power budget, transitioning cores operating in a first idle state to a different idle state. In doing so, the latency value associated with bringing the transitioned cores out of an idle state and into an active state, should the need arise, may be reduced. The result is that user experience and QoS may be improved as an otherwise idle core in an idle state with a long latency time may be better positioned to quickly transition to an active state and process a workload.

Abstract translation: 公开了便携式计算设备（“PCD”）中用于空闲状态优化的方法和系统的各种实施例。 一种示例性方法包括将PCD中的所有处理核心的总功耗级别与功率预算进行比较，并且如果在功率预算中存在可用的余量，则将在第一空闲状态中操作的核心转换到不同的空闲状态。 在这样做时，如果需要，可以减少与将转换的核心从空闲状态转变为活动状态相关联的延迟值。 结果是可以改善用户体验和QoS，因为空闲状态下的空闲核心具有长延迟时间可能更好地定位成快速转换到活动状态并处理工作负载。

公开(公告)号：US09116677B2

公开(公告)日：2015-08-25

申请号：US13773862

申请日：2013-02-22

Applicant: QUALCOMM Incorporated

Inventor： Ankur Jain ,  Paras S. Doshi ,  Vinay Mitter ,  Unni Vadakkanmaruveedu

IPC: G06F1/16 ,  G06F1/26 ,  G06F1/20

CPC classification number: G06F1/26 ,  G06F1/1632 ,  G06F1/20 ,  G06F1/206 ,  Y02D10/16

Abstract: A method and system for managing a thermal policy of a receiving device that couples to a portable computing device (PCD) includes automatically detecting a presence of the PCD. After detecting the presence of the PCD, a command to deactivate a thermal sensor and to deactivate a power supply within the PCD may be issued. The thermal policy manager module of the receiving device may issue a command to adjust an operating condition of a processor within the PCD if a temperature value reaches a predetermined value. The thermal policy manager module may also adjust operation of an active cooling device if the temperature value sensed by a sensor within the PCD reaches a predetermined value. The receiving device may include at least one of a docking station, a tablet personal computer, a laptop personal computer, a desktop personal computer, a portable media player, a portable television, and a printer.

Abstract translation: 用于管理耦合到便携式计算设备（PCD）的接收设备的热策略的方法和系统包括自动检测PCD的存在。 在检测到PCD的存在之后，可以发出禁用热传感器和停用PCD内的电源的命令。 如果温度值达到预定值，则接收设备的热策略管理器模块可以发出调整PCD内处理器的工作状态的命令。 如果由PCD内的传感器感测到的温度值达到预定值，则热策略管理器模块还可以调节主动冷却装置的操作。 接收设备可以包括对接站，平板电脑，膝上型个人计算机，台式个人计算机，便携式媒体播放器，便携式电视和打印机中的至少一个。

公开(公告)号：US10267545B2

公开(公告)日：2019-04-23

申请号：US15086039

申请日：2016-03-30

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter

IPC: G06F1/20 ,  F25B21/04 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32

Abstract: An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.

公开(公告)号：US10152099B2

公开(公告)日：2018-12-11

申请号：US14594984

申请日：2015-01-12

Applicant: QUALCOMM Incorporated

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Jon James Anderson ,  Vinay Mitter ,  Peng Wang

IPC: G06F1/20 ,  H05K7/20 ,  C09K5/14 ,  G06F1/16 ,  G06F1/18 ,  F28F13/00

Abstract: An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

公开(公告)号：US09864647B2

公开(公告)日：2018-01-09

申请号：US14588798

申请日：2015-01-02

Applicant: QUALCOMM INCORPORATED

Inventor： Serag Gadelrab ,  Cristian Duroiu ,  Vinod Chamarty ,  Pooja Sinha ,  John Daniel Chaparro ,  Anil Vootukuru ,  Vinodh Ramesh Cuppu ,  Joseph Schweiray Lee ,  Vinay Mitter ,  Paul Chow ,  Ruolong Liu ,  Johnny Jone Wai Kuan

IPC: G06F11/07 ,  G06F1/08 ,  G06F13/40

CPC classification number: G06F11/0781 ,  G06F1/08 ,  G06F11/0742 ,  G06F11/0793 ,  G06F13/4022

Abstract: A method and system for adjusting bandwidth within a portable computing device based on danger signals monitored from one on more elements of the portable computing device are disclosed. A danger level of an unacceptable deadline miss (“UDM”) element of the portable computing device may be determined with a danger level sensor within the UDM element. Next, a quality of service (“QoS”) controller may adjust a magnitude for one or more danger levels received based on the UDM element type that generated the danger level and based on a potential fault condition type associated with the particular danger level. The danger levels received from one UDM element may be mapped to at least one of another UDM element and a non-UDM element. A quality of service policy for each UDM element and non-UDM element may be mapped in accordance with the danger levels.

公开(公告)号：US09037882B2

公开(公告)日：2015-05-19

申请号：US13779153

申请日：2013-02-27

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Paras S. Doshi ,  Ankur Jain ,  Vinay Mitter ,  Richard A. Stewart

IPC: G06F1/00 ,  G06F1/26 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/26 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F2217/80 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

Abstract translation: 公开了基于功率电平计算的便携式计算设备（“PCD”）中用于热能管理的方法和系统的各种实施例。 示例性方法包括将瞬时操作温度和有功电力供应水平跟踪到一个或多个组件。 通过对环境温度的估计或测量，可以使用瞬时工作温度值和有功电源电平值来计算瞬时热阻值。 在管理热能产生的情况下，可以使用目标工作温度与环境温度和瞬时热阻值来求解最佳供电水平。 然后可以基于计算的最佳电源电平来调整有功电源电平。