Method of patterning ferroelectric layers
    3.
    发明授权
    Method of patterning ferroelectric layers 失效
    铁电层图案的方法

    公开(公告)号:US06730562B2

    公开(公告)日:2004-05-04

    申请号:US10364819

    申请日:2003-02-11

    IPC分类号: H01L218242

    CPC分类号: H01L28/55 H01L21/31122

    摘要: A method for structuring ferroelectric layers on semiconductor substrates retains or regenerates the adherence and breakdown voltage resistance of the ferroelectric layer, which is especially significant for producing storage capacitors in large-scale integrated FeRAM and DRAM memory components. The addition of H2O or O2 results principally in the recovery of the electrostatic breakdown strength of the ferroelectric layer, which is of importance in particular when the ferroelectric serves as a dielectric of a storage capacitor and has to withstand electric fields of 5-10×106 V/m without a significant leakage current.

    摘要翻译: 用于在半导体衬底上构造铁电层的方法保留或再生强电介质层的粘附和耐击穿电压,这对于在大规模集成的FeRAM和DRAM存储器组件中产生存储电容器尤其重要。 H 2 O或O 2的添加主要导致铁电层的静电击穿强度的恢复,特别是当铁电体用作储能电容器的电介质并且必须承受5-10×10 6的电场时,这尤其重要 > V / m,没有明显的漏电流。

    Method for producing a ferroelectric layer
    4.
    发明授权
    Method for producing a ferroelectric layer 失效
    铁电体层的制造方法

    公开(公告)号:US06790676B2

    公开(公告)日:2004-09-14

    申请号:US10204830

    申请日:2002-12-05

    IPC分类号: H01L2100

    摘要: A method for producing a ferroelectric layer includes preparing a substrate, applying a layer of material, which will be subsequently converted into the ferroelectric layer, and changing the material into the ferroelectric layer by applying an outer electrical field aligned with the direction desired in the ferroelectric material and heat treating the material. By providing a first noble metal electrode on the surface before applying the material that is to become the ferroelectric layer and then subsequently forming a second noble metal electrode on the ferroelectric layer, a ferroelectric storage capacitor can be formed. If the substrate is provided with memory cells, which include at least one transistor for each cell and the above-mentioned ferroelectric storage capacitors, a ferroelectric memory arrangement can be produced.

    摘要翻译: 一种铁电体层的制造方法,其特征在于,准备基板,涂敷随后转变为铁电体层的材料层,并且通过施加与铁电体中所需的方向对准的外部电场,将材料变更为铁电体层 材料和热处理材料。 通过在施加成为铁电体层的材料之后,在表面上设置第一贵金属电极,然后在铁电体层上形成第二贵金属电极,可以形成铁电存储电容器。 如果衬底设置有存储单元,其包括用于每个单元的至少一个晶体管和上述铁电存储电容器,则可以制造铁电存储器布置。

    Process for etching bismuth-containing oxide films

    公开(公告)号:US06669857B2

    公开(公告)日:2003-12-30

    申请号:US10073829

    申请日:2002-02-11

    申请人: Frank Hintermaier

    发明人: Frank Hintermaier

    IPC分类号: B44C122

    CPC分类号: H01L21/31111 C09K13/08

    摘要: A process is described for etching oxide films containing at least one bismuth-containing oxide, in particular a ferroelectric bismuth-containing mixed oxide. A substrate onto which at least one oxide film containing at least one bismuth-containing oxide has been applied is provided. An etching solution containing from 2 to 20% by weight of a fluoride ion donor, from 15 to 60% by weight of nitric acid and from 20 to 83% by weight of water is brought into contact with the substrate so that the etching solution can react with the oxide film. The etching solution is removed from the substrate. The etching solution is also used in a process for structuring bismuth-containing oxide films.

    Method for nucleation controlled chemical vapor deposition of metal
oxide ferroelectric thin films
    10.
    发明授权
    Method for nucleation controlled chemical vapor deposition of metal oxide ferroelectric thin films 失效
    金属氧化物铁电薄膜的成核控制化学气相沉积方法

    公开(公告)号:US6010744A

    公开(公告)日:2000-01-04

    申请号:US996574

    申请日:1997-12-23

    摘要: A method is described for the nucleation controlled deposition of ferroelectric thin films by chemical vapor deposition in a novel processing sequence wherein a higher density of bismuth nucleation sites is achieved either by the use of a substrate member which has been treated in a manner to yield a controllably and reproducible rough surface on which SBT films with excellent properties may be produced or by using a chemically modified substrate surface upon which surface chemical properties are modified. Typical techniques for achieving surface roughening include reactive ion etching, inert ion milling and chemical mechanical polishing, each of which may be used to delineate patterned bottom electrodes. The chemical properties of the substrate may be modified by alloy deposition, deposition of seed layers which are then partially or completely in-diffused ion implantation with or without heat treatment and changing the chemistry of the surface by a pre-exposure to chemical agents prior to deposition. The resultant oxide ferroelectric thin films are suitable for use in capacitors, memory devices and the like.

    摘要翻译: 描述了一种通过化学气相沉积的铁电薄膜的成核控制沉积的方法,其中新颖的加工顺序中,其中通过使用已经以产生a的方式处理的基底部件实现了较高密度的铋成核位点 粗糙表面的可控制和可重复性,可以在其上生产具有优异性能的SBT膜或通过使用改性表面化学性质的化学改性的基材表面。 用于实现表面粗糙化的典型技术包括反应离子蚀刻,惰性离子研磨和化学机械抛光,其中每一种可用于描绘图案化底部电极。 基材的化学性质可以通过合金沉积,种子层的沉积进行改性,然后种子层将被部分或全部扩散离子注入,有或者没有热处理,并且通过预先暴露于化学试剂之前改变表面的化学性质, 沉积 所得到的氧化物铁电薄膜适用于电容器,存储器件等。