摘要:
End-effectors and associated control and guidance systems and methods are disclosed. A transfer device in one embodiment includes a base unit, an arm carried by the base unit and movable relative to the base unit, and an end-effector carried by the arm and rotatable relative to the arm. The end-effector includes two grippers, at least one being movable toward and away from the other between a grip position and a release position. A transmission is coupled between a motor and the movable gripper to receive an input force from the motor and apply an output force to the gripper that increases as the gripper moves to the grip position.
摘要:
An intermediate module comprising a dimensionally stable mounting module and a first device attached to the dimensionally stable mounting module. The dimensionally stable mounting module can include a front docking unit with front alignment elements for connecting the mounting module to a load/unload module, and a rear docking unit with rear alignment elements for connecting the mounting module to a main processing unit. The mounting module can further include a deck between the front docking unit and the rear docking unit, positioning elements at the deck, and attachment elements at the deck. The first device can be a processing chamber, an annealing station, a metrology station, a buffer station, or another type of component for holding or otherwise performing a function on a workpiece. The first device has a device interface member engaged with one of the positioning elements and a device fastener engaged with one of the attachment elements so that the first device is positioned precisely at a known location in a fixed reference frame defined by the mounting module.
摘要:
A modular tool unit for wet chemical processing of microfeature workpieces including a dimensionally stable mounting module having front alignment elements at predetermined locations, positioning elements, and attachment elements. The tool unit further includes a wet chemical processing chamber and a transport system attached to the mounting module. The wet chemical processing chamber has chamber interface members engaged with corresponding positioning elements and chamber fasteners engaged with corresponding attachment elements. Similarly, the transport system has transport interface members engaged with corresponding positioning elements and transport fasteners engaged with corresponding attachment elements. The positioning elements for the wet chemical processing chamber and the transport system are precisely located at known points within the fixed reference frame defined by the dimensionally stable mounting module.
摘要:
A modular apparatus for thermally processing a microelectronic workpiece is provided. The modular apparatus comprises a mounting module having a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The thermal processing modular apparatus has a front docking unit for removeably connecting it to a load/unload module and a rear docking unit for removeably connecting it to a wet chemical processing tool, or another tool for otherwise processing a workpiece. A transport system (i.e., robot) services the modular tool units that can be automatically calibrated to work with individual processing components of the tool units.
摘要:
An intermediate module comprising a dimensionally stable mounting module and a first device attached to the dimensionally stable mounting module. The dimensionally stable mounting module can include a front docking unit with front alignment elements for connecting the mounting module to a load/unload module, and a rear docking unit with rear alignment elements for connecting the mounting module to a main processing unit. The mounting module can further include a deck between the front docking unit and the rear docking unit, positioning elements at the deck, and attachment elements at the deck. The first device can be a processing chamber, an annealing station, a metrology station, a buffer station, or another type of component for holding or otherwise performing a function on a workpiece. The first device has a device interface member engaged with one of the positioning elements and a device fastener engaged with one of the attachment elements so that the first device is positioned precisely at a known location in a fixed reference frame defined by the mounting module.
摘要:
Transfer devices and methods for handling microfeature workpieces are disclosed herein. In one embodiment, a transfer device includes a transport unit configured to move along a linear track and an arm assembly carried by the transport unit. The arm assembly can include an arm pivotable about a lift path. The transfer device further includes (a) a first end-effector coupled to the arm and rotatable about an axis generally parallel to the lift path, and (b) a second end-effector coupled to the arm and rotatable about the axis. The transfer device operates normally without pneumatic power.
摘要:
An apparatus for thermally processing a microelectronic workpiece is provided. The apparatus comprises a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The loading, heating and cooling stations are radially positioned and approximately equally spaced about a center axis of the carousel assembly. The heating station includes a heating element and an actuator for moving the heating element into thermal engagement with the workpiece in the heating station. The cooling station includes a cooling element and an actuator for moving the cooling element into thermal engagement with the workpiece in the cooling station. A process fluid distribution manifold for delivering process fluid to the workpieces at each station extends through a central opening in the carousel assembly. A non-oxidizing gas is delivered through the manifold to create an oxygen free environment during the thermal process.
摘要:
A system for processing a workpiece includes a base having a bowl or recess for holding a processing fluid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a processing fluid in the bowl. A process head holds a workpiece. A process head lifter lowers the head holding the workpiece into the processing fluid in the bowl. Sonic energy is provided to the workpiece through the processing fluid, optionally while the processing head spins the workpiece. The processing fluid may include de-ionized water and an etchant.
摘要:
An apparatus for thermally processing a microelectronic workpiece comprises a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The loading, heating and cooling stations are radially positioned about a center axis of the carousel assembly. The heating station includes a heating element and an actuator for moving the heating element into thermal engagement with the workpiece in the heating station. The cooling station includes a cooling element and an actuator for moving the cooling element into thermal engagement with the workpiece in the cooling station. A process fluid distribution manifold for delivering process fluid to the workpieces at each station extends through a central opening in the carousel assembly. A non-oxidizing gas is delivered through the manifold to create an oxygen free environment during the thermal process.
摘要:
An apparatus for thermally processing a microelectronic workpiece is provided. The apparatus comprises a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The loading, heating and cooling stations are radially positioned and approximately equally spaced about a center axis of the carousel assembly. The heating station includes a heating element and an actuator for moving the heating element into thermal engagement with the workpiece in the heating station. The cooling station includes a cooling element and an actuator for moving the cooling element into thermal engagement with the workpiece in the cooling station. A process fluid distribution manifold for delivering process fluid to the workpieces at each station extends through a central opening in the carousel assembly. A non-oxidizing gas is delivered through the manifold to create an oxygen free environment during the thermal process.