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1.发明授权Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the same 有权具有第一管芯的集成电路模块，具有与第二管芯堆叠的功率放大器及其制造方法公开(公告)号：US09583471B2
公开(公告)日：2017-02-28
申请号：US14595451
申请日：2015-01-13
Applicant: RF Micro Devices, Inc.
Inventor： Douglas Andrew Teeter , Ming Ji , Bhavin Shah , Mohsen Haji-Rahim , William Kent Braxton
IPC: H01L25/04 , H01L25/065 , H01L25/18 , H03F3/195 , H01L25/00 , H01L23/00 , H01L23/40 , H01L25/075 , H01L23/66
CPC classification number: H01L25/18 , H01L23/4012 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/043 , H01L25/0652 , H01L25/0657 , H01L25/0756 , H01L25/50 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48106 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/49096 , H01L2224/49111 , H01L2224/4917 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/10329 , H01L2924/141 , H01L2924/143 , H01L2924/19105 , H01L2924/19107 , H01L2924/20102 , H01L2924/20103 , H01L2924/2064 , H03F3/195 , H03F2200/531 , H01L2924/20753 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
Abstract: Disclosed is an integrated circuit module that includes a first die having a plurality of hot regions and at least one cool region when operating under normal conditions. The first die with a top surface includes at least one power amplifier that resides in the plurality of hot regions. The integrated circuit module also includes a second die. The second die has a bottom surface, which is adhered to the top surface of the first die, wherein any portion of the bottom surface of the second die that is adhered to the top surface of the first die resides exclusively on the at least one cool region. In at least one embodiment, the first die is an RF power amplifier die and the second die is a controller die having control circuitry configured to control the at least one power amplifier that is an RF power amplifier type.
Abstract translation: 公开了一种集成电路模块，其包括具有多个热区域的第一管芯和在正常条件下操作时的至少一个冷却区域。 具有顶表面的第一管芯包括驻留在多个热区域中的至少一个功率放大器。 集成电路模块还包括第二管芯。 第二模具具有底表面，其粘附到第一模具的顶表面，其中粘附到第一模具的顶表面的第二模具的底表面的任何部分仅在至少一个冷却 地区。 在至少一个实施例中，第一裸片是RF功率放大器芯片，而第二裸片是具有控制电路的控制器芯片，控制电路配置成控制作为RF功率放大器类型的至少一个功率放大器。
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公开(公告)号：US09423433B2
公开(公告)日：2016-08-23
申请号：US14599674
申请日：2015-01-19
Applicant: RF Micro Devices, Inc.
Inventor： Douglas Andrew Teeter , Ming Ji , Praveen Varma Nadimpalli
CPC classification number: G01R21/10 , H03F3/195 , H03F3/245 , H03F2200/204 , H03F2200/411 , H03F2200/451 , H03F2200/465 , H03F2200/541 , H03G3/3036
Abstract: An RF electronics module includes a grounding plate, a non-conductive substrate, a number of conductive vias, RF PA circuitry, and RF power detection circuitry. The non-conductive substrate is over the grounding plate. The conductive vias extend parallel to one another from a surface of the non-conductive substrate opposite the grounding plate through the non-conductive substrate to the grounding plate. The RF PA circuitry is coupled to the grounding plate through a first one of the conductive vias. The RF power detection circuitry is coupled to a second one of the conductive vias and configured to measure a signal induced in the second one of the conductive vias due to electromagnetic coupling with the first one of conductive vias. The first one of the conductive vias is adjacent to the second one of the conductive vias.
Abstract translation: RF电子模块包括接地板，非导电衬底，多个导电通孔，RF PA电路和RF功率检测电路。 非导电衬底在接地板上。 导电通孔从与非接触板相对的非导电衬底的表面通过非导电衬底彼此平行地延伸到接地板。 RF PA电路通过第一导电通孔耦合到接地板。 RF功率检测电路耦合到导电通孔中的第二个，并且被配置为测量由于与第一导电通孔的电磁耦合而在第二导电通孔中感应的信号。 导电通孔中的第一个与第二个导电通孔相邻。
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3.发明申请INTEGRATED CIRCUIT MODULE HAVING A FIRST DIE WITH A POWER AMPLIFIER STACKED WITH A SECOND DIE AND METHOD OF MAKING THE SAME 有权具有第二模块的功率放大器的第一模块的集成电路模块及其制造方法公开(公告)号：US20150200189A1
公开(公告)日：2015-07-16
申请号：US14595451
申请日：2015-01-13
Applicant: RF Micro Devices, Inc.
Inventor： Douglas Andrew Teeter , Ming Ji , Bhavin Shah , Mohsen Haji-Rahim , William Kent Braxton
CPC classification number: H01L25/18 , H01L23/4012 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/043 , H01L25/0652 , H01L25/0657 , H01L25/0756 , H01L25/50 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48106 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/49096 , H01L2224/49111 , H01L2224/4917 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/10329 , H01L2924/141 , H01L2924/143 , H01L2924/19105 , H01L2924/19107 , H01L2924/20102 , H01L2924/20103 , H01L2924/2064 , H03F3/195 , H03F2200/531 , H01L2924/20753 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
Abstract: Disclosed is an integrated circuit module that includes a first die having a plurality of hot regions and at least one cool region when operating under normal conditions. The first die with a top surface includes at least one power amplifier that resides in the plurality of hot regions. The integrated circuit module also includes a second die. The second die has a bottom surface, which is adhered to the top surface of the first die, wherein any portion of the bottom surface of the second die that is adhered to the top surface of the first die resides exclusively on the at least one cool region. In at least one embodiment, the first die is an RF power amplifier die and the second die is a controller die having control circuitry configured to control the at least one power amplifier that is an RF power amplifier type.
Abstract translation: 公开了一种集成电路模块，其包括具有多个热区域的第一管芯和在正常条件下操作时的至少一个冷却区域。 具有顶表面的第一管芯包括驻留在多个热区域中的至少一个功率放大器。 集成电路模块还包括第二管芯。 第二模具具有底表面，其粘附到第一模具的顶表面，其中粘附到第一模具的顶表面的第二模具的底表面的任何部分仅在至少一个冷却 地区。 在至少一个实施例中，第一裸片是RF功率放大器芯片，而第二裸片是具有控制电路的控制器芯片，控制电路配置成控制作为RF功率放大器类型的至少一个功率放大器。
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公开(公告)号：US20150204940A1
公开(公告)日：2015-07-23
申请号：US14599674
申请日：2015-01-19
Applicant: RF Micro Devices, Inc.
Inventor： Douglas Andrew Teeter , Ming Ji , Praveen Varma Nadimpalli
CPC classification number: G01R21/10 , H03F3/195 , H03F3/245 , H03F2200/204 , H03F2200/411 , H03F2200/451 , H03F2200/465 , H03F2200/541 , H03G3/3036
Abstract: An RF electronics module includes a grounding plate, a non-conductive substrate, a number of conductive vias, RF PA circuitry, and RF power detection circuitry. The non-conductive substrate is over the grounding plate. The conductive vias extend parallel to one another from a surface of the non-conductive substrate opposite the grounding plate through the non-conductive substrate to the grounding plate. The RF PA circuitry is coupled to the grounding plate through a first one of the conductive vias. The RF power detection circuitry is coupled to a second one of the conductive vias and configured to measure a signal induced in the second one of the conductive vias due to electromagnetic coupling with the first one of conductive vias. The first one of the conductive vias is adjacent to the second one of the conductive vias.
Abstract translation: RF电子模块包括接地板，非导电衬底，多个导电通孔，RF PA电路和RF功率检测电路。 非导电衬底在接地板上。 导电通孔从与非接触板相对的非导电衬底的表面通过非导电衬底彼此平行地延伸到接地板。 RF PA电路通过第一导电通孔耦合到接地板。 RF功率检测电路耦合到导电通孔中的第二个，并且被配置为测量由于与第一导电通孔的电磁耦合而在第二导电通孔中感应的信号。 导电通孔中的第一个与第二个导电通孔相邻。
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