Mop head base
    4.
    外观设计

    公开(公告)号:USD1048630S1

    公开(公告)日:2024-10-22

    申请号:US29954406

    申请日:2024-07-26

    申请人: Yun Zhang

    设计人: Yun Zhang

    摘要: FIG. 1 is a front, top and right-side perspective view of the mop head base showing my new design;
    FIG. 2 is a front elevation view thereof;
    FIG. 3 is a rear elevation view thereof;
    FIG. 4 is a left side elevation view thereof;
    FIG. 5 is a right side elevation view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is a rear, bottom and right-side perspective view thereof.
    The broken lines throughout the drawing figures depict portions of the mop head base that form no part of the claimed design.

    Energy-aware virtual infrastructure

    公开(公告)号:US10101787B1

    公开(公告)日:2018-10-16

    申请号:US13076747

    申请日:2011-03-31

    IPC分类号: G06F1/32

    摘要: Example embodiments of the present invention provide a method, apparatus and computer program product for determining a share of power consumption by an application executing on a server. The method includes obtaining metrics relating to operation of the server and obtaining metrics relating to server resource utilization attributable to the application. A transformation is then performed using the metrics relating to operation of the server and server resource utilization attributable to the application to determine the respective share of power consumption by the application executing on the server. Additionally, greenhouse-gases attributable to the application also may be calculated.

    Method of interest point matching for images
    8.
    发明授权
    Method of interest point matching for images 有权
    图像的兴趣点匹配方法

    公开(公告)号:US09020274B2

    公开(公告)日:2015-04-28

    申请号:US12775240

    申请日:2010-05-06

    申请人: Zhen Xiong Yun Zhang

    发明人: Zhen Xiong Yun Zhang

    IPC分类号: G06K9/46 G06T7/00 G06K9/62

    摘要: A computer implemented method for point matching comprising providing a pair of images captured, selecting first and second sets of interest points from the images; constructing a control network of super points for each set of interest points; assigning a position, with respect to the closest network control point of each control network, to other interest points on the images; locating conjugate points for each other interest point of each set based on its assigned position; and adding the conjugate points to the control network.

    摘要翻译: 一种用于点匹配的计算机实现方法,包括提供所捕获的一对图像,从所述图像中选择第一和第二组感兴趣点; 为每组兴趣点构建超级点控制网络; 将关于每个控制网络的最接近的网络控制点的位置分配给图像上的其他兴趣点; 根据其分配的位置定位每组的每个其他兴趣点的共轭点; 并将共轭点添加到控制网络。

    Phosphine-containing hydrogel contact lenses
    9.
    发明授权
    Phosphine-containing hydrogel contact lenses 有权
    含磷的水凝胶隐形眼镜

    公开(公告)号:US08642677B2

    公开(公告)日:2014-02-04

    申请号:US13404028

    申请日:2012-02-24

    IPC分类号: C08F8/00

    摘要: Hydrogel contact lenses that are derived from a polymerizable composition including at least one hydrophilic monomer and at least one phosphine-containing component are described. The hydrogel of the contact lenses can be a silicone hydrogel or a non-silicone hydrogel. Use of polymerizable compositions comprising a phosphine-containing component can be cured under both inert and air atmospheres, and can be used to form hydrogel contact lenses having improved shape retention properties, having improved resistance to discoloration. Batches of hydrogel contact lenses and methods of making hydrogel contact lenses are also described.

    摘要翻译: 描述了衍生自包含至少一种亲水性单体和至少一种含膦组分的可聚合组合物的水凝胶隐形眼镜。 隐形眼镜的水凝胶可以是硅酮水凝胶或非硅氧水凝胶。 包含含膦组分的可聚合组合物的使用可以在惰性和空气气氛下固化,并且可用于形成具有改善的变色保持性能的具有改进的抗变色性的水凝胶隐形眼镜。 还描述了水凝胶隐形眼镜的批次和制备水凝胶隐形眼镜的方法。

    COPPER FILLING OF THROUGH SILICON VIAS
    10.
    发明申请
    COPPER FILLING OF THROUGH SILICON VIAS 审中-公开
    铜填充硅橡胶

    公开(公告)号:US20130199935A1

    公开(公告)日:2013-08-08

    申请号:US13699910

    申请日:2011-05-24

    IPC分类号: C25D3/38

    摘要: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature. The deposition composition comprises (a) a source of copper ions; (b) an acid selected from among an inorganic acid, organic sulfonic acid, and mixtures thereof; (c) an organic disulfide compound; (d) a compound selected from the group consisting of a reaction product of benzyl chloride and hydroxyethyl polyethyleneimine, a quaternized dipyridyl compound, and a combination thereof; and (d) chloride ions.

    摘要翻译: 一种用于在半导体集成电路器件衬底中金属化硅通孔特征的方法。 该方法包括将半导体集成电路器件衬底浸入电解铜沉积组合物中,其中贯穿硅通孔特征具有介于1微米至100微米之间的入口尺寸,20微米至750微米的深度尺寸,以及大于 约2:1; 向电解沉积组合物供给电流以将铜金属沉积到底部和侧壁上以进行自底向上填充,由此产生铜填充的通孔特征。 沉积组合物包含(a)铜离子源; (b)选自无机酸,有机磺酸及其混合物的酸; (c)有机二硫化物; (d)选自苄基氯和羟乙基亚乙基亚胺的反应产物,季铵化吡啶基化合物及其组合的化合物; 和(d)氯离子。