公开(公告)号：US07816785B2

公开(公告)日：2010-10-19

申请号：US12357744

申请日：2009-01-22

Applicant: Sushumna Iruvanti ,  Randall G. Kemink ,  Rajneesh Kumar ,  Steven P. Ostrander ,  Prabjit Singh

Inventor： Sushumna Iruvanti ,  Randall G. Kemink ,  Rajneesh Kumar ,  Steven P. Ostrander ,  Prabjit Singh

IPC: H01L23/10

CPC classification number: H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.

Abstract translation: 提供了一种用于半导体器件的改进的热界面材料。 更具体地，提供了用于热界面材料的低压缩力，非硅氧烷，高导热性配方。 热界面材料包括使用约100psi或更小的压缩力显示约5.5W / mK或更高的导热率和约100微米或更小的压缩粘合线厚度的非硅氧烷有机物的组合物。

公开(公告)号：US07462294B2

公开(公告)日：2008-12-09

申请号：US11739701

申请日：2007-04-25

Applicant: Rajneesh Kumar ,  Steven P Ostrander

Inventor： Rajneesh Kumar ,  Steven P Ostrander

IPC: C09K5/08 ,  C09K5/10 ,  C09K5/14 ,  H01B1/00 ,  H05K7/20

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract translation: 提供了一种导热混合物，其用于制备导热配方，例如具有高导热性和较低粘度的糊状物。 该糊料用于在电子部件和冷却装置之间提供热导体连接，以增加部件和冷却电子部件的装置之间的传热速率。 制剂含有各种粒度范围内的导热颗粒的混合物，通常分散在含有抗氧化剂和分散剂的非水电介质载体中，导热颗粒混合物在混合物中基于粒度范围以体积百分数特别相关， 通过颗粒尺寸比各个粒径范围。 该混合物可用于制造其他类似产品，例如热凝胶，粘合剂，浆料和复合材料，用于电子和化妆品，药​​品，汽车和类似产品。

公开(公告)号：US20080311381A1

公开(公告)日：2008-12-18

申请号：US12196443

申请日：2008-08-22

Applicant: Rajneesh Kumar ,  Steven P. Ostrander

Inventor： Rajneesh Kumar ,  Steven P. Ostrander

IPC: B32B5/16 ,  H01L23/34

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract translation: 提供了一种导热混合物，其用于制备导热配方，例如具有高导热性和较低粘度的糊状物。 该糊料用于在电子部件和冷却装置之间提供热导体连接，以增加部件和冷却电子部件的装置之间的传热速率。 制剂含有各种粒度范围内的导热颗粒的混合物，通常分散在含有抗氧化剂和分散剂的非水电介质载体中，导热颗粒混合物在混合物中基于粒度范围以体积百分数特别相关， 通过颗粒尺寸比各个粒径范围。 该混合物可用于制造其他类似产品，例如热凝胶，粘合剂，浆料和复合材料，用于电子和化妆品，药​​品，汽车和类似产品。

公开(公告)号：US20080266809A1

公开(公告)日：2008-10-30

申请号：US11739701

申请日：2007-04-25

Applicant: Rajneesh Kumar ,  Steven P. Ostrander

Inventor： Rajneesh Kumar ,  Steven P. Ostrander

IPC: H05K7/20 ,  C08G63/48

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

公开(公告)号：US20090059785A1

公开(公告)日：2009-03-05

申请号：US11899935

申请日：2007-09-05

Applicant: Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

Inventor： Prasad Prabhakar Jogalekar ,  Arnold Mark Bilstad ,  Rajneesh Kumar

IPC: G08C15/00

CPC classification number: H04L47/824 ,  H04L47/10 ,  H04L47/70 ,  H04L47/805 ,  H04L47/822

Abstract: In one embodiment, a network device receives a request from a client in association with a connection, where the request indicates an amount of one or more resources that is requested to support the connection. The network device determines whether the amount of the resources is available. The network device may then allocate a level of the resources to the connection according to whether the amount of the resources is available.

Abstract translation: 在一个实施例中，网络设备从连接中接收来自客户端的请求，其中请求指示被请求支持连接的一个或多个资源的量。 网络设备确定资源的数量是否可用。 然后，网络设备可以根据资源的数量是否可用来向该连接分配一个资源级别。

公开(公告)号：US20070025325A1

公开(公告)日：2007-02-01

申请号：US11192706

申请日：2005-07-29

Applicant: Rajneesh Kumar

Inventor： Rajneesh Kumar

IPC: H04J3/06

CPC classification number: H04N21/6437 ,  H04J3/0638 ,  H04L47/10 ,  H04L47/14 ,  H04L47/2416 ,  H04L47/286 ,  H04N21/4305 ,  H04N21/64322 ,  H04W28/10 ,  H04W56/00 ,  H04W84/12

Abstract: A method and system directed to negotiating and triggering media stream synchronization at the link layer in a QoS-enabled 802.11 WLAN, or other wireless, network. In one implementation, the present invention allows for improved performance of streaming network applications, such as video conferencing, over wireless links. In one implementation, the present invention also provides an optional mechanism whereby a mobile station can signal a need for on-the-fly throttling, if an application on the mobile detects that there is a need for better synchronization of two streams, such as a lower priority stream to a higher priority stream.

Abstract translation: 一种用于在启用QoS的802.11 WLAN或其他无线网络中的链路层协商和触发媒体流同步的方法和系统。 在一个实现中，本发明允许通过无线链路改进诸如视频会议之类的流媒体网络应用的性能。 在一个实施方式中，本发明还提供了一种可选的机构，其中移动台可以发出对即时节流的需要，如果移动台上的应用检测到需要两个流的更好的同步，诸如 较低优先级流到较高优先级流。

公开(公告)号：US09172796B2

公开(公告)日：2015-10-27

申请号：US11685771

申请日：2007-03-14

Applicant: Rajneesh Kumar ,  Sravan Vadlakonda ,  Ashish Chotai ,  Aseem Asthana ,  Shmuel Shaffer

Inventor： Rajneesh Kumar ,  Sravan Vadlakonda ,  Ashish Chotai ,  Aseem Asthana ,  Shmuel Shaffer

IPC: H04L12/16 ,  H04M3/42 ,  H04M3/56

CPC classification number: H04M3/42187 ,  H04M3/42374 ,  H04M3/568 ,  H04M2242/30

Abstract: In one embodiment, a method includes identifying a plurality of locations associated with a conference system that has a conference server and a mixer, and prioritizing the locations by assigning a first priority to at least a first location and assigning a second priority to a second location. The second priority is lower than the first priority. The method also includes processing received media streams such that media streams received from endpoints associated with the first location are processed as having a higher priority than media streams received from endpoints associated with the second location.

Abstract translation: 在一个实施例中，一种方法包括识别与具有会议服务器和混合器的会议系统相关联的多个位置，以及通过将至少第一位置分配第一优先级并将第二优先级分配给第二位置来对所述位置进行优先级排序 。 第二优先级低于第一优先级。 该方法还包括处理接收到的媒体流，使得从与第一位置相关联的端点接收的媒体流被处理为具有比从与第二位置相关联的端点接收的媒体流更高的优先级。

公开(公告)号：US08411629B1

公开(公告)日：2013-04-02

申请号：US12705162

申请日：2010-02-12

Applicant: Lu Qian ,  Sandeep J. Shetty ,  Neil R. Diener ,  Tak Ming Francis Pang ,  Rajneesh Kumar

Inventor： Lu Qian ,  Sandeep J. Shetty ,  Neil R. Diener ,  Tak Ming Francis Pang ,  Rajneesh Kumar

IPC: H04W4/00

CPC classification number: H04W4/00 ,  H04L47/14 ,  H04L47/801 ,  H04L47/803 ,  H04L47/822 ,  H04L47/823 ,  H04W28/00

Abstract: Techniques are provided herein for computing a video admission control metric used to determine whether to admit a new video stream to a wireless network. The video admission control metric is computed using several measurable parameters of the wireless network. The dynamic nature of this process takes into account many real-time factors that affect admission control, such as traffic load, channel conditions, and overlapping basic service set (BSS) interference.

Abstract translation: 本文提供了用于计算用于确定是否将新的视频流接纳到无线网络的视频准入控制度量的技术。 使用无线网络的几个可测量的参数来计算视频准入控制度量。 该过程的动态性质考虑了影响准入控制的许多实时因素，例如业务负载，信道状况和重叠的基本业务集（BSS）干扰。

公开(公告)号：US20120119353A1

公开(公告)日：2012-05-17

申请号：US13358910

申请日：2012-01-26

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L23/28

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片的边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US20120106463A1

公开(公告)日：2012-05-03

申请号：US12917846

申请日：2010-11-02

Applicant: Michael McBride ,  Subhasri Dhesikan ,  Neil Diener ,  David Stephenson ,  Rajneesh Kumar

Inventor： Michael McBride ,  Subhasri Dhesikan ,  Neil Diener ,  David Stephenson ,  Rajneesh Kumar

IPC: H04W28/00 ,  H04L12/56 ,  H04W72/00

CPC classification number: H04W28/24 ,  H04W28/26

Abstract: Described in an example embodiment is an end-to-end admission control system that allows any rich media application to secure admission control in an environment where there are mixed wireless and wired segments in the network. In particular embodiments, the system includes the integration of Add Traffic Stream (ADDTS) and Resource Reservation Protocol (RSVP) admission control mechanisms, the mapping of parameters between these two mechanisms, the admission control policies, and failure handling for the end-to-end resource control.

Abstract translation: 在示例实施例中描述的是允许任何富媒体应用程序在网络中存在混合无线和有线段的环境中确保准入控制的端对端许可控制系统。 在特定实施例中，系统包括添加业务流（ADDTS）和资源预留协议（RSVP）准入控制机制的集成，这两种机制之间的参数映射，接纳控制策略以及终端 - 结束资源控制。