Microelectronic structure having a hydrogen barrier layer
    8.
    发明授权
    Microelectronic structure having a hydrogen barrier layer 有权
    具有氢阻挡层的微电子结构

    公开(公告)号:US07276300B2

    公开(公告)日:2007-10-02

    申请号:US10476579

    申请日:2002-04-22

    IPC分类号: B32B9/00

    摘要: The invention relates to a microelectronic structure which provides improved protection of a hydrogen-sensitive dielectric against hydrogen contamination. According to the invention, the hydrogen sensitive dielectric (14) is covered at lest by an intermediate oxide (18), where material thickness is at lest five times the thickness of the hydrogen-sensitive dielectric. The intermediate oxide (18) simultaneously acts as an internal dielectric and is metabolized on its surface for this purpose. The intermediate oxide (18), which has a sufficient thickness absorbers the hydrogen that may be released during the deposition of a hydrogen barrier layer (22, 26), thus protecting the hydrogen-sensitive dielectric (14).

    摘要翻译: 本发明涉及一种微电子结构,其提供对氢敏感介质的改善的防止氢污染的保护。 根据本发明,氢敏电介质(14)几乎被中间氧化物(18)覆盖,其中材料厚度是氢敏电介质厚度的五倍。 中间氧化物(18)同时作为内部电介质,为此目的在其表面上代谢。 具有足够厚度的中间氧化物(18)吸收在氢阻挡层(22,26)的沉积过程中可释放的氢,从而保护感应电介质(14)。

    Method for producing a semiconductor structure, and use of the method
    9.
    发明授权
    Method for producing a semiconductor structure, and use of the method 失效
    半导体结构的制造方法以及使用该方法

    公开(公告)号:US06809019B2

    公开(公告)日:2004-10-26

    申请号:US10261849

    申请日:2002-09-30

    IPC分类号: H01L213205

    CPC分类号: H01L28/91

    摘要: A method for producing a semiconductor structure includes applying at least one first layer, etching the first layer using a masking layer such that fences are produced, and, after removal of the masking layer and application of an auxiliary layer, the auxiliary layer and the fences are removed jointly except for a predetermined extent of the auxiliary layer. The present invention also relates to use of the method for producing spacers in a semiconductor structure.

    摘要翻译: 一种制造半导体结构的方法包括:施加至少一个第一层,使用掩模层蚀刻第一层以产生栅栏,并且在去除掩模层和施加辅助层之后,辅助层和栅栏 除了辅助层的预定范围外联合除去。 本发明还涉及在半导体结构中制造间隔物的方法的用途。