公开(公告)号：US20150102421A1

公开(公告)日：2015-04-16

申请号：US14579898

申请日：2014-12-22

Applicant: Renesas Electronics Corporation

Inventor： Masao Morimoto ,  Noriaki Maeda ,  Yasuhisa Shimazaki

IPC: H01L27/11 ,  G06F17/50

CPC classification number: H01L27/1116 ,  G06F17/5072 ,  G11C11/412 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/0928 ,  H01L27/1104

Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.

Abstract translation: 一种具有SRAM的半导体器件，包括：第一晶体管和第五晶体管设置在其中的单片第一有源区; 与第一有源区分离的第二有源区，其中设置第二晶体管; 其中设置第三晶体管和第六晶体管的单片第三有源区; 以及与第三有源区分离的第四有源区，其中设置第四晶体管。 每个驱动晶体管分为第一晶体管和第二晶体管（或第三晶体管和第四晶体管），并且这些驱动晶体管设置在不同的有源区域上。

公开(公告)号：US10566047B2

公开(公告)日：2020-02-18

申请号：US16250275

申请日：2019-01-17

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kiyotada Funane ,  Ken Shibata ,  Yasuhisa Shimazaki

IPC: G11C5/02 ,  G11C11/417 ,  G11C7/10 ,  G11C8/16 ,  G11C11/412 ,  G11C11/413 ,  H01L27/02 ,  H01L27/11 ,  G11C5/06

Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.

公开(公告)号：US09734893B2

公开(公告)日：2017-08-15

申请号：US15050074

申请日：2016-02-22

Applicant: Renesas Electronics Corporation

Inventor： Shigenobu Komatsu ,  Masanao Yamaoka ,  Noriaki Maeda ,  Masao Morimoto ,  Yasuhisa Shimazaki ,  Yasuyuki Okuma ,  Toshiaki Sano

IPC: G11C11/41 ,  G11C11/417 ,  G11C5/06 ,  G11C5/14 ,  G11C11/413 ,  H01L27/092 ,  H01L27/11

CPC classification number: G11C11/417 ,  G11C5/06 ,  G11C5/14 ,  G11C11/413 ,  H01L27/092 ,  H01L27/1104

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

公开(公告)号：US09368194B2

公开(公告)日：2016-06-14

申请号：US14692566

申请日：2015-04-21

Applicant: Renesas Electronics Corporation

Inventor： Shigenobu Komatsu ,  Masanao Yamaoka ,  Noriaki Maeda ,  Masao Morimoto ,  Yasuhisa Shimazaki ,  Yasuyuki Okuma ,  Toshiaki Sano

IPC: G11C11/413 ,  G11C11/417 ,  G11C5/06 ,  G11C5/14 ,  H01L27/092 ,  H01L27/11

CPC classification number: G11C11/417 ,  G11C5/06 ,  G11C5/14 ,  G11C11/413 ,  H01L27/092 ,  H01L27/1104

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract translation: 提供了可以对备用时的保留数据量的变化进行响应的半导体集成电路。 半导体集成电路包括逻辑电路（逻辑）和多个SRAM模块。 多个SRAM模块独立于逻辑电路进行功率控制，并且在多个SRAM模块之间执行独立的功率控制。 具体地，每个SRAM模块的电位控制电路的一个端子和另一个端子分别耦合到单元阵列和本地电力线。 一个SRAM模块的本地电源线和另一个SRAM模块的本地电源线共享一个共享的本地电源线。 一个SRAM模块的电源开关和另一个SRAM模块的电源开关共同耦合到共享的本地电源线。

公开(公告)号：US10304526B2

公开(公告)日：2019-05-28

申请号：US16059255

申请日：2018-08-09

Applicant: Renesas Electronics Corporation

Inventor： Shigenobu Komatsu ,  Masanao Yamaoka ,  Noriaki Maeda ,  Masao Morimoto ,  Yasuhisa Shimazaki ,  Yasuyuki Okuma ,  Toshiaki Sano

IPC: G11C5/14 ,  G11C11/417 ,  G11C5/06 ,  G11C11/413 ,  H01L27/092 ,  H01L27/11

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

公开(公告)号：US10079055B2

公开(公告)日：2018-09-18

申请号：US15648702

申请日：2017-07-13

Applicant: Renesas Electronics Corporation

Inventor： Shigenobu Komatsu ,  Masanao Yamaoka ,  Noriaki Maeda ,  Masao Morimoto ,  Yasuhisa Shimazaki ,  Yasuyuki Okuma ,  Toshiaki Sano

IPC: G11C5/14 ,  G11C11/417 ,  H01L27/11 ,  G11C5/06 ,  G11C11/413 ,  H01L27/092

CPC classification number: G11C11/417 ,  G11C5/06 ,  G11C5/14 ,  G11C11/413 ,  H01L27/092 ,  H01L27/1104

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

公开(公告)号：US09672872B2

公开(公告)日：2017-06-06

申请号：US15190263

申请日：2016-06-23

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kiyotada Funane ,  Ken Shibata ,  Yasuhisa Shimazaki

IPC: G11C5/02 ,  G11C5/06 ,  G11C7/10 ,  G11C8/16 ,  G11C11/412 ,  G11C11/413 ,  H01L27/02 ,  H01L27/11

CPC classification number: G11C11/417 ,  G11C5/02 ,  G11C5/06 ,  G11C7/1075 ,  G11C8/16 ,  G11C11/412 ,  G11C11/413 ,  H01L27/0207 ,  H01L27/11 ,  H01L27/1104

Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.

公开(公告)号：US09196622B2

公开(公告)日：2015-11-24

申请号：US14579898

申请日：2014-12-22

Applicant: Renesas Electronics Corporation

Inventor： Masao Morimoto ,  Noriaki Maeda ,  Yasuhisa Shimazaki

IPC: H01L27/11 ,  H01L27/02 ,  G11C11/412 ,  G06F17/50

CPC classification number: H01L27/1116 ,  G06F17/5072 ,  G11C11/412 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/0928 ,  H01L27/1104

Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.

Abstract translation: 一种具有SRAM的半导体器件，包括：第一晶体管和第五晶体管设置在其中的单片第一有源区; 与第一有源区分离的第二有源区，其中设置第二晶体管; 其中设置第三晶体管和第六晶体管的单片第三有源区; 以及与第三有源区分离的第四有源区，其中设置第四晶体管。 每个驱动晶体管分为第一晶体管和第二晶体管（或第三晶体管和第四晶体管），并且这些驱动晶体管设置在不同的有源区域上。

公开(公告)号：US09123435B2

公开(公告)日：2015-09-01

申请号：US13874834

申请日：2013-05-01

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Noriaki Maeda ,  Yoshihiro Shinozaki ,  Masanao Yamaoka ,  Yasuhisa Shimazaki ,  Masanori Isoda ,  Koji Nii

IPC: G11C11/00 ,  G11C11/412 ,  G11C5/06 ,  G11C5/14 ,  G11C11/419 ,  H01L27/11

CPC classification number: G11C11/412 ,  G11C5/063 ,  G11C5/14 ,  G11C11/419 ,  H01L27/11 ,  H01L27/1104

Abstract: The invention provides a semiconductor integrated circuit device provided with an SRAM that satisfies the requirements for both the SNM and the write margin with a low supply voltage. The semiconductor integrated circuit device include: multiple static memory cells provided in correspondence with multiple word lines and multiple complimentary bit lines; multiple memory cell power supply lines that each supply an operational voltage to each of the multiple memory cells connected to the multiple complimentary bit lines each; multiple power supply circuits comprised of resistive units that each supply a power supply voltage to the memory cell power supply lines each; and a pre-charge circuit that supplies a pre-charge voltage corresponding to the power supply voltage to the complimentary bit lines, wherein the memory cell power supply lines are made to have coupling capacitances to thereby transmit a write signal on corresponding complimentary bit lines.

公开(公告)号：US10224095B2

公开(公告)日：2019-03-05

申请号：US15795502

申请日：2017-10-27

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kiyotada Funane ,  Ken Shibata ,  Yasuhisa Shimazaki

IPC: G11C5/02 ,  G11C11/417 ,  G11C7/10 ,  G11C8/16 ,  G11C11/412 ,  G11C11/413 ,  H01L27/02 ,  H01L27/11 ,  G11C5/06

Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.