公开(公告)号：US20240224413A1

公开(公告)日：2024-07-04

申请号：US18555866

申请日：2021-11-16

Applicant: Resonac Corporation

Inventor： Kosuke URASHIMA ,  Motoki YONEKURA ,  Motohiro ARIFUKU ,  Tomohiko KOTAKE ,  Etsuo MIZUSHIMA

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/28

CPC classification number: H05K1/0237 ,  H05K3/06 ,  H05K3/28 ,  H05K2201/0753 ,  H05K2201/083 ,  H05K2201/10287 ,  H05K2203/063

Abstract: A wiring substrate includes a substrate, conductor wiring provided on the substrate, and an insulator positioned on at least a part of the periphery of the conductor wiring, in which the insulator contains a magnetic material. The wiring substrate ensures little loss in transmission even in high-frequency band.

公开(公告)号：US20240383035A1

公开(公告)日：2024-11-21

申请号：US18770661

申请日：2024-07-12

Applicant: RESONAC CORPORATION

Inventor： Yoshinori EJIRI ,  Shinichirou SUKATA ,  Masaya TOBA ,  Hideo NAKAKO ,  Yuki KAWANA ,  Kosuke URASHIMA ,  Motoki YONEKURA ,  Takaaki NOHDOH ,  Yoshiaki KURIHARA ,  Hiroshi MASUDA ,  Keita SONE

IPC: B22F7/08 ,  B22F1/052 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12 ,  H05K3/34

Abstract: One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

公开(公告)号：US20240209168A1

公开(公告)日：2024-06-27

申请号：US18554334

申请日：2021-04-19

Applicant: RESONAC CORPORATION

Inventor： Kazumasa TAKEUCHI ,  Teruo ITOH ,  Arisa TAIRA ,  Kosuke URASHIMA ,  Hideo MAEDA

IPC: C08J5/24 ,  C08K3/28 ,  C08K3/38 ,  C08L63/00

CPC classification number: C08J5/249 ,  C08K3/28 ,  C08K3/38 ,  C08L63/00 ,  C08K2201/01

Abstract: A monomer composition is a monomer composition for impregnating voids in a porous compact. The compact contains a metal powder and a thermosetting resin composition. The monomer composition contains at least one compound selected from the group consisting of an acrylate having a dicyclopentane structure, an acrylate having a dicyclopentene structure, a methacrylate having a dicyclopentane structure, and a methacrylate having a dicyclopentene structure.