THERMAL ENERGY ABSORBING STRUCTURES
    2.
    发明申请

    公开(公告)号:US20180120071A1

    公开(公告)日:2018-05-03

    申请号:US15342011

    申请日:2016-11-02

    申请人: Raytheon Company

    IPC分类号: F42B15/34 F25D5/00 F25D19/00

    摘要: Thermally-sensitive hardware is at least partially enclosed within a container in which reactants for a solid-solid endothermic chemical reaction are disposed, surrounding at least a portion of the thermally-sensitive hardware. The reactants or a structure including the reactants are positioned between the thermally-sensitive hardware and a heat source, such as an external surface of a missile traveling through atmospheric gases at extremely high speed and experiencing extreme frictional heating. The reactants absorb heat during the solid-solid endothermic reaction to thermally protect the thermally-sensitive hardware. The reactants are preferably selected to absorb heat of at least 5 kilo-Joules per gram (kJ/g) during the solid-solid endothermic chemical reaction.

    FERROCENYL BONDING AGENT OXIDIZERS
    4.
    发明申请
    FERROCENYL BONDING AGENT OXIDIZERS 审中-公开
    FERROCENYL结合剂氧化剂

    公开(公告)号:US20160159708A1

    公开(公告)日:2016-06-09

    申请号:US14563348

    申请日:2014-12-08

    申请人: Raytheon Company

    IPC分类号: C06B45/10 C06B43/00 C06B29/22

    摘要: Disclosed herein are energetic compositions and methods of making thereof. A composition includes perchlorate or nitrate containing oxidizer particles, a polymeric binder, and a borylated ferrocene derivative bonding agent bonded to a surface of at least a portion the perchlorate or nitrate containing oxidizer particles to form a Lewis complex.

    摘要翻译: 本文公开了能量组合物及其制备方法。 组合物包含与高氯酸盐或含硝酸盐的氧化剂颗粒的至少一部分的表面结合以形成路易斯络合物的高氯酸盐或含硝酸盐的氧化剂颗粒,聚合物粘合剂和硼化二茂铁衍生物粘合剂。

    METHODS TO DESENSITIZE HYDRAZINIUM NITROFORMATE (HNF)
    5.
    发明申请
    METHODS TO DESENSITIZE HYDRAZINIUM NITROFORMATE (HNF) 有权
    硝酸氢铵(HNF)

    公开(公告)号:US20150315093A1

    公开(公告)日:2015-11-05

    申请号:US14268470

    申请日:2014-05-02

    申请人: RAYTHEON COMPANY

    IPC分类号: C06B45/10 C06B45/32

    摘要: Disclosed herein are energetic compositions and methods of making thereof. A composition includes hydrazinium nitroformate (HNF) particles dispersed in a polymeric binder and a bonding agent bonded to a surface of at least a portion the HNF particles. The bonding agent disclosed is a Lewis acid.

    摘要翻译: 本文公开了能量组合物及其制备方法。 一种组合物包括分散在聚合物粘合剂中的硝基甲酸肼(HNF)颗粒和与HNF颗粒的至少一部分表面结合的粘合剂。 所公开的粘结剂是路易斯酸。

    Quantum molecular based thermal interface material

    公开(公告)号:US10388587B1

    公开(公告)日:2019-08-20

    申请号:US16106618

    申请日:2018-08-21

    申请人: RAYTHEON COMPANY

    摘要: A thermal interface structure includes a first surface including a surface of a heat generating device, a first surface binding polymer bonded to the first surface, a second surface including a surface of a heat sink, and a second surface binding polymer bonded to the second surface. The first surface binding polymer and the second surface binding polymer cross-link to one another to form a covalently bonded, cross-linked section that creates a thermal interface material that forms a continuous molecular connection between the first surface and the second surface.

    Ferrocenyl bonding agent oxidizers

    公开(公告)号:US10196324B2

    公开(公告)日:2019-02-05

    申请号:US14563348

    申请日:2014-12-08

    申请人: Raytheon Company

    摘要: Disclosed herein are energetic compositions and methods of making thereof. A composition includes perchlorate or nitrate containing oxidizer particles, a polymeric binder, and a borylated ferrocene derivative bonding agent bonded to a surface of at least a portion the perchlorate or nitrate containing oxidizer particles to form a Lewis complex.

    Separable component assembly having reduced seal stiction

    公开(公告)号:US11253963B1

    公开(公告)日:2022-02-22

    申请号:US16995737

    申请日:2020-08-17

    申请人: Raytheon Company

    IPC分类号: B23P19/04 F16J15/06 F02K9/34

    摘要: A separable component assembly is disclosed. The separable component assembly can include a first component having a first interface portion. The separable component assembly can also include a second component coupled to the first component. The second component can have a second interface portion. In addition, the separable component assembly can include a seal disposed between the first and second interface portions. The seal can have a first interface surface associated with the first interface portion. The seal can also have a second interface surface in contact with the second interface portion. Additionally, the seal can have a peel initiator defining a discontinuity in a portion of the second interface surface. Upon separation of the first and second components from one another, the discontinuity can create a stress concentration in the second interface surface that initiates peeling of the second interface surface away from the second interface portion.