公开(公告)号：US20240092632A1

公开(公告)日：2024-03-21

申请号：US18464759

申请日：2023-09-11

Applicant: ROHM CO., LTD.

Inventor： Martin Wilfried HELLER ,  Daisuke KAMINISHI

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0056 ,  B81C1/0019 ,  B81B2203/019 ,  B81B2203/0315 ,  B81B2203/033 ,  B81C2201/0132

Abstract: The present disclosure provides a MEMS device. The MEMS device includes: a substrate; a recess, disposed in the substrate; a movable portion, hollowly supported in the recess; and an isolation joint, inserted into a predetermined position of the movable portion and electrically insulating both sides of the movable portion. A shortest distance between a bottom of the recess and the movable portion is less than a distance between the bottom of the recess and the isolation joint.

公开(公告)号：US20240308841A1

公开(公告)日：2024-09-19

申请号：US18601334

申请日：2024-03-11

Applicant: ROHM CO., LTD.

Inventor： Toma FUJITA ,  Martin Wilfried HELLER ,  Daisuke KAMINISHI ,  Naoki IZUMI

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0235 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/07

Abstract: The present disclosure provides a MEMS device including a device wafer, a cap wafer and a bonding layer. The device wafer includes: a device substrate, having a first main surface, a second main surface opposite to the first main surface, and a cavity recessed along a first direction from the first main surface toward the second main surface; a sensor unit, located within the cavity and mechanically connected to and electrically insulated from the device substrate by a single anchor; and a device wiring, electrically coupled to the sensor unit. The cap wafer includes: a cap substrate, facing the device wafer from a side of the first main surface; and a cap wiring, electrically coupled to the device wiring. The bonding layer bonds the device wafer with the cap wafer, and the device wiring is directly connected to the bonding layer.

公开(公告)号：US20240317579A1

公开(公告)日：2024-09-26

申请号：US18676090

申请日：2024-05-28

Applicant: ROHM CO., LTD.

Inventor： Daisuke KAMINISHI ,  Martin Wilfried HELLER ,  Toma FUJITA

IPC: B81C1/00 ,  B81B7/00 ,  G01P15/125

CPC classification number: B81C1/00269 ,  B81B7/0006 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2203/0353 ,  B81B2203/04 ,  B81C2201/013 ,  B81C2201/0159 ,  B81C2201/0176 ,  B81C2203/037

Abstract: A MEMS sensor includes a bond portion in which a metal structure in a device substrate and a metal laminate are eutectically bonded. The bond portion bonds the device substrate and a lid substrate. The metal laminate is located on a main surface of the lid substrate and facing an exposed portion in the metal structure. The metal laminate includes a first metal and a second metal different from the first metal.

公开(公告)号：US20240425360A1

公开(公告)日：2024-12-26

申请号：US18753348

申请日：2024-06-25

Applicant: ROHM CO., LTD.

Inventor： Toma FUJITA ,  Martin HELLER ,  Daisuke KAMINISHI

IPC: B81B3/00 ,  B81C1/00

Abstract: Provided is a MEMS resonator which is inexpensive in manufacturing cost and can secure long-term stability of vibration. A MEMS resonator includes: a substrate; a cavity provided in the substrate; a MEMS structure held within the cavity, the MEMS structure including: an anchor having a first end and a second end, the first end being connected to the substrate; a vibrator connected to the second end of the anchor and held in a hollow; and an electrode disposed around the vibrator, the vibrator and the electrode forming a capacitive vibrator; and a cap layer which is formed over the substrate and seals the MEMS structure therein, in which the anchor includes an isolation joint having an insulation property disposed to electrically insulate the first end from the second end.

公开(公告)号：US20230258686A1

公开(公告)日：2023-08-17

申请号：US18091482

申请日：2022-12-30

Applicant: ROHM CO., LTD.

Inventor： Daisuke KAMINISHI

IPC: G01P15/125 ,  G01P15/18 ,  B81B7/02

CPC classification number: G01P15/125 ,  G01P15/18 ,  B81B7/02 ,  B81B2201/0235

Abstract: A MEMS sensor includes: a pair of movable electrodes arranged to be parallel to each other with a space portion interposed between the pair of movable electrodes above a cavity portion provided in a substrate; and a fixed electrode arranged to be parallel to the pair of movable electrodes with a groove portion interposed between the fixed electrode and the pair of movable electrodes on an opposite side of the space portion with respect to the pair of movable electrodes, wherein the space portion includes a central portion having a first space width and end portions having a second space width, and wherein the first space width is shorter than the second space width.

公开(公告)号：US20230166967A1

公开(公告)日：2023-06-01

申请号：US17992905

申请日：2022-11-22

Applicant: ROHM CO., LTD.

Inventor： Daisuke KAMINISHI ,  Martin Wilfried HELLER ,  Toma FUJITA

IPC: B81C1/00 ,  H01L21/02

CPC classification number: B81C1/00238 ,  H01L21/02636 ,  H01L21/02433 ,  B81B2201/0235

Abstract: A MEMS sensor includes: a first substrate having a cavity partially exposed on the surface of the first substrate; an electrode of a sensor element provided on the first substrate and arranged in the cavity; a support portion provided on the first substrate and configured to support the electrode; an element isolation portion formed on the first substrate so as to cover the support portion and configured to electrically isolate the electrode and the support portion from each other; an epitaxial growth layer formed on the electrode and the element isolation portion of the first substrate; and a second substrate bonded to the first substrate and configured to cover the sensor element, wherein the epitaxial growth layer has a monocrystalline portion arranged on the electrode and a polycrystalline portion arranged on the element isolation portion.