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    DIELECTROPHORESIS DEVICES AND METHODS THEREFOR
    5.
    发明申请
    DIELECTROPHORESIS DEVICES AND METHODS THEREFOR 审中-公开
    电介质器件及其方法

    公开(公告)号：US20120085649A1

    公开(公告)日：2012-04-12

    申请号：US13269286

    申请日：2011-10-07

    申请人： Michael B. Sano ,  John L. Caldwell ,  Rafael V. Davalos

    发明人： Michael B. Sano ,  John L. Caldwell ,  Rafael V. Davalos

    IPC分类号： G01N27/453

    CPC分类号： B03C5/005 ,  B03C5/026 ,  B03C2201/26

    摘要： Devices and methods for performing dielectrophoresis are described. The devices contain a sample channel which is separated by physical barriers from electrode channels which receive electrodes. The devices and methods may be used for the separation and analysis of particles in solution, including the separation and isolation of cells of a specific type. As the electrodes do not make contact with the sample, electrode fouling is avoided and sample integrity is better maintained.

    摘要翻译： 描述了用于进行介电电泳的装置和方法。 这些器件包含一个样品通道，该通道由接收电极的电极通道的物理屏障分开。 该装置和方法可用于分离和分析溶液中的颗粒，包括分离和分离特定类型的细胞。 由于电极不与样品接触，避免了电极结垢，更好地保持了样品的完整性。

    Test sockets, test systems, and methods for testing microfeature devices
    6.
    发明授权
    Test sockets, test systems, and methods for testing microfeature devices 失效
    测试插座，测试系统和测试微功能设备的方法

    公开(公告)号：US07256595B2

    公开(公告)日：2007-08-14

    申请号：US10805872

    申请日：2004-03-22

    申请人： John L. Caldwell ,  Mark A. Tverdy ,  Michael R. Slaughter

    发明人： John L. Caldwell ,  Mark A. Tverdy ,  Michael R. Slaughter

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0483 ,  G01R31/2893

    摘要： Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

    摘要翻译： 测试插座，测试系统和用于利用衬底和从衬底突出的多个导电互连元件来测试微特征器件的方法。 在一个实施例中，测试插座包括支撑表面和支撑表面中对应于微特征装置的至少一些互连元件的多个孔。 单独的孔延伸穿过测试插座，并且其尺寸被设计成接收互连元件中的一个的一部分，使得当微特征装置被接收在测试插座中时，基板与支撑表面间隔开。 在该实施例的一个方面，单个孔具有小于互连元件的横截面尺寸的横截面尺寸，使得孔仅接收相应互连元件的一部分。

    Method and apparatus for imager die package quality testing
    7.
    发明授权
    Method and apparatus for imager die package quality testing 有权
    成像仪芯片封装质量检测方法及装置

    公开(公告)号：US07122819B2

    公开(公告)日：2006-10-17

    申请号：US10839356

    申请日：2004-05-06

    申请人： John L. Caldwell

    发明人： John L. Caldwell

    IPC分类号： G01N21/88 ,  G01N21/00 ,  G06K9/00

    CPC分类号： G01N21/94 ,  G01N21/8806

    摘要： An apparatus and method of detecting a defect in an imager die package. The method comprises the steps of exposing the imager die package to light at a first angle, exposing the imager die package to light at a second angle, outputting electrical signals based on the exposures; and determining the level at which a defect is present based on the output electrical signals. An exemplary embodiment of the apparatus comprises a first light source positioned over an imager die package at a first angle, a second light source over the imager die package at a second angle, said first and second angles being different from each other; and a processor for determining a level of defection in the die package.

    摘要翻译： 一种检测成像模具封装中的缺陷的装置和方法。 该方法包括以下步骤：将成像器裸片封装以第一角度曝光，将成像器裸片封装以第二角度曝光，基于曝光输出电信号; 以及基于输出的电信号来确定存在缺陷的电平。 该装置的示例性实施例包括以第一角度位于成像模具封装之上的第一光源，以第二角度位于成像器裸片封装之上的第二光源，所述第一和第二角度彼此不同; 以及用于确定管芯封装中的缺陷水平的处理器。

    Method and apparatus for imager quality testing
    8.
    发明授权
    Method and apparatus for imager quality testing 失效
    成像仪质量检测方法和装置

    公开(公告)号：US07358517B2

    公开(公告)日：2008-04-15

    申请号：US11515393

    申请日：2006-09-05

    申请人： John L. Caldwell

    发明人： John L. Caldwell

    IPC分类号： G01N21/88 ,  G01N21/00 ,  G06K9/00

    CPC分类号： G01N21/94 ,  G01N21/8806

    摘要： An apparatus and method of detecting a defect in an imager die package. The method comprises the steps of exposing the imager die package to light at a first angle, exposing the imager die package to light at a second angle, outputting electrical signals based on the exposures; and determining the level at which a defect is present based on the output electrical signals. An exemplary embodiment of the apparatus comprises a first light source positioned over an imager die package at a first angle, a second light source over the imager die package at a second angle, said first and second angles being different from each other; and a processor for determining a level of defection in the die package.

    摘要翻译： 一种检测成像模具封装中的缺陷的装置和方法。 该方法包括以下步骤：将成像器裸片封装以第一角度曝光，将成像器裸片封装以第二角度曝光，基于曝光输出电信号; 以及基于输出的电信号来确定存在缺陷的电平。 该装置的示例性实施例包括以第一角度位于成像模具封装之上的第一光源，以第二角度位于成像器裸片封装之上的第二光源，所述第一和第二角度彼此不同; 以及用于确定管芯封装中的缺陷水平的处理器。