公开(公告)号：US12046543B2

公开(公告)日：2024-07-23

申请号：US17679862

申请日：2022-02-24

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Han-Chieh Hsieh ,  Chao-Min Lai ,  Cheng-Chen Huang ,  Nan-Chin Chuang

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16227

Abstract: A package substrate and a chip package structure using the same are provided. The package substrate includes a laminated board including first to third wiring layers, a pad array, a plurality of ground conductive structures, and a plurality of power conductive structures. At least one of the ground (or power) conductive structures includes two first ground (or power) conductive posts and a second ground (or power) conductive post. The two first ground (or power) conductive posts and the second ground (or power) conductive post are arranged along a first direction, and the second ground (or power) conductive post is located between two orthographic projections of the two first ground (or power) conductive posts. Each of the ground conductive structures in a first column and each of the power conductive structures in a second column are offset from each other in a second direction.

公开(公告)号：US11231759B2

公开(公告)日：2022-01-25

申请号：US16904050

申请日：2020-06-17

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Chien-Liang Chen ,  Chao-Min Lai ,  Ming-Tsung Tsai ,  Cheng-Yu Lee

IPC: G06F1/00 ,  G06F1/20 ,  G01K3/00 ,  G06F1/3287 ,  G06F1/324 ,  G06F1/3206

Abstract: A performance management method and an electronic device are provided. The method is applied to the electronic device with a system processor and includes: sensing a temperature of the electronic device and determining whether the temperature is greater than a first temperature setting value; when the temperature is not greater than the first temperature setting value, initiating a frequency increasing procedure; when the temperature is greater than the first temperature setting value, determining whether the temperature is greater than a second temperature setting value, where the second temperature setting value is greater than the first temperature setting value; when the temperature is greater than the first temperature setting value and is not greater than the second temperature setting value, initiating a first frequency reducing procedure; and when the temperature is greater than the second temperature setting value, initiating a second frequency reducing procedure or turning off the system processor.

公开(公告)号：US11646738B2

公开(公告)日：2023-05-09

申请号：US17695821

申请日：2022-03-15

Applicant: Realtek Semiconductor Corp.

Inventor： Chao-Min Lai ,  Han-Chieh Hsieh ,  Tang-Hung Chang ,  Hung-Wei Wang ,  Chun-Yi Kuo

IPC: H03K19/0185 ,  H03K19/00 ,  H03K19/17784

CPC classification number: H03K19/01855 ,  H03K19/0016 ,  H03K19/17784

Abstract: The present invention provides a processor including a core circuit, a plurality of clock signal generation circuits, a multiplexer and a detection circuit is disclosed. The core circuit is supplied by a supply voltage. The plurality of clock signal generation circuits are configured to generate a plurality of clock signals with different frequencies, respectively, wherein a number of the plurality of clock signals is equal to or greater than three. The multiplexer is configured to receive the plurality of clock signals, and to select one of the plurality of clock signals to serve as an output clock signal according to a control signal, wherein the core circuit uses the output clock signal to serve as an operating clock. The detection circuit is configured to detect a level of the supply voltage received by the core circuit in a real-time manner, to generate the control signal.

公开(公告)号：US11227851B2

公开(公告)日：2022-01-18

申请号：US16718256

申请日：2019-12-18

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Chao-Min Lai ,  Ping-Chia Wang ,  Han-Chieh Hsieh ,  Tang-Hung Chang

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/498

Abstract: A control device and a circuit board are provided. The control device can cooperate with the circuit board, and includes a ball grid array. The ball grid array includes a plurality of power balls and a plurality of ground balls, which are jointly arranged in a ball region. The power balls and the ground balls are respectively divided into a plurality of power ball groups and a plurality of ground ball groups. One of the ground ball groups includes two ground balls and is adjacent to a power ball group. A ball pitch between the two ground balls is greater than that between one of the power balls and one of the ground balls adjacent to each other. The circuit board includes a contact pad array corresponding to the ball grid array of the control device so that the control device can be disposed on the circuit board.

公开(公告)号：US20210181822A1

公开(公告)日：2021-06-17

申请号：US16904050

申请日：2020-06-17

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Chien-Liang Chen ,  Chao-Min Lai ,  Ming-Tsung Tsai ,  Cheng-Yu Lee

IPC: G06F1/20 ,  G06F1/324 ,  G06F1/3287 ,  G01K3/00

Abstract: A performance management method and an electronic device are provided. The method is applied to the electronic device with a system processor and includes: sensing a temperature of the electronic device and determining whether the temperature is greater than a first temperature setting value; when the temperature is not greater than the first temperature setting value, initiating a frequency increasing procedure; when the temperature is greater than the first temperature setting value, determining whether the temperature is greater than a second temperature setting value, where the second temperature setting value is greater than the first temperature setting value; when the temperature is greater than the first temperature setting value and is not greater than the second temperature setting value, initiating a first frequency reducing procedure; and when the temperature is greater than the second temperature setting value, initiating a second frequency reducing procedure or turning off the system processor.

公开(公告)号：US10763197B2

公开(公告)日：2020-09-01

申请号：US16371378

申请日：2019-04-01

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Chao-Min Lai ,  Hung-Wei Wang ,  Ping-Chia Wang

IPC: H01L29/40 ,  H01L21/44 ,  H01L23/498 ,  H01L23/00

Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus includes a control device that can operate with the circuit board, and includes a ball pad array. The ball pad array includes a plurality of power ball pads and a plurality of ground ball pads, which are arranged in the same pad arrangement region. At least a portion of the power ball pads and at least a portion of the ground ball pads are arranged in an alternate manner. The circuit board includes a solder pad array corresponding to the ball pad array of the control device so as to be disposed with the control device.

公开(公告)号：US20250045222A1

公开(公告)日：2025-02-06

申请号：US18791371

申请日：2024-07-31

Applicant: Realtek Semiconductor Corp.

Inventor： Chao-Min Lai

IPC: G06F13/20 ,  H04N21/4363

Abstract: A CEC system, comprising: a first IC, comprising a first pin and an anti-leakage circuit electrically coupled to the first pin; and a second IC, comprising a second pin electrically coupled to the first pin. The first IC or the second IC is configured to provide a CEC function. Thereby software can be used to simulate CEC functions to increase the number of CEC function sets without increasing hardware costs, to increase the application scope of the CEC system.

公开(公告)号：US11579643B2

公开(公告)日：2023-02-14

申请号：US17088560

申请日：2020-11-03

Applicant: Realtek Semiconductor Corp.

Inventor： Chao-Min Lai ,  Hung-Wei Wang ,  Tang-Hung Chang ,  Han-Chieh Hsieh ,  Chun-Yi Kuo

IPC: G05F1/46 ,  G06F1/3296 ,  H02M3/156

Abstract: The present invention discloses an AVS scanning method, wherein the AVS scanning method includes the steps of: mounting a system on chip (SoC) on a printed circuit board (PCB), and connecting the SoC to a storage unit; enabling the SoC to read a boot code from the storage unit, and executing the boot code to perform an AVS scanning operation on the SoC to determine a plurality of target supply voltages respectively corresponding to a plurality of operating frequencies of the SoC to establish an AVS look-up table; and storing the AVS look-up table into the SoC or the storage unit.

公开(公告)号：US11381912B2

公开(公告)日：2022-07-05

申请号：US17210439

申请日：2021-03-23

Applicant: Realtek Semiconductor Corp.

Inventor： Chao-Min Lai ,  Guo-Yuan Luo ,  Chia-Hao Wu

IPC: H04R3/00 ,  G06F3/16 ,  H04R3/02

Abstract: An audio receiver includes a first signal port, a second signal port, a power supply port, a power ground port, and an amplifier circuit. The first signal port is coupled to an audio signal line of a transmission interface. The second signal port is coupled to an audio ground line of the transmission interface. The power supply port is coupled to a power supply line of the transmission interface to generate a power supply level to the power supply line. The power ground port is connected to the ground level and to a power ground line of the transmission interface. When the audio receiver is outputting a power supply current to the audio source device through the power supply port via the power supply line, a connection state between the second signal port and the power ground port is at a high impedance state.

公开(公告)号：US10152447B2

公开(公告)日：2018-12-11

申请号：US15209764

申请日：2016-07-14

Applicant: Realtek Semiconductor Corp.

Inventor： Chao-Min Lai

IPC: H05K7/10 ,  G06F13/42 ,  G06F13/40 ,  H04B1/40

Abstract: A Universal Serial Bus (USB) converter circuit includes: a High Definition Multimedia Interface (HDMI) transceiver circuit, a signal converting circuit and a USB receptacle, wherein the HDMI transceiver circuit arranged to transmit/receive a HDMI signal, wherein the HDMI transceiver circuit includes at least a video signal and a plurality of processing signals; the signal converting circuit coupled to the HDMI transceiver circuit is arranged to execute a converting operation to processing a conversion between the plurality of processing signals and A USB signal; and the USB receptacle coupled to the signal converting circuit includes a USB signal pin and a set of video signal pin, wherein the USB signal is transmitted/received with an electronic device through the USB pin, and the video signal is transmitted/received with the electronic device through the set of video signal pin.