公开(公告)号：US20150130553A1

公开(公告)日：2015-05-14

申请号：US14080013

申请日：2013-11-14

申请人： Raul Enriquez Shibayama ,  Maria Garcia Garcia de Leon ,  Kai Xiao ,  Beom-Taek Lee ,  Carlos Lizalde Moreno

发明人： Raul Enriquez Shibayama ,  Maria Garcia Garcia de Leon ,  Kai Xiao ,  Beom-Taek Lee ,  Carlos Lizalde Moreno

IPC分类号： H01P3/08 ,  H01P11/00

CPC分类号： H01P3/026 ,  H01P5/028 ,  H04B3/32 ,  H05K1/0225 ,  H05K1/0228 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09672 ,  Y10T29/49117

摘要： A circuit component is described herein. The circuit component includes a first signal line to propagate in a first direction and a second signal line to propagate a second direction. The circuit component includes a region to introduce crosstalk within the region that reduces another crosstalk generated at a location remote from the region based on a change in propagation direction of the first signal line and second signal line.

摘要翻译： 这里描述了电路部件。 电路部件包括在第一方向上传播的第一信号线和第二信号线以传播第二方向。 电路部件包括在该区域内引入串扰的区域，其基于第一信号线和第二信号线的传播方向的变化，减少远离该区域的位置产生的另一个串扰。

公开(公告)号：US20170094791A1

公开(公告)日：2017-03-30

申请号：US14866637

申请日：2015-09-25

申请人： Raul Enriquez Shibayama ,  Beom-Taek Lee ,  Carolina Garcia Robles

发明人： Raul Enriquez Shibayama ,  Beom-Taek Lee ,  Carolina Garcia Robles

IPC分类号： H05K1/14 ,  H05K3/32 ,  H05K1/18 ,  H05K3/36 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K1/141 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K3/222 ,  H05K3/32 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/042

摘要： Techniques and mechanisms for facilitating connection between a packaged device and a substrate of another device. In an embodiment, a device—such as a printed circuit board—comprises a substrate and a hardware interface at a first side of the substrate, the hardware interface to couple the device to a package including integrated circuitry. The device is further configured to couple to a bridge device via contacts disposed at a second side of the substrate. An interconnect extends from the hardware interface to one of the contacts at the second side. In another embodiment, coupling the substrate to the bridge device interconnects two of the contacts at the second side to one another via the bridge device, where one or more contacts of the hardware interface (e.g., only a subset of all such contacts) are also interconnected with the bridge device via the second side.

公开(公告)号：US20060227522A1

公开(公告)日：2006-10-12

申请号：US11105141

申请日：2005-04-11

申请人： Chung-Chi Huang ,  Richard Kunze ,  Beom-Taek Lee

发明人： Chung-Chi Huang ,  Richard Kunze ,  Beom-Taek Lee

IPC分类号： H05K7/06 ,  H05K1/11

CPC分类号： H05K1/0228 ,  H01L23/49822 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0233 ,  H05K1/165 ,  H05K2201/0792 ,  H05K2201/0949 ,  H05K2201/1003 ,  H05K2201/10325 ,  H05K2201/10734 ,  H01L2924/00

摘要： A component having an inductor to at least partially compensate for a capacitance in a circuit of the component, is described herein.

公开(公告)号：US07474539B2

公开(公告)日：2009-01-06

申请号：US11105141

申请日：2005-04-11

申请人： Chung-Chi Huang ,  Richard Kunze ,  Beom-Taek Lee

发明人： Chung-Chi Huang ,  Richard Kunze ,  Beom-Taek Lee

IPC分类号： H05K7/00

CPC分类号： H05K1/0228 ,  H01L23/49822 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0233 ,  H05K1/165 ,  H05K2201/0792 ,  H05K2201/0949 ,  H05K2201/1003 ,  H05K2201/10325 ,  H05K2201/10734 ,  H01L2924/00

摘要： A component having an inductor to at least partially compensate for a capacitance in a circuit of the component, is described herein.

摘要翻译： 这里描述了具有至少部分地补偿组件的电路中的电容的电感器的部件。