Anti-scatter X-ray grid device for medical diagnostic radiography
    1.
    发明授权
    Anti-scatter X-ray grid device for medical diagnostic radiography 失效
    用于医疗诊断射线照相术的抗散射X射线格栅装置

    公开(公告)号:US5581592A

    公开(公告)日:1996-12-03

    申请号:US402223

    申请日:1995-03-10

    IPC分类号: G21K1/02 G21K1/00

    CPC分类号: G21K1/025

    摘要: An anti-scatter x-ray grid for medical diagnostic radiography includes a substrate having channels therein of material that is substantially non-absorbent of x-radiation and absorbing material in the channels including material that is substantially absorbent of x-radiation. The substrate preferably comprises material capable of remaining stable at the melting temperature of the absorbing material.

    摘要翻译: 用于医学诊断放射线照相术的抗散射x射线栅格包括其中具有基本上不吸收x射线的材料的通道的衬底,并且在通道中吸收材料,包括基本上吸收x辐射的材料。 基材优选包括能够在吸收材料的熔融温度下保持稳定的材料。

    Method for fabricating an anti-scatter X-ray grid device for medical
diagnostic radiography
    2.
    发明授权
    Method for fabricating an anti-scatter X-ray grid device for medical diagnostic radiography 失效
    医用诊断射线照相的防散射X射线栅格装置的制造方法

    公开(公告)号:US5557650A

    公开(公告)日:1996-09-17

    申请号:US402222

    申请日:1995-03-10

    IPC分类号: G21K1/02 G21K1/00

    CPC分类号: G21K1/025

    摘要: A method for fabricating an anti-scatter x-ray grid for medical diagnostic radiography includes providing a substrate having channels therein and material that is substantially non-absorbent of x-radiation; and filling the channels with absorbing material that is substantially absorbent of x-radiation. In one embodiment, the step of providing a substrate having channels therein comprises sawing a plastic substrate with a thin circular blade and the step of filling the channels with absorbing material comprises melting the absorbing material and flowing the melted absorbing material into the channels.

    摘要翻译: 用于医疗诊断放射线照相术的用于制造抗散射x射线栅格的方法包括提供其中具有通道的基底和基本上不吸收x射线的材料; 以及用基本吸收x辐射的吸收材料填充通道。 在一个实施例中,提供其中具有通道的基板的步骤包括用薄的圆形刀片锯切塑料基板,并且用吸收材料填充通道的步骤包括熔化吸收材料并使熔融的吸收材料流入通道。

    Polymer surfaces for subsequent plating thereon and improved
metal-plated plastic articles made therefrom
    6.
    发明授权
    Polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom 失效
    用于随后镀覆的聚合物表面和由其制成的改进的金属镀塑料制品

    公开(公告)号:US5132191A

    公开(公告)日:1992-07-21

    申请号:US603648

    申请日:1990-10-26

    摘要: Method of modifying an aromatic polymer surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. Polymer molecules disposed on the surface of the aromatic polymer such as polycarbonate, are nitrated by a contact with a nitrating solution such as a mixture of nitric and sulfuric acid and then ammonolytically cleaved by a contact with an ammonolytic solution such as ammonium hydroxide. The ammonolyzed surface is thus chemically modified to become hydrophilic. The chemically modified surface is electrolessly plated with a primary metal layer. A secondary metal layer is then electrolessly or electrolytically applied on top of the primary metal layer until a metal layer of a desired thickness is attained.The present invention further discloses articles such as an EMI shielded enclosure or a printed circuit board having metal layers as an EMI shield or a conductive metal trace pattern respectively.

    摘要翻译: 改进芳族聚合物表面以改善其上的金属层和由其制备的制品的粘附性的方法。 通过与诸如硝酸和硫酸的混合物的硝化溶液的接触而将设置在芳族聚合物表面上的聚合物分子例如聚碳酸酯进行硝化,然后通过与氨解溶液如氢氧化铵的接触进行氨解裂解。 因此,氨解表面被化学改性成亲水性。 化学改性的表面被无电镀的初级金属层。 然后在第一金属层的顶部上无电或电解施加二次金属层,直到达到所需厚度的金属层。 本发明还公开了诸如EMI屏蔽外壳或分别具有作为EMI屏蔽或导电金属迹线图案的金属层的印刷电路板的制品。

    Electroless nickel plating composition and method
    8.
    发明授权
    Electroless nickel plating composition and method 失效
    化学镀镍组合物及方法

    公开(公告)号:US4695489A

    公开(公告)日:1987-09-22

    申请号:US890050

    申请日:1986-07-28

    IPC分类号: C23C18/34 H05K1/09 H05K3/24

    CPC分类号: C23C18/34 H05K1/092 H05K3/245

    摘要: A method of applying nickel directly to a non-activated tungsten surface is disclosed, in which the tungsten surface is immersed in an aqueous electroless nickel plating bath containing a water-soluble nickel salt; ethylenediaminetetraacetic acid; hydrazine; and monoethanolamine for a period of time sufficient to deposit a layer of nickel on the tungsten surface.

    摘要翻译: 公开了一种将镍直接施加到非活化钨表面的方法,其中将钨表面浸入含有水溶性镍盐的含水无电镀镍浴中; 乙二胺四乙酸; 肼; 和单乙醇胺持续足以在钨表面上沉积镍层的时间。