公开(公告)号：US20140117503A1

公开(公告)日：2014-05-01

申请号：US13661025

申请日：2012-10-25

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC

Inventor： Mark S. OLIVER ,  Michael K. GALLAGHER

IPC: H01L21/58 ,  H01L29/06

CPC classification number: H01L21/6836 ,  C09D171/02 ,  C09J5/00 ,  C09J11/08 ,  C09J2203/326 ,  C09J2205/302 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Compositions suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate, are disclosed. Methods of temporarily bonding two surfaces, such as the active side of a wafer and a substrate using the compositions disclosed herein are also provided.

Abstract translation: 公开了适用于暂时粘合两个表面的组合物，例如晶片活性侧和基底。 还提供了使用本文公开的组合物临时粘合两个表面的方法，例如晶片的活性侧和基底。

公开(公告)号：US20160257861A1

公开(公告)日：2016-09-08

申请号：US14636981

申请日：2015-03-03

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： Mark S. OLIVER ,  Zhifeng BAI ,  Michael K. GALLAGHER

IPC: C09J11/06 ,  H01L21/683 ,  H01L23/00 ,  C09J4/00

CPC classification number: C09J11/06 ,  C09J4/00 ,  H01L21/6835 ,  H01L24/10 ,  H01L24/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13147 ,  H01L2224/13647

Abstract: Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.

Abstract translation: 含有粘合剂材料，脱模添加剂和铜钝化剂的组合物适用于临时粘合两个表面，例如半导体衬底活性侧和载体衬底。 这些组合物可用于制造电子器件，其中期望将组分临时粘合到具有铜表面的基底上。

公开(公告)号：US20150118488A1

公开(公告)日：2015-04-30

申请号：US14069348

申请日：2013-10-31

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

Inventor： Zhifeng BAI ,  Mark S. OLIVER ,  Michael K. GALLAGHER ,  Christopher J. TUCKER ,  Karen R. BRANTL ,  Elissei IAGODKINE ,  Zidong WANG

IPC: H01L21/683 ,  C09J143/04

CPC classification number: C09J143/04 ,  B32B7/06 ,  B32B7/12 ,  C08K5/06 ,  C08L71/02 ,  C09J5/06 ,  C09J11/08 ,  C09J125/18 ,  C09J171/02 ,  C09J2471/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2848

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Abstract translation: 含有粘合剂材料，脱模添加剂和增容剂的组合物适用于临时粘接两个表面，如晶片活性侧和基材。 这些组合物可用于制造其中期望将组分临时粘合到基底上的电子器件。

公开(公告)号：US20160297985A1

公开(公告)日：2016-10-13

申请号：US15055987

申请日：2016-02-29

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

Inventor： Zhifeng BAI ,  Michael K. GALLAGHER ,  Zidong WANG ,  Christopher J. TUCKER ,  Matthew T. BISHOP ,  Elissei IAGODKINE ,  Mark S. OLIVER

IPC: C09D143/04 ,  C09D7/12 ,  B05D3/00 ,  C09D5/00

CPC classification number: C09D143/04 ,  B05D3/007 ,  B05D3/10 ,  C08G61/02 ,  C08G61/12 ,  C08G2261/3424 ,  C08G2261/344 ,  C08G2261/65 ,  C08L25/10 ,  C08L25/16 ,  C08L27/06 ,  C08L51/04 ,  C08L51/06 ,  C08L51/08 ,  C08L63/00 ,  C08L71/02 ,  C09D5/00 ,  C09D7/65 ,  C09J165/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H05K3/285 ,  C08L65/00

Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Abstract translation: 提供具有改善的韧性的芳族环烯烃聚合物。 还提供了具有改善的韧性的用于涂覆芳基环丁烯聚合物的组合物和方法。

公开(公告)号：US20160122601A1

公开(公告)日：2016-05-05

申请号：US14992251

申请日：2016-01-11

Applicant: Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

Inventor： Zhifeng BAI ,  Mark S. OLIVER ,  Michael K. GALLAGHER ,  Christopher J. TUCKER ,  Karen R. BRANTL ,  Elissei IAGODKINE ,  Zidong WANG

IPC: C09J143/04 ,  B32B7/12 ,  H01L21/683 ,  B32B7/06 ,  C09J171/02 ,  C08K5/06

CPC classification number: C09J143/04 ,  B32B7/06 ,  B32B7/12 ,  C08K5/06 ,  C08L71/02 ,  C09J5/06 ,  C09J11/08 ,  C09J125/18 ,  C09J171/02 ,  C09J2471/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2848

Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

公开(公告)号：US20170032996A1

公开(公告)日：2017-02-02

申请号：US15291539

申请日：2016-10-12

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Mark S. OLIVER ,  Michael K. GALLAGHER ,  Karen R. BRANTL

IPC: H01L21/683 ,  C09J11/08 ,  C09J143/04

CPC classification number: H01L21/6835 ,  C09J5/00 ,  C09J11/08 ,  C09J143/04 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  C09J2471/00 ,  H01L21/78 ,  H01L29/06 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Abstract translation: 含有粘合剂材料和脱模添加剂的组合物适用于临时粘合两个表面，如晶片活性侧和基材。 这些组合物可用于电子器件的制造，其中诸如活性晶片的组分临时结合到衬底上，随后进一步处理活性晶片。

公开(公告)号：US20160122602A1

公开(公告)日：2016-05-05

申请号：US14993123

申请日：2016-01-12

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Mark S. OLIVER ,  Michael K. GALLAGHER ,  Karen R. BRANTL

IPC: C09J143/04 ,  H01L21/683

CPC classification number: H01L21/6835 ,  C09J5/00 ,  C09J11/08 ,  C09J143/04 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  C09J2471/00 ,  H01L21/78 ,  H01L29/06 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Abstract translation: 含有粘合剂材料和脱模添加剂的组合物适用于临时粘合两个表面，如晶片活性侧和基材。 这些组合物可用于电子器件的制造，其中诸如活性晶片的组分临时结合到衬底上，随后进一步处理活性晶片。

公开(公告)号：US20140117504A1

公开(公告)日：2014-05-01

申请号：US14060185

申请日：2013-10-22

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Mark S. OLIVER ,  Michael K. GALLAGHER ,  Karen R. BRANTL

IPC: H01L21/78 ,  H01L29/06

CPC classification number: H01L21/6835 ,  C09J5/00 ,  C09J11/08 ,  C09J143/04 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  C09J2471/00 ,  H01L21/78 ,  H01L29/06 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Abstract translation: 含有粘合剂材料和脱模添加剂的组合物适用于临时粘合两个表面，如晶片活性侧和基材。 这些组合物可用于电子器件的制造，其中诸如活性晶片的组分临时结合到衬底上，随后进一步处理活性晶片。