公开(公告)号：US20180033709A1

公开(公告)日：2018-02-01

申请号：US15662127

申请日：2017-07-27

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Soshi KURODA ,  Tatsuya KOBAYASHI ,  Takanori AOKI

IPC: H01L23/31 ,  H01L23/498 ,  H01L29/06 ,  H01L21/56 ,  H01L23/535 ,  H01L21/66 ,  H01L23/29 ,  H01L21/78 ,  H01L23/00 ,  H01L23/58

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L22/32 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/535 ,  H01L23/562 ,  H01L23/585 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L29/0649 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/0612 ,  H01L2224/06135 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/30183 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/10155 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0655

Abstract: To provide a semiconductor device having improved reliability. The semiconductor device has a wiring board, bonding land, semiconductor chip mounted on the wiring board via an adhesive layer and having a pad electrode, bonding wire connecting the pad electrode with the bonding land, and sealing body. The sealing body is, in a circuit formation region, in contact with an organic protection film and, in a scribe region and a region between the pad electrode and the scribe region, in contact with a surface protection film while not in contact with the organic protection film. A first side surface is closer to the circuit formation region side than a second one. The adhesive layer covers entirety of the semiconductor chip back surface and the second side surface of the semiconductor chip. The first side surface is in contact with the sealing body without being covered with the adhesive layer.