Quantum molecular based thermal interface material

    公开(公告)号:US10388587B1

    公开(公告)日:2019-08-20

    申请号:US16106618

    申请日:2018-08-21

    申请人: RAYTHEON COMPANY

    摘要: A thermal interface structure includes a first surface including a surface of a heat generating device, a first surface binding polymer bonded to the first surface, a second surface including a surface of a heat sink, and a second surface binding polymer bonded to the second surface. The first surface binding polymer and the second surface binding polymer cross-link to one another to form a covalently bonded, cross-linked section that creates a thermal interface material that forms a continuous molecular connection between the first surface and the second surface.