公开(公告)号：US09960145B2

公开(公告)日：2018-05-01

申请号：US15229780

申请日：2016-08-05

申请人： Qorvo US, Inc.

发明人： Julio C. Costa ,  Thomas Scott Morris ,  Jonathan Hale Hammond ,  David Jandzinski ,  Stephen Parker ,  Jon Chadwick

IPC分类号： H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/05 ,  H01L24/16 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16258 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/83

摘要： A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

公开(公告)号：US09899350B2

公开(公告)日：2018-02-20

申请号：US15229780

申请日：2016-08-05

申请人： Qorvo US, Inc.

发明人： Julio C. Costa ,  Thomas Scott Morris ,  Jonathan Hale Hammond ,  David Jandzinski ,  Stephen Parker ,  Jon Chadwick

IPC分类号： H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/05 ,  H01L24/16 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16258 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/83

摘要： A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

公开(公告)号：US20160343592A1

公开(公告)日：2016-11-24

申请号：US15229780

申请日：2016-08-05

申请人： Qorvo US, Inc.

发明人： Julio C. Costa ,  Thomas Scott Morris ,  Jonathan Hale Hammond ,  David Jandzinski ,  Stephen Parker ,  Jon Chadwick

IPC分类号： H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/29

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/05 ,  H01L24/16 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16258 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/83

摘要： A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

摘要翻译： 公开了一种具有至少一个倒装芯片的倒装芯片模块。 倒装芯片模块包括具有顶表面的载体，第一模具化合物位于顶表面上。 第一模具化合物设置在载体的顶表面上。 第一变薄的倒装芯片模具位于第一模具化合物的第一部分之上，其中互连件延伸穿过第一部分到顶部表面，其中模具化合物的第一部分填充第一倒装芯片模具和顶部表面之间的区域。 第二模具化合物位于衬底上并且在第一倒装芯片模具上方提供第一凹部，其中第一凹部延伸到第一倒装芯片模具的第一模具表面。 第三模具化合物位于第一凹部中并且覆盖倒装芯片裸片的暴露表面。

公开(公告)号：US09929125B2

公开(公告)日：2018-03-27

申请号：US15229780

申请日：2016-08-05

申请人： Qorvo US, Inc.

发明人： Julio C. Costa ,  Thomas Scott Morris ,  Jonathan Hale Hammond ,  David Jandzinski ,  Stephen Parker ,  Jon Chadwick

IPC分类号： H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16

摘要： A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.